JP6073932B2 - 多層デバイスの電気的接続部の生成方法および電気的接続部を有する多層デバイス - Google Patents
多層デバイスの電気的接続部の生成方法および電気的接続部を有する多層デバイス Download PDFInfo
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- JP6073932B2 JP6073932B2 JP2014558079A JP2014558079A JP6073932B2 JP 6073932 B2 JP6073932 B2 JP 6073932B2 JP 2014558079 A JP2014558079 A JP 2014558079A JP 2014558079 A JP2014558079 A JP 2014558079A JP 6073932 B2 JP6073932 B2 JP 6073932B2
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- 238000000034 method Methods 0.000 title claims description 59
- 239000000463 material Substances 0.000 claims description 161
- 239000011810 insulating material Substances 0.000 claims description 136
- 239000004020 conductor Substances 0.000 claims description 102
- 239000000758 substrate Substances 0.000 claims description 68
- 239000002904 solvent Substances 0.000 claims description 22
- 238000000059 patterning Methods 0.000 claims description 21
- 238000001459 lithography Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 50
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 238000009413 insulation Methods 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 7
- 238000000227 grinding Methods 0.000 description 6
- 238000003801 milling Methods 0.000 description 6
- 238000005488 sandblasting Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/308—Stacked capacitors made by transfer techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Manufacture Of Switches (AREA)
Description
2 : 光感受性材料
3 : 絶縁材料
4 : 露光マスク
5a : 第1の内部電極層
5b : 第2の内部電極層
6 : 導電性材料
7 : 露光
8a : 第1の外部電極
8b : 第2の外部電極
9 : 圧電層
10a : 第1の外面
10b : 第2の外面
10c : 第3の外面
10d : 第4の外面
11 : 基体
12 : 積層方向
13 : 2つの隣接する内部電極層の間隔
14 : 非接続領域
15 : 絶縁バー
16 : 接続バー
17 : 絶縁バーの幅
x : オーバーラップ
Claims (12)
- 多層デバイスの電気的接続を生成するための方法であって、
A)内部電極層(5a,5b)を有する多層デバイス(1)の基体(11)を提供するステップと、
B)絶縁材料(3)と、導電性材料(6)と、光感受性材料(2)とを提供するステップと、
C)前記基体(11)の1つの外面(10a,10b)上で前記内部電極層(5a,5b)が積層方向で交互に前記絶縁材料(3)および前記導電性材料(6)によって覆われ、前記内部電極層(5a,5b)が交互に接続されるように、前記外面(10a,10b)上で前記絶縁材料(3)および前記導電性材料(6)をパターンレイアウトするステップであって、前記外面(10a,10b)上にまず前記導電性材料(6)が取り付けられ、その後前記外面(10a,10b)上に前記光感受性材料(2)が、その後前記外面(10a,10b)上に前記絶縁材料(3)が取り付けられ、前記パターンレイアウトは前記光感受性材料(2)によって生成されるステップと、
を備えることを特徴とする方法。 - 前記導電性材料(6)上に前記光感受性材料(2)を取り付けてパターニングするステップを備えることを特徴とする、請求項1に記載の方法。
- 前記光感受性材料(2)は、リソグラフィーを用いてパターニングされることを特徴とする、請求項2に記載の方法。
- 前記導電性材料(6)をパターニングするステップを備えることを特徴とする、請求項1乃至3のいずれか1項に記載の方法。
- 前記導電性材料(6)をパターニングする際、前記光感受性材料(2)はエッチング停止部として機能することを特徴とする、請求項4に記載の方法。
- 前記パターニングは、異なる材料を選択的にエッチングすることができる3つの異なる溶剤を用いて行われることを特徴とする、請求項1乃至5のいずれか1項に記載の方法。
- 前記溶剤の1つは水であることを特徴とする、請求項6に記載の方法。
- 前記方法の間に前記光感受性材料(2)が完全に取り除かれることを特徴とする、請求項1乃至7のいずれか1項に記載の方法。
- 前記絶縁材料(3)は、絶縁バー(15)の形態で前記内部電極層(5a,5b)に取り付けられ、当該絶縁バーのそれぞれの積層方向での幅(17)は、2つの隣接する内部電極層(5a,5b)の間隔(13)より大きいことを特徴とする、請求項1乃至8のいずれか1項に記載の方法。
- 前記光感受性材料(2)のパターニングの前に前記内部電極層(5a,5b)の位置を確認するために前記基体(11)を寸法測定するステップを備えることを特徴とする、請求項1乃至9のいずれか1項に記載の方法。
- 前記光感受性材料(2)は露光マスクを用いて露光によってパターニングされ、前記露光マスクは、前記基体(11)の寸法測定の結果に対応して選択されることを特徴とする、請求項10に記載の方法。
- 前記絶縁材料(3)および前記導電性材料(6)は、前記パターニングの後、前記内部電極層(5a,5b)上で、交互に帯状にパターンレイアウトされていることを特徴とする、請求項1乃至11のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012101506.6 | 2012-02-24 | ||
DE102012101506 | 2012-02-24 | ||
PCT/EP2013/053265 WO2013124267A1 (de) | 2012-02-24 | 2013-02-19 | Verfahren zur herstellung einer elektrischen kontaktierung eines vielschichtbauelements und vielschichtbauelement mit einer elektrischen kontaktierung |
Publications (2)
Publication Number | Publication Date |
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JP2015511406A JP2015511406A (ja) | 2015-04-16 |
JP6073932B2 true JP6073932B2 (ja) | 2017-02-01 |
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JP2014558079A Active JP6073932B2 (ja) | 2012-02-24 | 2013-02-19 | 多層デバイスの電気的接続部の生成方法および電気的接続部を有する多層デバイス |
Country Status (5)
Country | Link |
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US (1) | US10090454B2 (ja) |
EP (1) | EP2817835B1 (ja) |
JP (1) | JP6073932B2 (ja) |
CN (1) | CN104126234A (ja) |
WO (1) | WO2013124267A1 (ja) |
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US9882117B2 (en) * | 2015-05-28 | 2018-01-30 | Honda Motor Co., Ltd. | Actuator including a dielectric elastomer and electrode films |
DE102015214778A1 (de) * | 2015-08-03 | 2017-02-09 | Continental Automotive Gmbh | Herstellungsverfahren zum Herstellen eines elektromechanischen Aktors und elektromechanischer Aktor |
CN107180912B (zh) * | 2017-06-09 | 2019-08-20 | 西人马联合测控(泉州)科技有限公司 | 压电陶瓷堆叠结构及压电式传感器 |
CN107591257B (zh) * | 2017-10-20 | 2020-11-10 | 温州宏丰电工合金股份有限公司 | 一种银基多层复合电接触材料及其制备方法 |
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2013
- 2013-02-19 US US14/380,670 patent/US10090454B2/en active Active
- 2013-02-19 JP JP2014558079A patent/JP6073932B2/ja active Active
- 2013-02-19 CN CN201380010568.5A patent/CN104126234A/zh active Pending
- 2013-02-19 WO PCT/EP2013/053265 patent/WO2013124267A1/de active Application Filing
- 2013-02-19 EP EP13707133.8A patent/EP2817835B1/de active Active
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Publication number | Publication date |
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JP2015511406A (ja) | 2015-04-16 |
EP2817835A1 (de) | 2014-12-31 |
WO2013124267A1 (de) | 2013-08-29 |
US20150022055A1 (en) | 2015-01-22 |
US10090454B2 (en) | 2018-10-02 |
CN104126234A (zh) | 2014-10-29 |
EP2817835B1 (de) | 2016-07-27 |
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