JP2014019102A5 - - Google Patents

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Publication number
JP2014019102A5
JP2014019102A5 JP2012161640A JP2012161640A JP2014019102A5 JP 2014019102 A5 JP2014019102 A5 JP 2014019102A5 JP 2012161640 A JP2012161640 A JP 2012161640A JP 2012161640 A JP2012161640 A JP 2012161640A JP 2014019102 A5 JP2014019102 A5 JP 2014019102A5
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JP
Japan
Prior art keywords
silicon wafer
manufacturing
substrate
discharge head
liquid discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012161640A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014019102A (ja
JP5943755B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012161640A priority Critical patent/JP5943755B2/ja
Priority claimed from JP2012161640A external-priority patent/JP5943755B2/ja
Priority to US13/945,617 priority patent/US9472639B2/en
Publication of JP2014019102A publication Critical patent/JP2014019102A/ja
Publication of JP2014019102A5 publication Critical patent/JP2014019102A5/ja
Application granted granted Critical
Publication of JP5943755B2 publication Critical patent/JP5943755B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012161640A 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法 Expired - Fee Related JP5943755B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012161640A JP5943755B2 (ja) 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法
US13/945,617 US9472639B2 (en) 2012-07-20 2013-07-18 Forming a liquid ejection head with through holes and a depression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161640A JP5943755B2 (ja) 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法

Publications (3)

Publication Number Publication Date
JP2014019102A JP2014019102A (ja) 2014-02-03
JP2014019102A5 true JP2014019102A5 (enExample) 2015-08-20
JP5943755B2 JP5943755B2 (ja) 2016-07-05

Family

ID=49946877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012161640A Expired - Fee Related JP5943755B2 (ja) 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法

Country Status (2)

Country Link
US (1) US9472639B2 (enExample)
JP (1) JP5943755B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873833B2 (en) * 2014-12-29 2018-01-23 Versum Materials Us, Llc Etchant solutions and method of use thereof
JP2016221688A (ja) * 2015-05-27 2016-12-28 キヤノン株式会社 液体吐出ヘッド及びシリコン基板の加工方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002029057A (ja) * 2000-07-18 2002-01-29 Casio Comput Co Ltd インクジェットプリントヘッド
CN1289298C (zh) * 2001-09-06 2006-12-13 株式会社理光 液滴喷射头及其制造方法、微型器件、喷墨头、墨盒以及喷墨打印设备
JP2003266394A (ja) * 2002-03-14 2003-09-24 Seiko Epson Corp シリコンデバイスの製造方法及びインクジェット式記録ヘッドの製造方法並びにシリコンウェハ
US7347532B2 (en) * 2004-08-05 2008-03-25 Fujifilm Dimatix, Inc. Print head nozzle formation
KR20060081110A (ko) * 2005-01-07 2006-07-12 삼성전자주식회사 잉크젯 프린트헤드의 대칭형 노즐 형성 방법
JP4438710B2 (ja) * 2005-07-20 2010-03-24 セイコーエプソン株式会社 マスク、マスクチップ、マスクの製造方法及びマスクチップの製造方法
JP5028112B2 (ja) * 2006-03-07 2012-09-19 キヤノン株式会社 インクジェットヘッド用基板の製造方法およびインクジェットヘッド
JP4306717B2 (ja) * 2006-11-09 2009-08-05 セイコーエプソン株式会社 シリコンデバイスの製造方法及び液体噴射ヘッドの製造方法
US7648891B2 (en) * 2006-12-22 2010-01-19 International Business Machines Corporation Semiconductor chip shape alteration
US8629532B2 (en) * 2007-05-08 2014-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer with assisting dicing structure and dicing method thereof
US8173030B2 (en) * 2008-09-30 2012-05-08 Eastman Kodak Company Liquid drop ejector having self-aligned hole
JP5728795B2 (ja) * 2009-04-01 2015-06-03 セイコーエプソン株式会社 ノズルプレートの製造方法、及び、液滴吐出ヘッドの製造方法
JP5455461B2 (ja) * 2009-06-17 2014-03-26 キヤノン株式会社 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法
JP2011083787A (ja) 2009-10-14 2011-04-28 Seiko Epson Corp 基板の加工方法及び基板
US8765498B2 (en) * 2010-05-19 2014-07-01 Canon Kabushiki Kaisha Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly
WO2011154770A1 (en) * 2010-06-07 2011-12-15 Telecom Italia S.P.A. Method of manufacturing an ink-jet printhead

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