JP6004941B2 - 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 - Google Patents

相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Download PDF

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Publication number
JP6004941B2
JP6004941B2 JP2012547231A JP2012547231A JP6004941B2 JP 6004941 B2 JP6004941 B2 JP 6004941B2 JP 2012547231 A JP2012547231 A JP 2012547231A JP 2012547231 A JP2012547231 A JP 2012547231A JP 6004941 B2 JP6004941 B2 JP 6004941B2
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Prior art keywords
polishing
elements
polishing pad
polymer
main surface
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JP2013516768A5 (OSRAM
JP2013516768A (ja
Inventor
ウィリアム ディー． ジョセフ，
ウィリアム ディー． ジョセフ，
ゲアリー エム． パームグレン，
ゲアリー エム． パームグレン，
スティーヴン シー． ローパー，
スティーヴン シー． ローパー，
クリストファー， エヌ． ローシュ，
クリストファー， エヌ． ローシュ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2013516768A5 publication Critical patent/JP2013516768A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2012547231A 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Active JP6004941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (3)

Publication Number Publication Date
JP2013516768A JP2013516768A (ja) 2013-05-13
JP2013516768A5 JP2013516768A5 (OSRAM) 2014-02-06
JP6004941B2 true JP6004941B2 (ja) 2016-10-12

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JP2012547231A Active JP6004941B2 (ja) 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法

Country Status (7)

Country Link
US (1) US9162340B2 (OSRAM)
JP (1) JP6004941B2 (OSRAM)
KR (1) KR20120125612A (OSRAM)
CN (1) CN102686362A (OSRAM)
SG (1) SG181678A1 (OSRAM)
TW (1) TWI552832B (OSRAM)
WO (1) WO2011082155A2 (OSRAM)

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Also Published As

Publication number Publication date
US9162340B2 (en) 2015-10-20
SG181678A1 (en) 2012-07-30
TWI552832B (zh) 2016-10-11
JP2013516768A (ja) 2013-05-13
CN102686362A (zh) 2012-09-19
WO2011082155A3 (en) 2011-11-17
US20120315830A1 (en) 2012-12-13
WO2011082155A2 (en) 2011-07-07
KR20120125612A (ko) 2012-11-16
TW201136710A (en) 2011-11-01

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