JP6031495B2 - 透明導電性フィルム - Google Patents
透明導電性フィルム Download PDFInfo
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- JP6031495B2 JP6031495B2 JP2014247952A JP2014247952A JP6031495B2 JP 6031495 B2 JP6031495 B2 JP 6031495B2 JP 2014247952 A JP2014247952 A JP 2014247952A JP 2014247952 A JP2014247952 A JP 2014247952A JP 6031495 B2 JP6031495 B2 JP 6031495B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31507—Of polycarbonate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon
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- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Physical Vapour Deposition (AREA)
Description
また、前記多結晶層は、スパッタ法により形成されたインジウムスズ酸化物の非結晶層を加熱処理することにより得られる。
前記多結晶層の結晶粒径の平均値は、190nm〜250nmであるのが好ましい。
また、前記多結晶層のキャリア密度は、6.5×10 20 個/cm 3 〜8×10 20 個/cm 3 であるのが好ましい。
また、前記多結晶層のホール移動度は、24cm 2 /V・sec〜28cm 2 /V・secであるのが好ましい。
多結晶層の表面を、透過型電子顕微鏡(日立製作所製 製品名「H−7650」)により、直接倍率100,000倍で観察し、加速電圧10kVにて写真撮影を行った。この写真に画像解析処理を施し、結晶粒界の識別を行った。この画像解析処理後の画像を図2に示す。そして、本識別の結果に基づき、各結晶粒の形状において最も長い径を粒径(nm)として、その平均値を求めた。
多結晶層のキャリア密度およびホール密度を、ホール効果測定システム(BIO−RAD社製 製品名「HL5500PC」)を用いて測定した。
多結晶層の比抵抗を、4端子法で求めた表面抵抗値に、該多結晶層の厚みを乗じて求めた。
透過型電子顕微鏡(日立製作所製 製品名「H−7650」)にて、結晶粒の有無を観察した。
2 フィルム基材
3 多結晶層
Claims (2)
- フィルム基材と、該フィルム基材上に形成されたインジウムスズ酸化物の多結晶層とを有する透明導電性フィルムであって、
前記多結晶層は、厚みが10nm〜30nmであり、結晶粒径の平均値が190nm〜250nmであり、かつキャリア密度が6.5×1020個/cm3を超え8×1020個/cm3以下であり、
前記多結晶層のホール移動度が、24cm2/V・sec〜28cm2/V・secであり、
前記インジウムスズ酸化物の多結晶層におけるスズ原子の量が、インジウム原子とスズ原子とを加えた重さに対して、7重量%〜12重量%である(但し、酸化インジウムと酸化スズとの合計100重量部に対して酸化スズを1重量部〜8重量部、すなわち、前記インジウムスズ酸化物の多結晶層におけるスズ原子の量を、インジウム原子とスズ原子とを加えた重さに対する百分率に換算して0.95重量%〜7.64重量%含有する範囲のうち、重複する範囲を除く)ことを特徴とする透明導電性フィルム。 - 前記フィルム基材は、ポリエチレンテレフタレート、ポリシクロオレフィン又はポリカーボネートからなることを特徴とする、請求項1記載の透明導電性フィルム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014247952A JP6031495B2 (ja) | 2012-06-07 | 2014-12-08 | 透明導電性フィルム |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012129916 | 2012-06-07 | ||
JP2012129916 | 2012-06-07 | ||
JP2014247952A JP6031495B2 (ja) | 2012-06-07 | 2014-12-08 | 透明導電性フィルム |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013555676A Division JPWO2013183564A1 (ja) | 2012-06-07 | 2013-05-31 | 透明導電性フィルム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015108192A JP2015108192A (ja) | 2015-06-11 |
JP6031495B2 true JP6031495B2 (ja) | 2016-11-24 |
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ID=49711956
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013555676A Pending JPWO2013183564A1 (ja) | 2012-06-07 | 2013-05-31 | 透明導電性フィルム |
JP2014247952A Active JP6031495B2 (ja) | 2012-06-07 | 2014-12-08 | 透明導電性フィルム |
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JP2013555676A Pending JPWO2013183564A1 (ja) | 2012-06-07 | 2013-05-31 | 透明導電性フィルム |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150086789A1 (ja) |
JP (2) | JPWO2013183564A1 (ja) |
KR (2) | KR101814375B1 (ja) |
CN (1) | CN103999166B (ja) |
TW (1) | TWI631578B (ja) |
WO (1) | WO2013183564A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102314238B1 (ko) * | 2014-04-30 | 2021-10-18 | 닛토덴코 가부시키가이샤 | 투명 도전성 필름 및 그 제조 방법 |
CN106460153B (zh) * | 2014-04-30 | 2019-05-10 | 日东电工株式会社 | 透明导电性膜及其制造方法 |
JP6211557B2 (ja) * | 2014-04-30 | 2017-10-11 | 日東電工株式会社 | 透明導電性フィルム及びその製造方法 |
