JP6070588B2 - 多層配線基板 - Google Patents

多層配線基板 Download PDF

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Publication number
JP6070588B2
JP6070588B2 JP2014010967A JP2014010967A JP6070588B2 JP 6070588 B2 JP6070588 B2 JP 6070588B2 JP 2014010967 A JP2014010967 A JP 2014010967A JP 2014010967 A JP2014010967 A JP 2014010967A JP 6070588 B2 JP6070588 B2 JP 6070588B2
Authority
JP
Japan
Prior art keywords
ground electrode
electrode
wiring board
multilayer wiring
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014010967A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015138925A (ja
Inventor
宏通 北嶋
宏通 北嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2014010967A priority Critical patent/JP6070588B2/ja
Priority to US14/490,698 priority patent/US9370092B2/en
Priority to CN201910110770.4A priority patent/CN109769342A/zh
Priority to CN201410572577.XA priority patent/CN104812160A/zh
Publication of JP2015138925A publication Critical patent/JP2015138925A/ja
Application granted granted Critical
Publication of JP6070588B2 publication Critical patent/JP6070588B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09354—Ground conductor along edge of main surface
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2014010967A 2014-01-24 2014-01-24 多層配線基板 Active JP6070588B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014010967A JP6070588B2 (ja) 2014-01-24 2014-01-24 多層配線基板
US14/490,698 US9370092B2 (en) 2014-01-24 2014-09-19 Multilayer wiring board
CN201910110770.4A CN109769342A (zh) 2014-01-24 2014-10-23 多层布线基板
CN201410572577.XA CN104812160A (zh) 2014-01-24 2014-10-23 多层布线基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014010967A JP6070588B2 (ja) 2014-01-24 2014-01-24 多層配線基板

Publications (2)

Publication Number Publication Date
JP2015138925A JP2015138925A (ja) 2015-07-30
JP6070588B2 true JP6070588B2 (ja) 2017-02-01

Family

ID=53680475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014010967A Active JP6070588B2 (ja) 2014-01-24 2014-01-24 多層配線基板

Country Status (3)

Country Link
US (1) US9370092B2 (zh)
JP (1) JP6070588B2 (zh)
CN (2) CN109769342A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6652443B2 (ja) * 2016-05-06 2020-02-26 株式会社日本マイクロニクス 多層配線基板及びこれを用いたプローブカード
CN106163097B (zh) * 2016-08-31 2018-11-09 珠海市联健电子科技有限公司 一种防漏电的铝基板及其方法
US10720338B1 (en) * 2017-11-07 2020-07-21 Honeywell Federal Manufacturing & Technologies, Llc Low temperature cofired ceramic substrates and fabrication techniques for the same
EP4095893A4 (en) * 2020-01-24 2024-04-17 Kyocera Corp WIRING SUBSTRATE AND ELECTRONIC DEVICE

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3656307B2 (ja) * 1996-02-07 2005-06-08 株式会社デンソー 混成集積回路装置およびその製造方法
JP2001319992A (ja) * 2000-02-28 2001-11-16 Shinko Electric Ind Co Ltd 配線基板、半導体装置及びそれらの製造方法
JP3882500B2 (ja) 2000-03-02 2007-02-14 株式会社村田製作所 厚膜絶縁組成物およびそれを用いたセラミック電子部品、ならびに電子装置
JP3565768B2 (ja) * 2000-07-27 2004-09-15 ソニーケミカル株式会社 配線基板
TW575949B (en) * 2001-02-06 2004-02-11 Hitachi Ltd Mixed integrated circuit device, its manufacturing method and electronic apparatus
JP4025654B2 (ja) * 2003-01-29 2007-12-26 京セラ株式会社 高周波モジュール
JP2007287654A (ja) * 2006-03-23 2007-11-01 Alps Electric Co Ltd 接続装置
JP2007295327A (ja) * 2006-04-26 2007-11-08 Hitachi Metals Ltd 高周波回路、高周波部品及び通信装置
JP4790558B2 (ja) * 2006-10-02 2011-10-12 日東電工株式会社 配線回路基板の製造方法
WO2009128437A1 (ja) * 2008-04-14 2009-10-22 株式会社村田製作所 無線ｉｃデバイス、電子機器及び無線ｉｃデバイスの共振周波数の調整方法
JP5115573B2 (ja) * 2010-03-03 2013-01-09 オムロン株式会社 接続用パッドの製造方法
KR20130015661A (ko) 2011-08-04 2013-02-14 삼성전기주식회사 다층 세라믹 기판 및 그의 제조방법

Also Published As

Publication number Publication date
US9370092B2 (en) 2016-06-14
US20150216034A1 (en) 2015-07-30
CN109769342A (zh) 2019-05-17
JP2015138925A (ja) 2015-07-30
CN104812160A (zh) 2015-07-29

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