JP6030637B2 - ワイヤーボンディング法を改良するためのリードフレームのクリーニング - Google Patents

ワイヤーボンディング法を改良するためのリードフレームのクリーニング Download PDF

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JP6030637B2
JP6030637B2 JP2014508496A JP2014508496A JP6030637B2 JP 6030637 B2 JP6030637 B2 JP 6030637B2 JP 2014508496 A JP2014508496 A JP 2014508496A JP 2014508496 A JP2014508496 A JP 2014508496A JP 6030637 B2 JP6030637 B2 JP 6030637B2
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acid
composition
lead frame
composition used
contact
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JP2014516478A (ja
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クインティン コリアー テレンス
クインティン コリアー テレンス
バリー レニー デイビッド
バリー レニー デイビッド
ラママーシー ラジュクマール
ラママーシー ラジュクマール
エバラッド パリス ジーン
エバラッド パリス ジーン
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Air Products and Chemicals Inc
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Wire Bonding (AREA)
JP2014508496A 2011-04-25 2012-04-25 ワイヤーボンディング法を改良するためのリードフレームのクリーニング Expired - Fee Related JP6030637B2 (ja)

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KR20130142197A (ko) 2013-12-27
CN103620753A (zh) 2014-03-05
MY175223A (en) 2020-06-16
WO2012148967A2 (en) 2012-11-01
CN103620753B (zh) 2017-05-24
KR101729203B1 (ko) 2017-04-21
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EP2702607A2 (en) 2014-03-05
TW201308455A (zh) 2013-02-16

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