CN105473756B (zh) * | 2014-05-20 | 2019-06-18 | 日东电工株式会社 | 透明导电性薄膜 |
US10133428B2 (en) * | 2015-05-29 | 2018-11-20 | Samsung Display Co., Ltd. | Flexible display device including a flexible substrate having a bending part and a conductive pattern at least partially disposed on the bending part |
JP6159490B1 (ja) * | 2015-09-30 | 2017-07-05 | 積水化学工業株式会社 | 光透過性導電フィルム、及び、アニール処理された光透過性導電フィルムの製造方法 |
JP6412539B2 (ja) | 2015-11-09 | 2018-10-24 | 日東電工株式会社 | 光透過性導電フィルムおよび調光フィルム |
USD806662S1 (en) | 2015-11-18 | 2018-01-02 | Samsung Electronics Co., Ltd. | Television |
USD806664S1 (en) | 2015-11-18 | 2018-01-02 | Samsung Electronics Co., Ltd. | Television |
JP7162461B2 (ja) | 2017-08-04 | 2022-10-28 | 日東電工株式会社 | ヒータ用部材、ヒータ用テープ、及びヒータ用部材付成形体 |
EP3664576B1 (en) * | 2017-08-04 | 2023-03-22 | Nitto Denko Corporation | Heater |
CN115280428A (zh) * | 2020-03-19 | 2022-11-01 | 日东电工株式会社 | 透明导电层和透明导电性薄膜 |
CN116348284B (zh) * | 2021-08-06 | 2024-05-24 | 日东电工株式会社 | 层叠体 |
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JPH07278791A (ja) * | 1994-04-15 | 1995-10-24 | Hitachi Ltd | 低抵抗透明導電膜 |
JPH0877845A (ja) * | 1994-09-01 | 1996-03-22 | Hitachi Ltd | 膜の作製方法および膜の改質方法 |
JP4010587B2 (ja) | 1995-12-20 | 2007-11-21 | 三井化学株式会社 | 透明導電性積層体及びそれを用いたエレクトロルミネッセンス発光素子 |
JP2001152323A (ja) * | 1999-11-29 | 2001-06-05 | Canon Inc | 透明電極および光起電力素子の作製方法 |
JP2002041243A (ja) * | 2000-07-21 | 2002-02-08 | Nippon Soda Co Ltd | 透明導電膜 |
JP3785109B2 (ja) * | 2002-04-08 | 2006-06-14 | 日東電工株式会社 | 透明導電積層体の製造方法 |
JP3749531B2 (ja) * | 2003-08-29 | 2006-03-01 | 日東電工株式会社 | 透明導電積層体の製造方法 |
CN100460943C (zh) * | 2004-06-03 | 2009-02-11 | 日东电工株式会社 | 透明导电性膜 |
TW200745923A (en) * | 2005-10-20 | 2007-12-16 | Nitto Denko Corp | Transparent conductive laminate body and touch panel equipped with above |
JP4861707B2 (ja) * | 2006-01-20 | 2012-01-25 | 日東電工株式会社 | 透明導電積層体 |
JP5166700B2 (ja) * | 2006-01-30 | 2013-03-21 | 日東電工株式会社 | 結晶性透明導電性薄膜、その製造方法、透明導電性フィルムおよびタッチパネル |
TWI445624B (zh) * | 2009-06-03 | 2014-07-21 | Toyo Boseki | 透明導電性積層薄膜 |
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JP2013152827A (ja) * | 2012-01-24 | 2013-08-08 | Kaneka Corp | 透明電極付き基板およびその製造方法 |
CN104067353B (zh) * | 2012-01-27 | 2016-10-26 | 株式会社钟化 | 带有透明电极的基板及其制造方法 |
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2013
- 2013-05-31 KR KR1020167035463A patent/KR101814375B1/ko active IP Right Grant
- 2013-05-31 JP JP2013555676A patent/JPWO2013183564A1/ja active Pending
- 2013-05-31 US US14/377,122 patent/US20150086789A1/en not_active Abandoned
- 2013-05-31 CN CN201380004245.5A patent/CN103999166B/zh active Active
- 2013-05-31 WO PCT/JP2013/065231 patent/WO2013183564A1/ja active Application Filing
- 2013-05-31 KR KR1020147004575A patent/KR20140041873A/ko active Application Filing
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US20150086789A1 (en) | 2015-03-26 |
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KR20140041873A (ko) | 2014-04-04 |
CN103999166B (zh) | 2018-01-09 |
WO2013183564A1 (ja) | 2013-12-12 |
JPWO2013183564A1 (ja) | 2016-01-28 |
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CN103999166A (zh) | 2014-08-20 |
KR101814375B1 (ko) | 2018-01-04 |
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