JP6065612B2 - シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ - Google Patents

シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ Download PDF

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JP6065612B2
JP6065612B2 JP2013014556A JP2013014556A JP6065612B2 JP 6065612 B2 JP6065612 B2 JP 6065612B2 JP 2013014556 A JP2013014556 A JP 2013014556A JP 2013014556 A JP2013014556 A JP 2013014556A JP 6065612 B2 JP6065612 B2 JP 6065612B2
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voxel
calculation
damage
workpiece
shape
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JP2014029982A (ja
JP2014029982A5 (enExample
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信行 久保井
信行 久保井
木下　隆
隆 木下
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Sony Corp
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Sony Corp
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Priority to JP2013014556A priority Critical patent/JP6065612B2/ja
Priority to US13/919,470 priority patent/US9189577B2/en
Priority to CN201310247610.7A priority patent/CN103514318A/zh
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Drying Of Semiconductors (AREA)
JP2013014556A 2012-06-28 2013-01-29 シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ Active JP6065612B2 (ja)

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JP2013014556A JP6065612B2 (ja) 2012-06-28 2013-01-29 シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ
US13/919,470 US9189577B2 (en) 2012-06-28 2013-06-17 Simulation method, simulation program, processing unit, and simulator
CN201310247610.7A CN103514318A (zh) 2012-06-28 2013-06-20 模拟方法、计算机可读介质、处理装置及模拟器

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JP2012146065 2012-06-28
JP2012146065 2012-06-28
JP2013014556A JP6065612B2 (ja) 2012-06-28 2013-01-29 シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ

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JP2014029982A JP2014029982A (ja) 2014-02-13
JP2014029982A5 JP2014029982A5 (enExample) 2016-02-12
JP6065612B2 true JP6065612B2 (ja) 2017-01-25

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CN (1) CN103514318A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5685762B2 (ja) * 2011-03-07 2015-03-18 みずほ情報総研株式会社 プラズマ加工形状シミュレーション装置及びプログラム
US20150013901A1 (en) * 2013-07-11 2015-01-15 Hsio Technologies, Llc Matrix defined electrical circuit structure
US20150205890A1 (en) * 2014-01-17 2015-07-23 Kabushiki Kaisha Toshiba Topography simulation apparatus, topography simulation method and recording medium
JP6117746B2 (ja) 2014-07-30 2017-04-19 ソニーセミコンダクタソリューションズ株式会社 エッチング特性推定方法、プログラム、情報処理装置、加工装置、設計方法、および、製造方法
WO2016132759A1 (ja) * 2015-02-20 2016-08-25 ソニー株式会社 情報処理装置、加工装置、推定方法、プログラム、および、加工方法
US10599789B2 (en) * 2015-11-25 2020-03-24 Synopsys, Inc. Topography simulation of etching and/or deposition on a physical structure
JP2017162286A (ja) 2016-03-10 2017-09-14 東芝メモリ株式会社 形状シミュレーション装置、形状シミュレーション方法、および形状シミュレーションプログラム
JP2017163035A (ja) * 2016-03-10 2017-09-14 東芝メモリ株式会社 形状シミュレーション装置、形状シミュレーション方法、および形状シミュレーションプログラム
JP2018067677A (ja) * 2016-10-21 2018-04-26 ソニーセミコンダクタソリューションズ株式会社 ダメージ予測方法、プログラム、および半導体加工システム
US11093665B2 (en) * 2017-10-25 2021-08-17 Lockheed Martin Corporation System and method for simulation visualization
SG10202005345XA (en) * 2019-06-11 2021-01-28 Canon Kk Simulation method, simulation apparatus, and program
CN113378444B (zh) * 2021-08-13 2021-11-05 墨研计算科学（南京）有限公司 一种淀积工艺的仿真方法及装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188926A (ja) 1989-12-19 1991-08-16 Kubota Corp ろ過処理方法
JP2687270B2 (ja) 1992-07-27 1997-12-08 日本電信電話株式会社 半導体装置断面構造の表示方法
JP3188926B2 (ja) 1993-09-06 2001-07-16 日本電信電話株式会社 半導体装置断面構造の表示方法
US6313842B1 (en) * 1999-03-03 2001-11-06 Discreet Logic Inc. Generating image data
JP3388203B2 (ja) * 1999-05-28 2003-03-17 株式会社半導体先端テクノロジーズ 形状シミュレーション方法、装置および記録媒体
US7375490B2 (en) * 2004-09-14 2008-05-20 Siemens Energy & Automation, Inc. Methods for managing electrical power
US7850338B1 (en) * 2006-09-25 2010-12-14 Microscan Systems, Inc. Methods for directing light
JP4957195B2 (ja) * 2006-11-09 2012-06-20 ソニー株式会社 液晶表示装置
JP5322413B2 (ja) * 2007-08-16 2013-10-23 株式会社東芝 シミュレーション方法およびシミュレーションプログラム
JP5428450B2 (ja) * 2009-03-30 2014-02-26 ソニー株式会社 イオン照射ダメージの予測方法とイオン照射ダメージのシミュレータ、およびイオン照射装置とイオン照射方法
JP2011081154A (ja) * 2009-10-07 2011-04-21 Hitachi Ltd 光学素子および光学装置
US9905028B2 (en) * 2013-12-11 2018-02-27 Adobe Systems Incorporated Simulating sub-surface scattering of illumination for simulated three-dimensional objects

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JP2014029982A (ja) 2014-02-13
CN103514318A (zh) 2014-01-15
US20140005990A1 (en) 2014-01-02
US9189577B2 (en) 2015-11-17

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