JP2012153136A5 - - Google Patents
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- Publication number
- JP2012153136A5 JP2012153136A5 JP2012004366A JP2012004366A JP2012153136A5 JP 2012153136 A5 JP2012153136 A5 JP 2012153136A5 JP 2012004366 A JP2012004366 A JP 2012004366A JP 2012004366 A JP2012004366 A JP 2012004366A JP 2012153136 A5 JP2012153136 A5 JP 2012153136A5
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- piezoelectric elements
- openings
- patterned
- gap layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims 16
- 239000000463 material Substances 0.000 claims 16
- 239000012790 adhesive layer Substances 0.000 claims 11
- 238000000034 method Methods 0.000 claims 8
- 238000001020 plasma etching Methods 0.000 claims 6
- 238000007789 sealing Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 2
- 229910001882 dioxygen Inorganic materials 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 238000001802 infusion Methods 0.000 claims 2
- 238000000608 laser ablation Methods 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 claims 1
- 230000000873 masking effect Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/011,409 US8465659B2 (en) | 2011-01-21 | 2011-01-21 | Polymer layer removal on pzt arrays using a plasma etch |
| US13/011,409 | 2011-01-21 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012153136A JP2012153136A (ja) | 2012-08-16 |
| JP2012153136A5 true JP2012153136A5 (enExample) | 2015-02-26 |
| JP5778588B2 JP5778588B2 (ja) | 2015-09-16 |
Family
ID=46520098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012004366A Expired - Fee Related JP5778588B2 (ja) | 2011-01-21 | 2012-01-12 | Pzt配列におけるポリマー層のプラズマエッチングによる除去 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8465659B2 (enExample) |
| JP (1) | JP5778588B2 (enExample) |
| CN (1) | CN102602151B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8727508B2 (en) * | 2011-11-10 | 2014-05-20 | Xerox Corporation | Bonded silicon structure for high density print head |
| US9038269B2 (en) | 2013-04-02 | 2015-05-26 | Xerox Corporation | Printhead with nanotips for nanoscale printing and manufacturing |
| US10038267B2 (en) | 2014-06-12 | 2018-07-31 | Palo Alto Research Center Incorporated | Circuit interconnect system and method |
| US9278526B1 (en) * | 2014-10-14 | 2016-03-08 | Xerox Corporation | Modular printhead sub-assembly |
| JP2021136248A (ja) * | 2020-02-21 | 2021-09-13 | 株式会社ディスコ | デバイスウェーハの加工方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5045870A (en) * | 1990-04-02 | 1991-09-03 | International Business Machines Corporation | Thermal ink drop on demand devices on a single chip with vertical integration of driver device |
| KR100481901B1 (ko) * | 1999-12-10 | 2005-04-11 | 후지 샤신 필름 가부시기가이샤 | 잉크젯 헤드 및 인쇄 장치 |
| US6464324B1 (en) * | 2000-01-31 | 2002-10-15 | Picojet, Inc. | Microfluid device and ultrasonic bonding process |
| US6586112B1 (en) * | 2000-08-01 | 2003-07-01 | Hewlett-Packard Company | Mandrel and orifice plates electroformed using the same |
| CN100411872C (zh) * | 2004-01-16 | 2008-08-20 | 财团法人工业技术研究院 | 喷墨打印头及其制造方法 |
| JP4586427B2 (ja) * | 2004-06-10 | 2010-11-24 | 富士ゼロックス株式会社 | インクジェット記録ヘッド |
| US7229219B2 (en) * | 2004-09-17 | 2007-06-12 | Fujitsu Limited | Apparatuses and methods for integrating opto-electric components into the optical pathways of routing substrates with precision optical coupling and compact electrical interconnection |
| US7600863B2 (en) * | 2006-01-04 | 2009-10-13 | Xerox Corporation | Inkjet jet stack external manifold |
| US7959266B2 (en) * | 2007-03-28 | 2011-06-14 | Xerox Corporation | Self aligned port hole opening process for ink jet print heads |
| US8082641B2 (en) | 2007-06-01 | 2011-12-27 | Xerox Corporation | Method of manufacturing a ductile polymer-piezoelectric material composite |
| US8360557B2 (en) * | 2008-12-05 | 2013-01-29 | Xerox Corporation | Method for laser drilling fluid ports in multiple layers |
| KR101545271B1 (ko) * | 2008-12-19 | 2015-08-19 | 삼성전자주식회사 | 압전형 음향 변환기 및 이의 제조방법 |
| US8197037B2 (en) | 2009-12-15 | 2012-06-12 | Xerox Corporation | Method of removing thermoset polymer from piezoelectric transducers in a print head |
| US8303093B2 (en) * | 2009-12-15 | 2012-11-06 | Xerox Corporation | Print head having a polymer layer to facilitate assembly of the print head |
-
2011
- 2011-01-21 US US13/011,409 patent/US8465659B2/en not_active Expired - Fee Related
-
2012
- 2012-01-12 JP JP2012004366A patent/JP5778588B2/ja not_active Expired - Fee Related
- 2012-01-19 CN CN201210024667.6A patent/CN102602151B/zh not_active Expired - Fee Related
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