JP5939898B2 - 可とう性平板を用いる侵入型ポリマーの平坦化方法 - Google Patents
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Description
本発明のまた別の態様は、以下のとおりであってもよい。
〔1〕インク・ジェット・プリント・ヘッドを形成するための方法であって、
未硬化の誘電侵入型層を圧電素子アレイ上へ計量分配することと、
前記未硬化の誘電侵入型層と上側のプレス板との間に可とう性の上板および離型剤とを挿入することと、
前記未硬化の誘電侵入型層を前記離型剤と接触させることと、
前記未硬化の誘電侵入型層と前記離型剤との接触を保持しながら、前記上側のプレス板を用いて前記未硬化の誘電侵入型層に圧力を加えることであって、前記可とう性の上板は前記未硬化の誘電侵入型層へ圧力を加える間にたわむ圧力を加えることと、
前記未硬化の誘電侵入型層と前記離型剤との接触を保持しかつ前記上側のプレス板を用いて前記未硬化の誘電侵入型層に圧力を加えながら、前記誘電侵入型層を硬化することと、を含む方法。
〔2〕前記可とう性の上板と前記上側のプレス板との間に、約1mmと約25mmとの間の厚さを有するシリコーンゴム層を挿入することと、
前記侵入型層の硬化の間に、前記シリコーンゴム層を前記可とう性の上板および前記上側のプレス板と接触させることとをさらに含む、前記〔1〕に記載の方法。
〔3〕前記可とう性の上板は、前記上板がたわむ間に、約25μmと約12,700μmとの間の厚さおよびガラス、シリコン、石英、サファイアおよび金属のうちの少なくとも1つを含む組成を有する、前記〔1〕に記載の方法。
〔4〕前記硬化された誘電侵入型層の第1の部分を除去して圧電素子のアレイを露出し、かつ隣接する圧電素子間に前記硬化された誘電侵入型層の第2の部分を残すことをさらに含む、前記〔1〕に記載の方法。
〔5〕約10MPaと約50MPaとの間の曲げ弾性率を有する可とう性の上板を提供することをさらに含む、前記〔1〕に記載の方法。
〔6〕インク・ジェット・プリント・ヘッドを形成するための装置であって、
下側のプレスカセットと上側のプレス板とを備えるプレスと、
離型剤と、
ガラス、シリコン、石英、サファイアおよび金属のうちの少なくとも1つを含む可とう性の上板であって、前記ガラス、シリコン、石英、サファイアおよび金属のうちの1つは約25μmと約12,700μmとの間の厚さを有する可とう性の上板とを備え、
前記離型剤注文前記可とう性の上板は、未硬化の侵入型層と前記上側のプレス板との間へ挿入されるように構成される装置。
〔7〕前記ガラス、シリコン、石英、サファイアおよび金属のうちの1つは約500μmと約900μmとの間の厚さを有する、前記〔6〕に記載の装置。
〔8〕インク・ジェット・プリンタを形成するための方法であって、
少なくとも1つのインクジェット・プリントヘッドを、
未硬化の誘電侵入型層を圧電素子アレイ上へ計量分配することと、
前記未硬化の誘電侵入型層と上側のプレス板との間に可とう性の上板および離型剤とを挿入することと、
前記未硬化の誘電侵入型層を前記離型剤と接触させることと、
前記未硬化の誘電侵入型層と前記離型剤との接触を保持しながら、前記上側のプレス板を用いて前記未硬化の誘電侵入型層に圧力を加えることであって、前記可とう性の上板は前記未硬化の誘電侵入型層へ圧力を加える間にたわむことと、
前記未硬化の誘電侵入型層と前記離型剤との接触を保持しかつ前記上側のプレス板を用いて前記未硬化の誘電侵入型層に圧力を加えながら、前記誘電侵入型層を硬化することと、を含む方法を用いて形成することと、
前記少なくとも1つのプリントヘッドをプリンタのハウジング内へ取り付けることと、を含む方法。
〔9〕前記可とう性の上板は、前記上板がたわむ間に、約25μmと約12,700μmとの間の厚さおよびガラス、シリコン、石英、サファイアおよび金属のうちの少なくとも1つを含む組成を有する、前記〔8〕に記載の方法。
〔10〕約10MPaと約50MPaとの間の曲げ弾性率を有する可とう性の上板を提供することをさらに含む、前記〔8〕に記載の方法。
Claims (5)
- インク・ジェット・プリント・ヘッドを形成するための装置であって、
下側のプレスカセットと上側のプレス板とを備えるプレスと、
離型剤と、
ガラス、シリコン、石英、サファイアおよび金属のうちの少なくとも1つを含む可とう性の上板であって、前記ガラス、シリコン、石英、サファイアおよび金属のうちの1つは25μmと12,700μmとの間の厚さを有する可とう性の上板とを備え、
前記下側のプレスカセットは、複数の圧電素子の上に横たわりかつ覆っている未硬化の侵入型層を含むプリント・ヘッド・ジェット・スタック・サブアッセンブリを支持するように構成され、
前記離型剤および前記可とう性の上板は、前記未硬化の侵入型層と前記上側のプレス板との間へ挿入されており、
前記離型剤は、前記プリント・ヘッド・ジェット・スタック・アッセンブリと前記未硬化の侵入型層でのみ物理的に接触し、かつ前記複数の圧電素子は前記未硬化の侵入型層を介して露出しておらず、
前記未硬化の侵入型層は、液状タイプの熱硬化性樹脂であり、
前記プレスは、前記可とう性の上板を10psiと500psiとの間の圧力で前記侵入型層に接触させて保持し、前記未硬化の侵入型層を加熱により硬化させるように構成されている、装置。 - 前記下側のプレスカセットが加熱されるように構成されている、請求項1に記載の装置。
- 前記可とう性の上板が、ガラス、シリコン、石英およびサファイアのうちの1つを含み、前記可とう性の上板が500μmと900μmとの間の厚さを有する、請求項1に記載の装置。
- 前記可とう性の上板が、1MPaと300MPaとの間の曲げ弾性率を有する、請求項1に記載の装置。
- 前記可とう性の上板が、10MPaと50MPaとの間の曲げ弾性率を有する、請求項1に記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/165,785 | 2011-06-21 | ||
US13/165,785 US8556611B2 (en) | 2011-06-21 | 2011-06-21 | Method for interstitial polymer planarization using a flexible flat plate |
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Publication Number | Publication Date |
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JP2013001119A JP2013001119A (ja) | 2013-01-07 |
JP2013001119A5 JP2013001119A5 (ja) | 2015-07-23 |
