JP6099891B2 - ドライエッチング方法 - Google Patents

ドライエッチング方法 Download PDF

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Publication number
JP6099891B2
JP6099891B2 JP2012149606A JP2012149606A JP6099891B2 JP 6099891 B2 JP6099891 B2 JP 6099891B2 JP 2012149606 A JP2012149606 A JP 2012149606A JP 2012149606 A JP2012149606 A JP 2012149606A JP 6099891 B2 JP6099891 B2 JP 6099891B2
Authority
JP
Japan
Prior art keywords
etching
stage
film
adhesion improving
reactive ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012149606A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014012341A5 (enExample
JP2014012341A (ja
Inventor
弘幸 阿保
弘幸 阿保
坂井　稔康
稔康 坂井
阿部　和也
和也 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012149606A priority Critical patent/JP6099891B2/ja
Priority to US13/926,636 priority patent/US9067460B2/en
Publication of JP2014012341A publication Critical patent/JP2014012341A/ja
Publication of JP2014012341A5 publication Critical patent/JP2014012341A5/ja
Application granted granted Critical
Publication of JP6099891B2 publication Critical patent/JP6099891B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/227—Removing surface-material, e.g. by engraving, by etching by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2012149606A 2012-07-03 2012-07-03 ドライエッチング方法 Active JP6099891B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012149606A JP6099891B2 (ja) 2012-07-03 2012-07-03 ドライエッチング方法
US13/926,636 US9067460B2 (en) 2012-07-03 2013-06-25 Dry etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012149606A JP6099891B2 (ja) 2012-07-03 2012-07-03 ドライエッチング方法

Publications (3)

Publication Number Publication Date
JP2014012341A JP2014012341A (ja) 2014-01-23
JP2014012341A5 JP2014012341A5 (enExample) 2015-07-30
JP6099891B2 true JP6099891B2 (ja) 2017-03-22

Family

ID=49877719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012149606A Active JP6099891B2 (ja) 2012-07-03 2012-07-03 ドライエッチング方法

Country Status (2)

Country Link
US (1) US9067460B2 (enExample)
JP (1) JP6099891B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6128972B2 (ja) 2013-06-06 2017-05-17 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
CN106297831B (zh) * 2015-05-21 2020-04-21 新科实业有限公司 在衬底形成图案的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5451837A (en) 1977-09-30 1979-04-24 Ricoh Co Ltd Ink jet head device
JP2625072B2 (ja) * 1992-09-08 1997-06-25 アプライド マテリアルズ インコーポレイテッド 電磁ｒｆ結合を用いたプラズマ反応装置及びその方法
JP3143307B2 (ja) 1993-02-03 2001-03-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US5960306A (en) * 1995-12-15 1999-09-28 Motorola, Inc. Process for forming a semiconductor device
JP4105261B2 (ja) * 1997-08-20 2008-06-25 株式会社半導体エネルギー研究所 電子機器の作製方法
JP3957920B2 (ja) * 1998-06-11 2007-08-15 キヤノン株式会社 インクジェットヘッドの製造方法
US6333560B1 (en) * 1999-01-14 2001-12-25 International Business Machines Corporation Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies
US20020039704A1 (en) * 2000-08-18 2002-04-04 Din Kuen Sane Lithographic and etching process using a hardened photoresist layer
JP2002347254A (ja) 2001-05-22 2002-12-04 Canon Inc インクジエット記録ヘッドの作成方法
US6806203B2 (en) * 2002-03-18 2004-10-19 Applied Materials Inc. Method of forming a dual damascene structure using an amorphous silicon hard mask
US7132369B2 (en) * 2002-12-31 2006-11-07 Applied Materials, Inc. Method of forming a low-K dual damascene interconnect structure
JP2006334889A (ja) * 2005-06-01 2006-12-14 Canon Inc インクジェットヘッド用基板の製造方法、インクジェットヘッド用基板およびインクジェットヘッド
US7637013B2 (en) * 2005-08-23 2009-12-29 Canon Kabushiki Kaisha Method of manufacturing ink jet recording head
JP4563927B2 (ja) * 2005-12-02 2010-10-20 信越化学工業株式会社 基板及びその製造方法、並びにそれを用いたパターン形成方法
JP5655443B2 (ja) * 2010-09-06 2015-01-21 住友電気工業株式会社 無機化合物膜のエッチング方法および半導体光素子の製造方法

Also Published As

Publication number Publication date
US9067460B2 (en) 2015-06-30
US20140008322A1 (en) 2014-01-09
JP2014012341A (ja) 2014-01-23

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