JP6058664B2 - 低応力ビア - Google Patents

低応力ビア Download PDF

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Publication number
JP6058664B2
JP6058664B2 JP2014522989A JP2014522989A JP6058664B2 JP 6058664 B2 JP6058664 B2 JP 6058664B2 JP 2014522989 A JP2014522989 A JP 2014522989A JP 2014522989 A JP2014522989 A JP 2014522989A JP 6058664 B2 JP6058664 B2 JP 6058664B2
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Japan
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component
metal
substrate
conductive
opening
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JP2014522989A
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Japanese (ja)
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JP2014526149A5 (enExample
JP2014526149A (ja
Inventor
イリヤス モハメド
イリヤス モハメド
ベルガセム ハーバ
ベルガセム ハーバ
キプリアン ウゾ
キプリアン ウゾ
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Adeia Semiconductor Solutions LLC
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Tessera LLC
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Publication of JP2014526149A5 publication Critical patent/JP2014526149A5/ja
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    • H10W20/023—
    • H10W20/0261—
    • H10W20/20—
    • H10W20/42—
    • H10W20/425—
    • H10W20/48—
    • H10W72/285—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing & Machinery (AREA)
JP2014522989A 2011-07-29 2012-07-26 低応力ビア Active JP6058664B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/193,814 2011-07-29
US13/193,814 US8816505B2 (en) 2011-07-29 2011-07-29 Low stress vias
PCT/US2012/048288 WO2013019541A2 (en) 2011-07-29 2012-07-26 Low-stress vias

Publications (3)

Publication Number Publication Date
JP2014526149A JP2014526149A (ja) 2014-10-02
JP2014526149A5 JP2014526149A5 (enExample) 2015-09-10
JP6058664B2 true JP6058664B2 (ja) 2017-01-11

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JP2014522989A Active JP6058664B2 (ja) 2011-07-29 2012-07-26 低応力ビア

Country Status (5)

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US (4) US8816505B2 (enExample)
JP (1) JP6058664B2 (enExample)
KR (1) KR101928320B1 (enExample)
TW (1) TWI538147B (enExample)
WO (1) WO2013019541A2 (enExample)

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Also Published As

Publication number Publication date
WO2013019541A2 (en) 2013-02-07
US9214425B2 (en) 2015-12-15
US20130026645A1 (en) 2013-01-31
US20170250132A1 (en) 2017-08-31
US9659858B2 (en) 2017-05-23
US10283449B2 (en) 2019-05-07
US8816505B2 (en) 2014-08-26
KR101928320B1 (ko) 2018-12-12
WO2013019541A4 (en) 2013-05-30
WO2013019541A3 (en) 2013-04-18
KR20140050693A (ko) 2014-04-29
TWI538147B (zh) 2016-06-11
US20140332981A1 (en) 2014-11-13
US20150325498A1 (en) 2015-11-12
TW201320287A (zh) 2013-05-16
JP2014526149A (ja) 2014-10-02

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