JP5939898B2 true JP5939898B2 (ja) | 2016-06-22 |
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US (1) | US8556611B2 (ja) |
JP (1) | JP5939898B2 (ja) |
KR (1) | KR101988870B1 (ja) |
CN (1) | CN102837501B (ja) |
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DE102010001023A1 (de) * | 2010-01-19 | 2011-07-21 | Robert Bosch GmbH, 70469 | Sensorvorrichtung |
US9656469B2 (en) | 2013-02-28 | 2017-05-23 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
KR101827070B1 (ko) | 2013-02-28 | 2018-02-07 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 유체 유동 구조체 성형 |
JP6356263B2 (ja) | 2014-04-22 | 2018-07-11 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 流体フロー構造 |
US10038267B2 (en) | 2014-06-12 | 2018-07-31 | Palo Alto Research Center Incorporated | Circuit interconnect system and method |
US10714361B2 (en) * | 2017-12-21 | 2020-07-14 | Foundation For Research And Business, Seoul National University Of Science And Technology | Method of fabricating a semiconductor package using an insulating polymer layer |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615946A (en) * | 1967-12-01 | 1971-10-26 | Gen Electric | Method of embedding semiconductor chip within a dielectric layer flush with surface |
US3616014A (en) * | 1968-05-15 | 1971-10-26 | Walter Weglin | Manufacture of printed circuit board |
JPS59191600A (ja) * | 1983-04-15 | 1984-10-30 | Hitachi Ltd | ホツトプレス |
JPS6025714A (ja) * | 1983-07-22 | 1985-02-08 | Shin Kobe Electric Mach Co Ltd | 積層板の製造法 |
US4806195A (en) * | 1987-09-28 | 1989-02-21 | Edmond Namysl | Printed circuit board laminating machine |
JP3194783B2 (ja) * | 1992-05-15 | 2001-08-06 | 株式会社リコー | インク流路基板の製造方法及びインク流路基板 |
US5578159A (en) * | 1993-06-29 | 1996-11-26 | Hitachi Techno Engineering Co., Ltd. | Hot press for producing multilayer circuit board |
JPH07108549A (ja) * | 1993-10-08 | 1995-04-25 | Hitachi Techno Eng Co Ltd | ホットプレス |
JPH10272774A (ja) * | 1997-03-28 | 1998-10-13 | Sony Corp | プリンタ装置及びその製造方法 |
JP4012307B2 (ja) * | 1998-04-02 | 2007-11-21 | イビデン株式会社 | 多層プリント配線板の製造方法 |
US6100114A (en) * | 1998-08-10 | 2000-08-08 | International Business Machines Corporation | Encapsulation of solder bumps and solder connections |
TW545101B (en) * | 2001-10-12 | 2003-08-01 | Matsushita Electric Ind Co Ltd | Manufacturing method of printed wiring board |
JP2003283138A (ja) * | 2002-03-22 | 2003-10-03 | Taiyo Yuden Co Ltd | 三次元積層モジュール |
JP3646101B2 (ja) * | 2002-04-08 | 2005-05-11 | ニチゴー・モートン株式会社 | 積層方法 |
JP2007266165A (ja) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Ind Co Ltd | 多層配線基板の製造方法 |
US8303093B2 (en) | 2009-12-15 | 2012-11-06 | Xerox Corporation | Print head having a polymer layer to facilitate assembly of the print head |
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US20120328784A1 (en) | 2012-12-27 |
KR101988870B1 (ko) | 2019-06-14 |
KR20130012107A (ko) | 2013-02-01 |
US8556611B2 (en) | 2013-10-15 |
CN102837501A (zh) | 2012-12-26 |
CN102837501B (zh) | 2016-02-24 |
JP2013001119A (ja) | 2013-01-07 |
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