JP2013516768A5 - - Google Patents

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Publication number
JP2013516768A5
JP2013516768A5 JP2012547231A JP2012547231A JP2013516768A5 JP 2013516768 A5 JP2013516768 A5 JP 2013516768A5 JP 2012547231 A JP2012547231 A JP 2012547231A JP 2012547231 A JP2012547231 A JP 2012547231A JP 2013516768 A5 JP2013516768 A5 JP 2013516768A5
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JP
Japan
Prior art keywords
main surface
polishing
polishing pad
polymer phase
polymer
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JP2012547231A
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English (en)
Japanese (ja)
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JP6004941B2 (ja
JP2013516768A (ja
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Priority claimed from PCT/US2010/062204 external-priority patent/WO2011082155A2/en
Publication of JP2013516768A publication Critical patent/JP2013516768A/ja
Publication of JP2013516768A5 publication Critical patent/JP2013516768A5/ja
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Publication of JP6004941B2 publication Critical patent/JP6004941B2/ja
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JP2012547231A 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法 Active JP6004941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29117609P 2009-12-30 2009-12-30
US61/291,176 2009-12-30
PCT/US2010/062204 WO2011082155A2 (en) 2009-12-30 2010-12-28 Polishing pads including phase-separated polymer blend and method of making and using the same

Publications (3)

Publication Number Publication Date
JP2013516768A JP2013516768A (ja) 2013-05-13
JP2013516768A5 true JP2013516768A5 (OSRAM) 2014-02-06
JP6004941B2 JP6004941B2 (ja) 2016-10-12

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Application Number Title Priority Date Filing Date
JP2012547231A Active JP6004941B2 (ja) 2009-12-30 2010-12-28 相分離したポリマーブレンドを含む研磨パッド並びにその製造及び使用方法

Country Status (7)

Country Link
US (1) US9162340B2 (OSRAM)
JP (1) JP6004941B2 (OSRAM)
KR (1) KR20120125612A (OSRAM)
CN (1) CN102686362A (OSRAM)
SG (1) SG181678A1 (OSRAM)
TW (1) TWI552832B (OSRAM)
WO (1) WO2011082155A2 (OSRAM)

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US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
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CN110776724B (zh) * 2019-10-23 2022-02-25 青岛科技大学 一种功能性弹性发泡材料及其制备方法和应用
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
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