JP6009540B2 - レーザー光を用いた部材の分離方法 - Google Patents

レーザー光を用いた部材の分離方法 Download PDF

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Publication number
JP6009540B2
JP6009540B2 JP2014507023A JP2014507023A JP6009540B2 JP 6009540 B2 JP6009540 B2 JP 6009540B2 JP 2014507023 A JP2014507023 A JP 2014507023A JP 2014507023 A JP2014507023 A JP 2014507023A JP 6009540 B2 JP6009540 B2 JP 6009540B2
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Japan
Prior art keywords
laser light
laser beam
adhesive tape
adhesive layer
pressure
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Active
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JP2014507023A
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English (en)
Japanese (ja)
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JPWO2013145036A1 (ja
Inventor
山田 功作
功作 山田
博文 村上
博文 村上
藤田 和也
和也 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hayakawa Rubber Co Ltd
Original Assignee
Hayakawa Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hayakawa Rubber Co Ltd filed Critical Hayakawa Rubber Co Ltd
Publication of JPWO2013145036A1 publication Critical patent/JPWO2013145036A1/ja
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/57Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
    • B23K2103/172Multilayered materials wherein at least one of the layers is non-metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic material
    • B23K2103/42Plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
JP2014507023A 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法 Active JP6009540B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012081230 2012-03-30
JP2012081230 2012-03-30
PCT/JP2012/006283 WO2013145036A1 (ja) 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法

Publications (2)

Publication Number Publication Date
JPWO2013145036A1 JPWO2013145036A1 (ja) 2015-08-03
JP6009540B2 true JP6009540B2 (ja) 2016-10-19

Family

ID=49258406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014507023A Active JP6009540B2 (ja) 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法

Country Status (5)

Country Link
JP (1) JP6009540B2 (zh)
KR (1) KR20140142704A (zh)
CN (1) CN104204122A (zh)
TW (1) TWI464027B (zh)
WO (1) WO2013145036A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6352645B2 (ja) * 2014-02-13 2018-07-04 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
CN105964512A (zh) * 2016-04-26 2016-09-28 乐视控股(北京)有限公司 一种对触控面板进行返工的方法
CN106475680B (zh) * 2016-12-09 2018-12-07 深圳市吉祥云科技有限公司 一种采用激光拆解夹层内oca光学胶的方法
CN109087932A (zh) * 2018-06-26 2018-12-25 武汉华星光电半导体显示技术有限公司 柔性基板的剥离方法与显示面板
FR3094905B1 (fr) * 2019-04-12 2022-11-11 Psa Automobiles Sa Procédé de marquage de pièce pour guider le dépôt de matière lors d’un procédé d’assemblage
JP2023049529A (ja) * 2021-09-29 2023-04-10 日東電工株式会社 電子部品仮固定用粘着シートおよび電子部品の処理方法
JP2023049530A (ja) * 2021-09-29 2023-04-10 日東電工株式会社 電子部品仮固定用粘着シートおよび電子部品の処理方法
CN114458667A (zh) * 2022-01-29 2022-05-10 苏州富润泽激光科技有限公司 工件贴合方法及其电子产品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2282046A1 (en) * 1998-09-10 2000-03-10 Koji Terumoto Liquid crystal display device and method of fabricating thereof
JP2003167534A (ja) * 2001-09-21 2003-06-13 Seiko Epson Corp 電気光学装置及びその製造方法並びに電子機器
JP2003238910A (ja) * 2002-01-31 2003-08-27 Three M Innovative Properties Co 加熱剥離型熱硬化性粘着剤フィルム
JP2005002269A (ja) * 2003-06-13 2005-01-06 Three M Innovative Properties Co 粘着テープ
CN100399142C (zh) * 2004-01-21 2008-07-02 瀚宇彩晶股份有限公司 液晶显示面板及其制造方法
US7507312B2 (en) * 2005-08-23 2009-03-24 The Boeing Company Using laser shock loads to debond structures
JP2007204706A (ja) * 2006-02-06 2007-08-16 Osaka Industrial Promotion Organization レーザー光を用いた粘着シートの剥離方法
JP2008144116A (ja) * 2006-12-13 2008-06-26 Nitto Denko Corp 両面粘着シートおよび液晶表示装置
JP5743465B2 (ja) * 2010-09-16 2015-07-01 早川ゴム株式会社 レーザー光を用いた部材の分離方法

Also Published As

Publication number Publication date
CN104204122A (zh) 2014-12-10
JPWO2013145036A1 (ja) 2015-08-03
WO2013145036A1 (ja) 2013-10-03
TW201338899A (zh) 2013-10-01
TWI464027B (zh) 2014-12-11
KR20140142704A (ko) 2014-12-12

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