JP6082884B2 - 露光装置、露光方法 - Google Patents

露光装置、露光方法 Download PDF

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Publication number
JP6082884B2
JP6082884B2 JP2012132802A JP2012132802A JP6082884B2 JP 6082884 B2 JP6082884 B2 JP 6082884B2 JP 2012132802 A JP2012132802 A JP 2012132802A JP 2012132802 A JP2012132802 A JP 2012132802A JP 6082884 B2 JP6082884 B2 JP 6082884B2
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JP
Japan
Prior art keywords
exposure
substrate
unit
moving
disposed
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Active
Application number
JP2012132802A
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English (en)
Japanese (ja)
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JP2013257409A (ja
JP2013257409A5 (enExample
Inventor
三宅　健
健 三宅
俊博 高木
俊博 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanei Giken Co Ltd
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Sanei Giken Co Ltd
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Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Priority to JP2012132802A priority Critical patent/JP6082884B2/ja
Priority to KR1020130064595A priority patent/KR102205976B1/ko
Priority to TW102120332A priority patent/TWI603158B/zh
Priority to CN201310228361.7A priority patent/CN103488055A/zh
Publication of JP2013257409A publication Critical patent/JP2013257409A/ja
Publication of JP2013257409A5 publication Critical patent/JP2013257409A5/ja
Application granted granted Critical
Publication of JP6082884B2 publication Critical patent/JP6082884B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
JP2012132802A 2012-06-12 2012-06-12 露光装置、露光方法 Active JP6082884B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012132802A JP6082884B2 (ja) 2012-06-12 2012-06-12 露光装置、露光方法
KR1020130064595A KR102205976B1 (ko) 2012-06-12 2013-06-05 노광 장치, 노광 방법
TW102120332A TWI603158B (zh) 2012-06-12 2013-06-07 Exposure device, exposure method
CN201310228361.7A CN103488055A (zh) 2012-06-12 2013-06-08 曝光装置、曝光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012132802A JP6082884B2 (ja) 2012-06-12 2012-06-12 露光装置、露光方法

Publications (3)

Publication Number Publication Date
JP2013257409A JP2013257409A (ja) 2013-12-26
JP2013257409A5 JP2013257409A5 (enExample) 2015-08-13
JP6082884B2 true JP6082884B2 (ja) 2017-02-22

Family

ID=49828382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012132802A Active JP6082884B2 (ja) 2012-06-12 2012-06-12 露光装置、露光方法

Country Status (4)

Country Link
JP (1) JP6082884B2 (enExample)
KR (1) KR102205976B1 (enExample)
CN (1) CN103488055A (enExample)
TW (1) TWI603158B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201643557A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
TW201704892A (zh) * 2015-03-31 2017-02-01 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
TW201643558A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
CN105217311A (zh) * 2015-09-09 2016-01-06 合肥芯碁微电子装备有限公司 一种ldi单机自动装置
JP5997409B1 (ja) * 2016-05-26 2016-09-28 株式会社 ベアック 両面露光装置及び両面露光装置におけるマスクとワークとの位置合わせ方法
CN109656104B (zh) * 2018-12-26 2021-03-16 深圳市华星光电半导体显示技术有限公司 一种基板曝光方法及装置
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
CN110647017A (zh) * 2019-10-26 2020-01-03 东莞科视自动化科技有限公司 一种自动对位曝光设备及方法
TWI877329B (zh) * 2020-03-23 2025-03-21 日商三榮技研股份有限公司 曝光裝置及曝光方法
CN116520643B (zh) * 2022-01-24 2025-08-01 成都辰显光电有限公司 基板制备方法及显示面板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004012900A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
CN100468624C (zh) * 2003-08-07 2009-03-11 株式会社尼康 曝光方法及曝光装置、载置台装置、及设备制造方法
JP2006350022A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 描画装置及び描画方法
US7429532B2 (en) * 2005-08-08 2008-09-30 Applied Materials, Inc. Semiconductor substrate process using an optically writable carbon-containing mask
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置
JP4887165B2 (ja) * 2007-02-02 2012-02-29 富士フイルム株式会社 描画装置及び方法
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method
JP5420942B2 (ja) * 2009-03-19 2014-02-19 大日本スクリーン製造株式会社 パターン描画装置およびパターン描画方法

Also Published As

Publication number Publication date
CN103488055A (zh) 2014-01-01
TWI603158B (zh) 2017-10-21
KR102205976B1 (ko) 2021-01-20
TW201351067A (zh) 2013-12-16
JP2013257409A (ja) 2013-12-26
KR20130139170A (ko) 2013-12-20

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