JP5943755B2 - 液体吐出ヘッドの基板の製造方法 - Google Patents

液体吐出ヘッドの基板の製造方法 Download PDF

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Publication number
JP5943755B2
JP5943755B2 JP2012161640A JP2012161640A JP5943755B2 JP 5943755 B2 JP5943755 B2 JP 5943755B2 JP 2012161640 A JP2012161640 A JP 2012161640A JP 2012161640 A JP2012161640 A JP 2012161640A JP 5943755 B2 JP5943755 B2 JP 5943755B2
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JP
Japan
Prior art keywords
silicon wafer
liquid discharge
discharge head
substrate
manufacturing
Prior art date
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Expired - Fee Related
Application number
JP2012161640A
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English (en)
Japanese (ja)
Other versions
JP2014019102A5 (enExample
JP2014019102A (ja
Inventor
弘幸 阿保
弘幸 阿保
太地 米本
太地 米本
小山　修司
修司 小山
正紀 大角
正紀 大角
松本　圭司
圭司 松本
誠一郎 柳沼
誠一郎 柳沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012161640A priority Critical patent/JP5943755B2/ja
Priority to US13/945,617 priority patent/US9472639B2/en
Publication of JP2014019102A publication Critical patent/JP2014019102A/ja
Publication of JP2014019102A5 publication Critical patent/JP2014019102A5/ja
Application granted granted Critical
Publication of JP5943755B2 publication Critical patent/JP5943755B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Weting (AREA)
JP2012161640A 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法 Expired - Fee Related JP5943755B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012161640A JP5943755B2 (ja) 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法
US13/945,617 US9472639B2 (en) 2012-07-20 2013-07-18 Forming a liquid ejection head with through holes and a depression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161640A JP5943755B2 (ja) 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法

Publications (3)

Publication Number Publication Date
JP2014019102A JP2014019102A (ja) 2014-02-03
JP2014019102A5 JP2014019102A5 (enExample) 2015-08-20
JP5943755B2 true JP5943755B2 (ja) 2016-07-05

Family

ID=49946877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012161640A Expired - Fee Related JP5943755B2 (ja) 2012-07-20 2012-07-20 液体吐出ヘッドの基板の製造方法

Country Status (2)

Country Link
US (1) US9472639B2 (enExample)
JP (1) JP5943755B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9873833B2 (en) * 2014-12-29 2018-01-23 Versum Materials Us, Llc Etchant solutions and method of use thereof
JP2016221688A (ja) * 2015-05-27 2016-12-28 キヤノン株式会社 液体吐出ヘッド及びシリコン基板の加工方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002029057A (ja) * 2000-07-18 2002-01-29 Casio Comput Co Ltd インクジェットプリントヘッド
CN1289298C (zh) * 2001-09-06 2006-12-13 株式会社理光 液滴喷射头及其制造方法、微型器件、喷墨头、墨盒以及喷墨打印设备
JP2003266394A (ja) * 2002-03-14 2003-09-24 Seiko Epson Corp シリコンデバイスの製造方法及びインクジェット式記録ヘッドの製造方法並びにシリコンウェハ
US7347532B2 (en) * 2004-08-05 2008-03-25 Fujifilm Dimatix, Inc. Print head nozzle formation
KR20060081110A (ko) * 2005-01-07 2006-07-12 삼성전자주식회사 잉크젯 프린트헤드의 대칭형 노즐 형성 방법
JP4438710B2 (ja) * 2005-07-20 2010-03-24 セイコーエプソン株式会社 マスク、マスクチップ、マスクの製造方法及びマスクチップの製造方法
JP5028112B2 (ja) * 2006-03-07 2012-09-19 キヤノン株式会社 インクジェットヘッド用基板の製造方法およびインクジェットヘッド
JP4306717B2 (ja) * 2006-11-09 2009-08-05 セイコーエプソン株式会社 シリコンデバイスの製造方法及び液体噴射ヘッドの製造方法
US7648891B2 (en) * 2006-12-22 2010-01-19 International Business Machines Corporation Semiconductor chip shape alteration
US8629532B2 (en) * 2007-05-08 2014-01-14 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer with assisting dicing structure and dicing method thereof
US8173030B2 (en) * 2008-09-30 2012-05-08 Eastman Kodak Company Liquid drop ejector having self-aligned hole
JP5728795B2 (ja) * 2009-04-01 2015-06-03 セイコーエプソン株式会社 ノズルプレートの製造方法、及び、液滴吐出ヘッドの製造方法
JP5455461B2 (ja) * 2009-06-17 2014-03-26 キヤノン株式会社 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法
JP2011083787A (ja) 2009-10-14 2011-04-28 Seiko Epson Corp 基板の加工方法及び基板
US8765498B2 (en) * 2010-05-19 2014-07-01 Canon Kabushiki Kaisha Method of manufacturing liquid discharge head substrate, method of manufacturing liquid discharge head, and method of manufacturing liquid discharge head assembly
WO2011154770A1 (en) * 2010-06-07 2011-12-15 Telecom Italia S.P.A. Method of manufacturing an ink-jet printhead

Also Published As

Publication number Publication date
US9472639B2 (en) 2016-10-18
US20140024148A1 (en) 2014-01-23
JP2014019102A (ja) 2014-02-03

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