CN103514318A - 模拟方法、计算机可读介质、处理装置及模拟器 - Google Patents

模拟方法、计算机可读介质、处理装置及模拟器 Download PDF

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Publication number
CN103514318A
CN103514318A CN201310247610.7A CN201310247610A CN103514318A CN 103514318 A CN103514318 A CN 103514318A CN 201310247610 A CN201310247610 A CN 201310247610A CN 103514318 A CN103514318 A CN 103514318A
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voxel
vector
damage
calculation
processing target
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Chinese (zh)
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久保井信行
木下隆
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Sony Corp
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Sony Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Drying Of Semiconductors (AREA)
CN201310247610.7A 2012-06-28 2013-06-20 模拟方法、计算机可读介质、处理装置及模拟器 Pending CN103514318A (zh)

Applications Claiming Priority (4)

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JP2012-146065 2012-06-28
JP2012146065 2012-06-28
JP2013-014556 2013-01-29
JP2013014556A JP6065612B2 (ja) 2012-06-28 2013-01-29 シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ

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CN103514318A true CN103514318A (zh) 2014-01-15

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US (1) US9189577B2 (enExample)
JP (1) JP6065612B2 (enExample)
CN (1) CN103514318A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN112068398A (zh) * 2019-06-11 2020-12-11 佳能株式会社 模拟方法、模拟装置、存储介质、膜形成方法和生产固化产物的方法

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JP5685762B2 (ja) * 2011-03-07 2015-03-18 みずほ情報総研株式会社 プラズマ加工形状シミュレーション装置及びプログラム
US20150013901A1 (en) * 2013-07-11 2015-01-15 Hsio Technologies, Llc Matrix defined electrical circuit structure
US20150205890A1 (en) * 2014-01-17 2015-07-23 Kabushiki Kaisha Toshiba Topography simulation apparatus, topography simulation method and recording medium
JP6117746B2 (ja) * 2014-07-30 2017-04-19 ソニーセミコンダクタソリューションズ株式会社 エッチング特性推定方法、プログラム、情報処理装置、加工装置、設計方法、および、製造方法
US10534355B2 (en) * 2015-02-20 2020-01-14 Sony Semiconductor Solutions Corporation Information processing device, processing device, prediction method, and processing method
US10599789B2 (en) * 2015-11-25 2020-03-24 Synopsys, Inc. Topography simulation of etching and/or deposition on a physical structure
JP2017163035A (ja) * 2016-03-10 2017-09-14 東芝メモリ株式会社 形状シミュレーション装置、形状シミュレーション方法、および形状シミュレーションプログラム
JP2017162286A (ja) 2016-03-10 2017-09-14 東芝メモリ株式会社 形状シミュレーション装置、形状シミュレーション方法、および形状シミュレーションプログラム
JP2018067677A (ja) * 2016-10-21 2018-04-26 ソニーセミコンダクタソリューションズ株式会社 ダメージ予測方法、プログラム、および半導体加工システム
US11093665B2 (en) * 2017-10-25 2021-08-17 Lockheed Martin Corporation System and method for simulation visualization
CN113378444B (zh) * 2021-08-13 2021-11-05 墨研计算科学（南京）有限公司 一种淀积工艺的仿真方法及装置

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JPH03188926A (ja) 1989-12-19 1991-08-16 Kubota Corp ろ過処理方法
JP2687270B2 (ja) 1992-07-27 1997-12-08 日本電信電話株式会社 半導体装置断面構造の表示方法
JP3188926B2 (ja) 1993-09-06 2001-07-16 日本電信電話株式会社 半導体装置断面構造の表示方法
US6313842B1 (en) * 1999-03-03 2001-11-06 Discreet Logic Inc. Generating image data
JP3388203B2 (ja) * 1999-05-28 2003-03-17 株式会社半導体先端テクノロジーズ 形状シミュレーション方法、装置および記録媒体
US7375490B2 (en) * 2004-09-14 2008-05-20 Siemens Energy & Automation, Inc. Methods for managing electrical power
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JP5322413B2 (ja) * 2007-08-16 2013-10-23 株式会社東芝 シミュレーション方法およびシミュレーションプログラム
JP5428450B2 (ja) * 2009-03-30 2014-02-26 ソニー株式会社 イオン照射ダメージの予測方法とイオン照射ダメージのシミュレータ、およびイオン照射装置とイオン照射方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112068398A (zh) * 2019-06-11 2020-12-11 佳能株式会社 模拟方法、模拟装置、存储介质、膜形成方法和生产固化产物的方法
CN112068398B (zh) * 2019-06-11 2024-03-15 佳能株式会社 模拟方法、模拟装置、存储介质、膜形成方法和生产固化产物的方法

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US9189577B2 (en) 2015-11-17
JP2014029982A (ja) 2014-02-13
JP6065612B2 (ja) 2017-01-25
US20140005990A1 (en) 2014-01-02

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Application publication date: 20140115