JP2014012341A5 - - Google Patents

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Publication number
JP2014012341A5
JP2014012341A5 JP2012149606A JP2012149606A JP2014012341A5 JP 2014012341 A5 JP2014012341 A5 JP 2014012341A5 JP 2012149606 A JP2012149606 A JP 2012149606A JP 2012149606 A JP2012149606 A JP 2012149606A JP 2014012341 A5 JP2014012341 A5 JP 2014012341A5
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JP
Japan
Prior art keywords
etching
stage
dry etching
reactive ion
etching method
Prior art date
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Application number
JP2012149606A
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English (en)
Japanese (ja)
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JP6099891B2 (ja
JP2014012341A (ja
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Priority to JP2012149606A priority Critical patent/JP6099891B2/ja
Priority claimed from JP2012149606A external-priority patent/JP6099891B2/ja
Priority to US13/926,636 priority patent/US9067460B2/en
Publication of JP2014012341A publication Critical patent/JP2014012341A/ja
Publication of JP2014012341A5 publication Critical patent/JP2014012341A5/ja
Application granted granted Critical
Publication of JP6099891B2 publication Critical patent/JP6099891B2/ja
Active legal-status Critical Current
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JP2012149606A 2012-07-03 2012-07-03 ドライエッチング方法 Active JP6099891B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012149606A JP6099891B2 (ja) 2012-07-03 2012-07-03 ドライエッチング方法
US13/926,636 US9067460B2 (en) 2012-07-03 2013-06-25 Dry etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012149606A JP6099891B2 (ja) 2012-07-03 2012-07-03 ドライエッチング方法

Publications (3)

Publication Number Publication Date
JP2014012341A JP2014012341A (ja) 2014-01-23
JP2014012341A5 true JP2014012341A5 (enExample) 2015-07-30
JP6099891B2 JP6099891B2 (ja) 2017-03-22

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ID=49877719

Family Applications (1)

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JP2012149606A Active JP6099891B2 (ja) 2012-07-03 2012-07-03 ドライエッチング方法

Country Status (2)

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US (1) US9067460B2 (enExample)
JP (1) JP6099891B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6128972B2 (ja) 2013-06-06 2017-05-17 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
CN106297831B (zh) * 2015-05-21 2020-04-21 新科实业有限公司 在衬底形成图案的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5451837A (en) 1977-09-30 1979-04-24 Ricoh Co Ltd Ink jet head device
JP2625072B2 (ja) * 1992-09-08 1997-06-25 アプライド マテリアルズ インコーポレイテッド 電磁ｒｆ結合を用いたプラズマ反応装置及びその方法
JP3143307B2 (ja) 1993-02-03 2001-03-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US5960306A (en) * 1995-12-15 1999-09-28 Motorola, Inc. Process for forming a semiconductor device
JP4105261B2 (ja) * 1997-08-20 2008-06-25 株式会社半導体エネルギー研究所 電子機器の作製方法
JP3957920B2 (ja) * 1998-06-11 2007-08-15 キヤノン株式会社 インクジェットヘッドの製造方法
US6333560B1 (en) * 1999-01-14 2001-12-25 International Business Machines Corporation Process and structure for an interlock and high performance multilevel structures for chip interconnects and packaging technologies
US20020039704A1 (en) * 2000-08-18 2002-04-04 Din Kuen Sane Lithographic and etching process using a hardened photoresist layer
JP2002347254A (ja) 2001-05-22 2002-12-04 Canon Inc インクジエット記録ヘッドの作成方法
US6806203B2 (en) * 2002-03-18 2004-10-19 Applied Materials Inc. Method of forming a dual damascene structure using an amorphous silicon hard mask
US7132369B2 (en) * 2002-12-31 2006-11-07 Applied Materials, Inc. Method of forming a low-K dual damascene interconnect structure
JP2006334889A (ja) * 2005-06-01 2006-12-14 Canon Inc インクジェットヘッド用基板の製造方法、インクジェットヘッド用基板およびインクジェットヘッド
US7637013B2 (en) * 2005-08-23 2009-12-29 Canon Kabushiki Kaisha Method of manufacturing ink jet recording head
JP4563927B2 (ja) * 2005-12-02 2010-10-20 信越化学工業株式会社 基板及びその製造方法、並びにそれを用いたパターン形成方法
JP5655443B2 (ja) * 2010-09-06 2015-01-21 住友電気工業株式会社 無機化合物膜のエッチング方法および半導体光素子の製造方法

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