JP6054104B2 - 反応現像画像形成法 - Google Patents

反応現像画像形成法 Download PDF

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Publication number
JP6054104B2
JP6054104B2 JP2012193009A JP2012193009A JP6054104B2 JP 6054104 B2 JP6054104 B2 JP 6054104B2 JP 2012193009 A JP2012193009 A JP 2012193009A JP 2012193009 A JP2012193009 A JP 2012193009A JP 6054104 B2 JP6054104 B2 JP 6054104B2
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Prior art keywords
acid dianhydride
resin composition
acid
photosensitive resin
photoresist
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JP2012193009A
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Japanese (ja)
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JP2014048562A (ja
JP2014048562A5 (enExample
Inventor
俊幸 大山
俊幸 大山
安田　めぐみ
めぐみ 安田
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Yokohama National University
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Yokohama National University
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  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2012193009A 2012-09-03 2012-09-03 反応現像画像形成法 Expired - Fee Related JP6054104B2 (ja)

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JP2012193009A JP6054104B2 (ja) 2012-09-03 2012-09-03 反応現像画像形成法

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JP2012193009A JP6054104B2 (ja) 2012-09-03 2012-09-03 反応現像画像形成法

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JP2014048562A JP2014048562A (ja) 2014-03-17
JP2014048562A5 JP2014048562A5 (enExample) 2015-10-15
JP6054104B2 true JP6054104B2 (ja) 2016-12-27

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7633666B2 (ja) * 2021-06-21 2025-02-20 株式会社ピーアイ技術研究所 感光性ポリイミド樹脂組成物
CN116082636B (zh) * 2022-12-13 2025-03-18 广东粤港澳大湾区黄埔材料研究院 聚酰胺酸树脂及其制备方法、正性光敏树脂组合物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003035950A (ja) * 2001-05-15 2003-02-07 Hitachi Cable Ltd 感光性ポリイミド樹脂組成物
JP2005196130A (ja) * 2003-12-12 2005-07-21 Hitachi Cable Ltd 感光性ポリイミド樹脂組成物、それを用いた絶縁膜、絶縁膜の製造方法および絶縁膜を使用した電子部品
JP5526766B2 (ja) * 2009-12-25 2014-06-18 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜及びその形成方法
JP2011221390A (ja) * 2010-04-13 2011-11-04 Toyobo Co Ltd ポジ型感光性ポリイミド樹脂組成物

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