JP6102319B2 - プリプレグおよびプリプレグの製造方法 - Google Patents

プリプレグおよびプリプレグの製造方法 Download PDF

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Publication number
JP6102319B2
JP6102319B2 JP2013029775A JP2013029775A JP6102319B2 JP 6102319 B2 JP6102319 B2 JP 6102319B2 JP 2013029775 A JP2013029775 A JP 2013029775A JP 2013029775 A JP2013029775 A JP 2013029775A JP 6102319 B2 JP6102319 B2 JP 6102319B2
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Prior art keywords
resin
resin layer
prepreg
fiber base
base material
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Japanese (ja)
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JP2013209626A (ja
Inventor
猛 八月朔日
猛 八月朔日
恭史 瀧本
恭史 瀧本
晴行 秦野
晴行 秦野
亘平 穴田
亘平 穴田
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
    • B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
    • B29B15/10—Coating or impregnating independently of the moulding or shaping step
    • B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
    • B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/22—Thermoplastic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)
JP2013029775A 2012-02-28 2013-02-19 プリプレグおよびプリプレグの製造方法 Active JP6102319B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013029775A JP6102319B2 (ja) 2012-02-28 2013-02-19 プリプレグおよびプリプレグの製造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012041886 2012-02-28
JP2012041917 2012-02-28
JP2012041886 2012-02-28
JP2012041917 2012-02-28
JP2013029775A JP6102319B2 (ja) 2012-02-28 2013-02-19 プリプレグおよびプリプレグの製造方法

Publications (2)

Publication Number Publication Date
JP2013209626A JP2013209626A (ja) 2013-10-10
JP6102319B2 true JP6102319B2 (ja) 2017-03-29

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Country Status (4)

Country Link
JP (1) JP6102319B2 (ko)
KR (1) KR20140127803A (ko)
TW (1) TWI575003B (ko)
WO (1) WO2013128841A1 (ko)

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US9631279B2 (en) * 2014-05-19 2017-04-25 Sierra Circuits, Inc. Methods for forming embedded traces
US9380700B2 (en) * 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
JP2016009763A (ja) * 2014-06-24 2016-01-18 イビデン株式会社 多層プリント配線板およびその製造方法
KR102163043B1 (ko) * 2014-09-05 2020-10-08 삼성전기주식회사 프리프레그 및 그 제조 방법
KR102306718B1 (ko) * 2014-11-26 2021-09-30 삼성전기주식회사 프리프레그
EP3275923B1 (en) * 2015-03-26 2021-05-26 NIPPON STEEL Chemical & Material Co., Ltd. Fiber-reinforced plastic molding material, method for producing same, and molded article
ES2846002T3 (es) * 2015-06-16 2021-07-28 Gh Craft Ltd Dispositivo de moldeo y método de producción
JP2017081136A (ja) * 2015-10-30 2017-05-18 住友ベークライト株式会社 繊維強化プラスチック成形品
CN108473312B (zh) * 2015-12-28 2022-02-15 日立造船株式会社 碳纳米管复合材料以及碳纳米管复合材料的制造方法
JP6711245B2 (ja) * 2016-11-21 2020-06-17 株式会社デンソー プリント基板の製造方法および電子装置の製造方法
JP6960595B2 (ja) * 2017-01-13 2021-11-05 パナソニックＩｐマネジメント株式会社 厚導体内蔵プリント配線板及びその製造方法
JP7063327B2 (ja) * 2017-03-28 2022-05-09 昭和電工マテリアルズ株式会社 Ｆｒｐ前駆体の製造方法及びｆｒｐの製造方法
JP6777017B2 (ja) * 2017-06-08 2020-10-28 マツダ株式会社 繊維強化樹脂成形品の成形用材料及び成形方法
HUE056827T2 (hu) * 2017-07-31 2022-03-28 Basf Se Berendezés meghatározott száltérfogat-tartalommal rendelkezõ szálak impregnálására
US20220227024A1 (en) * 2019-05-23 2022-07-21 Toray Industries, Inc. Method for producing fiber-reinforced plastic substrate, and fiber-reinforced plastic substrate and integrated molding thereof
WO2020235490A1 (ja) * 2019-05-23 2020-11-26 東レ株式会社 繊維強化樹脂基材、一体化成形品および繊維強化樹脂基材の製造方法
US20220388289A1 (en) * 2019-12-11 2022-12-08 Toray Industries, Inc. Prepreg, laminate, and integrated product
EP4074765A4 (en) * 2019-12-11 2023-12-20 Toray Industries, Inc. PREPREG, LAMINATE AND INTEGRATED MOLDING
JP7467906B2 (ja) * 2019-12-23 2024-04-16 東レ株式会社 繊維強化樹脂成形体および複合成形体
JPWO2021201252A1 (ko) * 2020-04-03 2021-10-07
JP2022049935A (ja) * 2020-09-17 2022-03-30 三菱重工航空エンジン株式会社 プリプレグの製造方法及び複合材の成形方法
WO2023218969A1 (ja) * 2022-05-10 2023-11-16 株式会社レゾナック Ｆｒｐ前駆体の製造方法及びｆｒｐの製造方法

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JP2003313324A (ja) * 2002-04-24 2003-11-06 Mitsubishi Gas Chem Co Inc 基材入りｂステージ樹脂組成物シートの製造方法
JP2003342399A (ja) * 2002-05-28 2003-12-03 Matsushita Electric Works Ltd プリプレグ及びこのプリプレグを用いてなる内層回路入り積層板
JP2005105035A (ja) * 2003-09-29 2005-04-21 Asahi Schwebel Co Ltd プリプレグとその製造方法、及び積層板
JP4903989B2 (ja) * 2004-07-27 2012-03-28 株式会社アドマテックス プリント基板用組成物
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JP5243715B2 (ja) * 2005-12-01 2013-07-24 住友ベークライト株式会社 プリプレグ、基板および半導体装置
CN101321813B (zh) * 2005-12-01 2012-07-04 住友电木株式会社 预成型料、预成型料的制造方法、基板及半导体装置
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JP5370149B2 (ja) * 2007-03-30 2013-12-18 住友ベークライト株式会社 キャリア付きプリプレグおよびその製造方法、多層プリント配線板、ならびに半導体装置
CN102197088A (zh) * 2008-10-29 2011-09-21 住友电木株式会社 树脂组合物，树脂片材，半固化片，层叠板，多层印刷布线板及半导体装置
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP5547678B2 (ja) * 2011-03-14 2014-07-16 住友ベークライト株式会社 積層板の製造方法
WO2013100024A1 (ja) * 2011-12-28 2013-07-04 日本ゼオン株式会社 プリプレグ、積層体及びプリプレグの製造方法

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KR20140127803A (ko) 2014-11-04
JP2013209626A (ja) 2013-10-10
TWI575003B (zh) 2017-03-21
WO2013128841A1 (ja) 2013-09-06
TW201343740A (zh) 2013-11-01

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