JP6009540B2 - レーザー光を用いた部材の分離方法 - Google Patents
レーザー光を用いた部材の分離方法 Download PDFInfo
- Publication number
- JP6009540B2 JP6009540B2 JP2014507023A JP2014507023A JP6009540B2 JP 6009540 B2 JP6009540 B2 JP 6009540B2 JP 2014507023 A JP2014507023 A JP 2014507023A JP 2014507023 A JP2014507023 A JP 2014507023A JP 6009540 B2 JP6009540 B2 JP 6009540B2
- Authority
- JP
- Japan
- Prior art keywords
- laser light
- laser beam
- adhesive tape
- adhesive layer
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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- 239000002390 adhesive tape Substances 0.000 claims description 70
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- 239000012790 adhesive layer Substances 0.000 claims description 48
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 238000000926 separation method Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 238000005187 foaming Methods 0.000 claims description 7
- 238000000354 decomposition reaction Methods 0.000 claims description 6
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- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 3
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- 238000004064 recycling Methods 0.000 description 9
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- 239000002585 base Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- -1 styrene ethylene butylene styrene Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUMBMVFBXHLACL-UHFFFAOYSA-N Melanin Chemical compound O=C1C(=O)C(C2=CNC3=C(C(C(=O)C4=C32)=O)C)=C2C4=CNC2=C1C XUMBMVFBXHLACL-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laser Beam Processing (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012081230 | 2012-03-30 | ||
JP2012081230 | 2012-03-30 | ||
PCT/JP2012/006283 WO2013145036A1 (ja) | 2012-03-30 | 2012-10-01 | レーザー光を用いた部材の分離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2013145036A1 JPWO2013145036A1 (ja) | 2015-08-03 |
JP6009540B2 true JP6009540B2 (ja) | 2016-10-19 |
Family
ID=49258406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014507023A Active JP6009540B2 (ja) | 2012-03-30 | 2012-10-01 | レーザー光を用いた部材の分離方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6009540B2 (zh) |
KR (1) | KR20140142704A (zh) |
CN (1) | CN104204122A (zh) |
TW (1) | TWI464027B (zh) |
WO (1) | WO2013145036A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6352645B2 (ja) * | 2014-02-13 | 2018-07-04 | 浜松ホトニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
CN105964512A (zh) * | 2016-04-26 | 2016-09-28 | 乐视控股(北京)有限公司 | 一种对触控面板进行返工的方法 |
CN106475680B (zh) * | 2016-12-09 | 2018-12-07 | 深圳市吉祥云科技有限公司 | 一种采用激光拆解夹层内oca光学胶的方法 |
CN109087932A (zh) * | 2018-06-26 | 2018-12-25 | 武汉华星光电半导体显示技术有限公司 | 柔性基板的剥离方法与显示面板 |
FR3094905B1 (fr) * | 2019-04-12 | 2022-11-11 | Psa Automobiles Sa | Procédé de marquage de pièce pour guider le dépôt de matière lors d’un procédé d’assemblage |
JP2023049529A (ja) * | 2021-09-29 | 2023-04-10 | 日東電工株式会社 | 電子部品仮固定用粘着シートおよび電子部品の処理方法 |
JP2023049530A (ja) * | 2021-09-29 | 2023-04-10 | 日東電工株式会社 | 電子部品仮固定用粘着シートおよび電子部品の処理方法 |
CN114458667A (zh) * | 2022-01-29 | 2022-05-10 | 苏州富润泽激光科技有限公司 | 工件贴合方法及其电子产品 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2282046A1 (en) * | 1998-09-10 | 2000-03-10 | Koji Terumoto | Liquid crystal display device and method of fabricating thereof |
JP2003167534A (ja) * | 2001-09-21 | 2003-06-13 | Seiko Epson Corp | 電気光学装置及びその製造方法並びに電子機器 |
JP2003238910A (ja) * | 2002-01-31 | 2003-08-27 | Three M Innovative Properties Co | 加熱剥離型熱硬化性粘着剤フィルム |
JP2005002269A (ja) * | 2003-06-13 | 2005-01-06 | Three M Innovative Properties Co | 粘着テープ |
CN100399142C (zh) * | 2004-01-21 | 2008-07-02 | 瀚宇彩晶股份有限公司 | 液晶显示面板及其制造方法 |
US7507312B2 (en) * | 2005-08-23 | 2009-03-24 | The Boeing Company | Using laser shock loads to debond structures |
JP2007204706A (ja) * | 2006-02-06 | 2007-08-16 | Osaka Industrial Promotion Organization | レーザー光を用いた粘着シートの剥離方法 |
JP2008144116A (ja) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | 両面粘着シートおよび液晶表示装置 |
JP5743465B2 (ja) * | 2010-09-16 | 2015-07-01 | 早川ゴム株式会社 | レーザー光を用いた部材の分離方法 |
-
2012
- 2012-10-01 CN CN201280071785.0A patent/CN104204122A/zh active Pending
- 2012-10-01 JP JP2014507023A patent/JP6009540B2/ja active Active
- 2012-10-01 WO PCT/JP2012/006283 patent/WO2013145036A1/ja active Application Filing
- 2012-10-01 KR KR1020147025862A patent/KR20140142704A/ko not_active Application Discontinuation
- 2012-10-05 TW TW101136793A patent/TWI464027B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN104204122A (zh) | 2014-12-10 |
JPWO2013145036A1 (ja) | 2015-08-03 |
WO2013145036A1 (ja) | 2013-10-03 |
TW201338899A (zh) | 2013-10-01 |
TWI464027B (zh) | 2014-12-11 |
KR20140142704A (ko) | 2014-12-12 |
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