JP6009540B2 - レーザー光を用いた部材の分離方法 - Google Patents

レーザー光を用いた部材の分離方法 Download PDF

Info

Publication number
JP6009540B2
JP6009540B2 JP2014507023A JP2014507023A JP6009540B2 JP 6009540 B2 JP6009540 B2 JP 6009540B2 JP 2014507023 A JP2014507023 A JP 2014507023A JP 2014507023 A JP2014507023 A JP 2014507023A JP 6009540 B2 JP6009540 B2 JP 6009540B2
Authority
JP
Japan
Prior art keywords
laser light
laser beam
adhesive tape
adhesive layer
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014507023A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2013145036A1 (ja
Inventor
山田　功作
功作 山田
博文 村上
博文 村上
藤田　和也
和也 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hayakawa Rubber Co Ltd
Original Assignee
Hayakawa Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hayakawa Rubber Co Ltd filed Critical Hayakawa Rubber Co Ltd
Publication of JPWO2013145036A1 publication Critical patent/JPWO2013145036A1/ja
Application granted granted Critical
Publication of JP6009540B2 publication Critical patent/JP6009540B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Adhesive Tapes (AREA)
JP2014507023A 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法 Active JP6009540B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012081230 2012-03-30
JP2012081230 2012-03-30
PCT/JP2012/006283 WO2013145036A1 (ja) 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法

Publications (2)

Publication Number Publication Date
JPWO2013145036A1 JPWO2013145036A1 (ja) 2015-08-03
JP6009540B2 true JP6009540B2 (ja) 2016-10-19

Family

ID=49258406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014507023A Active JP6009540B2 (ja) 2012-03-30 2012-10-01 レーザー光を用いた部材の分離方法

Country Status (5)

Country Link
JP (1) JP6009540B2 (zh)
KR (1) KR20140142704A (zh)
CN (1) CN104204122A (zh)
TW (1) TWI464027B (zh)
WO (1) WO2013145036A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6352645B2 (ja) * 2014-02-13 2018-07-04 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
CN105964512A (zh) * 2016-04-26 2016-09-28 乐视控股（北京）有限公司 一种对触控面板进行返工的方法
CN106475680B (zh) * 2016-12-09 2018-12-07 深圳市吉祥云科技有限公司 一种采用激光拆解夹层内oca光学胶的方法
CN109087932A (zh) * 2018-06-26 2018-12-25 武汉华星光电半导体显示技术有限公司 柔性基板的剥离方法与显示面板
FR3094905B1 (fr) * 2019-04-12 2022-11-11 Psa Automobiles Sa Procédé de marquage de pièce pour guider le dépôt de matière lors d’un procédé d’assemblage
JP2023049529A (ja) * 2021-09-29 2023-04-10 日東電工株式会社 電子部品仮固定用粘着シートおよび電子部品の処理方法
JP2023049530A (ja) * 2021-09-29 2023-04-10 日東電工株式会社 電子部品仮固定用粘着シートおよび電子部品の処理方法
CN114458667A (zh) * 2022-01-29 2022-05-10 苏州富润泽激光科技有限公司 工件贴合方法及其电子产品

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2282046A1 (en) * 1998-09-10 2000-03-10 Koji Terumoto Liquid crystal display device and method of fabricating thereof
JP2003167534A (ja) * 2001-09-21 2003-06-13 Seiko Epson Corp 電気光学装置及びその製造方法並びに電子機器
JP2003238910A (ja) * 2002-01-31 2003-08-27 Three M Innovative Properties Co 加熱剥離型熱硬化性粘着剤フィルム
JP2005002269A (ja) * 2003-06-13 2005-01-06 Three M Innovative Properties Co 粘着テープ
CN100399142C (zh) * 2004-01-21 2008-07-02 瀚宇彩晶股份有限公司 液晶显示面板及其制造方法
US7507312B2 (en) * 2005-08-23 2009-03-24 The Boeing Company Using laser shock loads to debond structures
JP2007204706A (ja) * 2006-02-06 2007-08-16 Osaka Industrial Promotion Organization レーザー光を用いた粘着シートの剥離方法
JP2008144116A (ja) * 2006-12-13 2008-06-26 Nitto Denko Corp 両面粘着シートおよび液晶表示装置
JP5743465B2 (ja) * 2010-09-16 2015-07-01 早川ゴム株式会社 レーザー光を用いた部材の分離方法

Also Published As

Publication number Publication date
CN104204122A (zh) 2014-12-10
JPWO2013145036A1 (ja) 2015-08-03
WO2013145036A1 (ja) 2013-10-03
TW201338899A (zh) 2013-10-01
TWI464027B (zh) 2014-12-11
KR20140142704A (ko) 2014-12-12

Similar Documents

Publication Publication Date Title
JP6009540B2 (ja) レーザー光を用いた部材の分離方法
JP5976503B2 (ja) レーザー接合用粘着テープ
JP3883652B2 (ja) 板状枠体付きｉｃキャリアとその製造方法
JP5342286B2 (ja) シート接合体の製造方法及びシート接合体
CN102161233A (zh) 使用激光的接合方法
JPWO2010137523A1 (ja) 再剥離性を有する粘着材
JP5070063B2 (ja) 液晶表示装置用表面保護板の製造方法および液晶表示装置の製造方法
JP6208497B2 (ja) 粘着テープを用いた接合方法
KR20180029172A (ko) 커버 패널 및 이를 포함하는 표시 장치
JPWO2014069542A1 (ja) 積層体および表示装置
JP5736331B2 (ja) レーザー光を用いた接合方法
US12114557B2 (en) Display assembly apparatus and methods for information handling systems
JP4934942B2 (ja) 剥離方法
JP2015060113A (ja) ホログラム積層体
JP2006039231A (ja) 光電気配線混載基板の製造方法
WO2018223435A1 (zh) 屏幕贴膜
JP6053253B2 (ja) レーザー光を用いた接合方法
JP2007127772A (ja) 表示装置
JP5608395B2 (ja) シート部材の接合方法及びシート接合体
JP2016064509A (ja) レーザー光を用いた接合方法及び剥離方法
JP6009318B2 (ja) レーザー光を用いた接合方法
JP2010125809A (ja) レーザーマーキング用積層体およびそれを用いたレーザーマーキング方法
JP2024083116A (ja) ラベル及びラベルの剥離方法
JP6161390B2 (ja) レーザー光を用いた接合方法
JP2016210034A (ja) フィルム複合体、これを含む表示装置及びその製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150707

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160808

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160830

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160914

R150 Certificate of patent or registration of utility model

Ref document number: 6009540

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250