JP2011000755A5 - - Google Patents

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Publication number
JP2011000755A5
JP2011000755A5 JP2009144152A JP2009144152A JP2011000755A5 JP 2011000755 A5 JP2011000755 A5 JP 2011000755A5 JP 2009144152 A JP2009144152 A JP 2009144152A JP 2009144152 A JP2009144152 A JP 2009144152A JP 2011000755 A5 JP2011000755 A5 JP 2011000755A5
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JP
Japan
Prior art keywords
silicon substrate
holes
processing
forming
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009144152A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011000755A (ja
JP5455461B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009144152A priority Critical patent/JP5455461B2/ja
Priority claimed from JP2009144152A external-priority patent/JP5455461B2/ja
Priority to US12/784,144 priority patent/US8287747B2/en
Publication of JP2011000755A publication Critical patent/JP2011000755A/ja
Publication of JP2011000755A5 publication Critical patent/JP2011000755A5/ja
Application granted granted Critical
Publication of JP5455461B2 publication Critical patent/JP5455461B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009144152A 2009-06-17 2009-06-17 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法 Expired - Fee Related JP5455461B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009144152A JP5455461B2 (ja) 2009-06-17 2009-06-17 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法
US12/784,144 US8287747B2 (en) 2009-06-17 2010-05-20 Method of processing silicon substrate and method of manufacturing substrate for liquid discharge head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009144152A JP5455461B2 (ja) 2009-06-17 2009-06-17 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法

Publications (3)

Publication Number Publication Date
JP2011000755A JP2011000755A (ja) 2011-01-06
JP2011000755A5 true JP2011000755A5 (enExample) 2012-07-26
JP5455461B2 JP5455461B2 (ja) 2014-03-26

Family

ID=43354715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009144152A Expired - Fee Related JP5455461B2 (ja) 2009-06-17 2009-06-17 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法

Country Status (2)

Country Link
US (1) US8287747B2 (enExample)
JP (1) JP5455461B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8771531B2 (en) * 2011-04-19 2014-07-08 Canon Kabushiki Kaisha Method of producing substrate for liquid ejection head
WO2013137902A1 (en) 2012-03-16 2013-09-19 Hewlett-Packard Development Company, L.P. Printhead with recessed slot ends
JP5943755B2 (ja) * 2012-07-20 2016-07-05 キヤノン株式会社 液体吐出ヘッドの基板の製造方法
BR112015019393B1 (pt) * 2013-02-13 2021-11-30 Hewlett-Packard Development Company, L.P. Dispositivo de ejeção de fluido
JP6188354B2 (ja) * 2013-03-06 2017-08-30 キヤノン株式会社 液体吐出ヘッドの製造方法
JP6395539B2 (ja) * 2014-09-24 2018-09-26 キヤノン株式会社 液体吐出ヘッド用基板の製造方法、及びシリコン基板の加工方法
KR102552275B1 (ko) * 2015-07-31 2023-07-07 삼성디스플레이 주식회사 마스크 제조방법
JP6736374B2 (ja) * 2016-06-21 2020-08-05 キヤノン株式会社 液体吐出ヘッド用半導体チップの製造方法
JP2018153978A (ja) 2017-03-16 2018-10-04 キヤノン株式会社 シリコン基板の加工方法および液体吐出ヘッドの製造方法
WO2025005206A1 (ja) * 2023-06-28 2025-01-02 三菱ケミカル株式会社 エッチング液、エッチング方法及び半導体デバイスの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065429A9 (en) * 2001-10-22 2009-03-12 Dickensheets David L Stiffened surface micromachined structures and process for fabricating the same
US6800930B2 (en) * 2002-07-31 2004-10-05 Micron Technology, Inc. Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies
US6648454B1 (en) * 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
JP4834426B2 (ja) * 2006-03-06 2011-12-14 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP4854336B2 (ja) 2006-03-07 2012-01-18 キヤノン株式会社 インクジェットヘッド用基板の製造方法
US7625776B2 (en) * 2006-06-02 2009-12-01 Micron Technology, Inc. Methods of fabricating intermediate semiconductor structures by selectively etching pockets of implanted silicon
JP5124999B2 (ja) * 2006-06-15 2013-01-23 富士電機株式会社 半導体装置およびその製造方法
US8197705B2 (en) * 2007-09-06 2012-06-12 Canon Kabushiki Kaisha Method of processing silicon substrate and method of manufacturing liquid discharge head
JP5031492B2 (ja) * 2007-09-06 2012-09-19 キヤノン株式会社 インクジェットヘッド基板の製造方法
JP5031493B2 (ja) * 2007-09-06 2012-09-19 キヤノン株式会社 インクジェットヘッド用基板の製造方法
JP2009061667A (ja) * 2007-09-06 2009-03-26 Canon Inc シリコン基板の加工方法、及び液体吐出ヘッドの製造方法
JP2009061664A (ja) * 2007-09-06 2009-03-26 Canon Inc インクジェットヘッド用基板の製造方法
US7998829B2 (en) * 2007-12-11 2011-08-16 Hvvi Semiconductors, Inc. Semiconductor structure and method of manufacture

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