WO2009043058A3 - Cmp pad conditioners with mosaic abrasive segments and associated methods - Google Patents

Cmp pad conditioners with mosaic abrasive segments and associated methods Download PDF

Info

Publication number
WO2009043058A3
WO2009043058A3 PCT/US2008/078208 US2008078208W WO2009043058A3 WO 2009043058 A3 WO2009043058 A3 WO 2009043058A3 US 2008078208 W US2008078208 W US 2008078208W WO 2009043058 A3 WO2009043058 A3 WO 2009043058A3
Authority
WO
WIPO (PCT)
Prior art keywords
abrasive
cmp pad
abrasive segments
associated methods
pad conditioners
Prior art date
Application number
PCT/US2008/078208
Other languages
French (fr)
Other versions
WO2009043058A2 (en
Inventor
Chien-Min Sung
Michael Sung
Original Assignee
Chien-Min Sung
Michael Sung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/168,110 external-priority patent/US8398466B2/en
Application filed by Chien-Min Sung, Michael Sung filed Critical Chien-Min Sung
Priority to CN2008801184378A priority Critical patent/CN101878094A/en
Publication of WO2009043058A2 publication Critical patent/WO2009043058A2/en
Publication of WO2009043058A3 publication Critical patent/WO2009043058A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material, A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.
PCT/US2008/078208 2007-09-28 2008-09-29 Cmp pad conditioners with mosaic abrasive segments and associated methods WO2009043058A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801184378A CN101878094A (en) 2007-09-28 2008-09-29 CMP pad conditioners with mosaic abrasive segments and associated methods

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US97619807P 2007-09-28 2007-09-28
US60/976,198 2007-09-28
US98768707P 2007-11-13 2007-11-13
US60/987,687 2007-11-13
US98864307P 2007-11-16 2007-11-16
US60/988,643 2007-11-16
US99296607P 2007-12-06 2007-12-06
US60/992,966 2007-12-06
US12/168,110 US8398466B2 (en) 2006-11-16 2008-07-05 CMP pad conditioners with mosaic abrasive segments and associated methods
US12/168,110 2008-07-05

Publications (2)

Publication Number Publication Date
WO2009043058A2 WO2009043058A2 (en) 2009-04-02
WO2009043058A3 true WO2009043058A3 (en) 2009-10-15

Family

ID=40512135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/078208 WO2009043058A2 (en) 2007-09-28 2008-09-29 Cmp pad conditioners with mosaic abrasive segments and associated methods

Country Status (3)

Country Link
KR (1) KR20100087297A (en)
CN (2) CN104708539A (en)
WO (1) WO2009043058A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
KR101237740B1 (en) * 2010-11-29 2013-02-26 이화다이아몬드공업 주식회사 Method for Manufacturing a High-functional Pad Conditioner for Chemical Mechanical Planarization and High-functional Pad Conditioner produced thereby
TWI487019B (en) 2011-05-23 2015-06-01 Cmp pad dresser having leveled tips and associated methods
WO2014022453A1 (en) 2012-08-02 2014-02-06 3M Innovative Properties Company Abrasive element precursor with precisely shaped features and method of making thereof
KR102089383B1 (en) 2012-08-02 2020-03-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Abrasive articles with precisely shaped features and method of making thereof
CN104858787B (en) * 2015-06-18 2017-04-12 浙江工商大学 Grinding disc surface self-growing grinding mechanism
TWI613039B (en) * 2016-01-27 2018-02-01 周景星 Grinding apparatus and grinding method thereof
WO2018116122A1 (en) * 2016-12-21 2018-06-28 3M Innovative Properties Company Pad conditioner with spacer and wafer planarization system
CN107263342B (en) * 2017-06-07 2019-04-16 广州捷骏电子科技有限公司 Printed wiring board grinding brush wheel resin abrasive disc and its manufacturing method
CN109866108A (en) * 2017-12-01 2019-06-11 咏巨科技有限公司 Trimming device for polishing cushion and its manufacturing method and polishing pad finishing method
CN108161721B (en) * 2018-01-10 2023-10-24 江苏韦尔博新材料科技有限公司 Multi-layer brazing diamond grinding head
CN108312080A (en) * 2018-02-09 2018-07-24 江苏中博钻石科技有限公司 A kind of medal polish disk and its manufacturing method
CN110871407A (en) * 2018-09-04 2020-03-10 宋健民 Polishing pad dresser and method for chemical mechanical planarization
CN111673627A (en) * 2020-04-28 2020-09-18 泉州众志新材料科技有限公司 Dry-wet dual-purpose abrasive disc material and preparation method thereof
KR102466715B1 (en) * 2020-10-13 2022-11-14 김영환 Cmp pad conditioner and manufacturing method thereof
CN112536711A (en) * 2020-11-19 2021-03-23 西安奕斯伟硅片技术有限公司 Grinding structure and grinding device
CN113172553A (en) * 2021-05-25 2021-07-27 宁波江丰电子材料股份有限公司 Chemical mechanical grinding polishing pad dressing device and preparation method thereof
CN113478392A (en) * 2021-08-03 2021-10-08 北京烁科精微电子装备有限公司 Diamond collator and grinding machine table with same
CN113618648B (en) * 2021-08-18 2022-08-16 全立传感科技(南京)有限公司 Preparation method of regular fine diamond particle grinding tool

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003071718A (en) * 2001-08-30 2003-03-12 Nippon Steel Corp Cmp conditioner, method for arranging hard abrasive grain used in cmp conditioner and method for manufacturing cmp conditioner
US20030054746A1 (en) * 2001-08-13 2003-03-20 Josef Nussbaumer Grinding wheel
US6905571B2 (en) * 2002-10-28 2005-06-14 Elpida Memory, Inc. Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5243790A (en) * 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US20040072510A1 (en) * 2000-12-21 2004-04-15 Toshiya Kinoshita Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
JP4216025B2 (en) * 2002-09-09 2009-01-28 株式会社リード Dresser for polishing cloth and dressing method for polishing cloth using the same
CN1532026A (en) * 2003-03-19 2004-09-29 铨科光电材料股份有限公司 Grinding pad finishing device and its producing method
US7367872B2 (en) * 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
CN100491077C (en) * 2003-05-13 2009-05-27 中国砂轮企业股份有限公司 Trimming disc with grinding grains capable of being regulated individually and its making process
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030054746A1 (en) * 2001-08-13 2003-03-20 Josef Nussbaumer Grinding wheel
JP2003071718A (en) * 2001-08-30 2003-03-12 Nippon Steel Corp Cmp conditioner, method for arranging hard abrasive grain used in cmp conditioner and method for manufacturing cmp conditioner
US6905571B2 (en) * 2002-10-28 2005-06-14 Elpida Memory, Inc. Wafer polishing method and wafer polishing apparatus in semiconductor fabrication equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods

Also Published As

Publication number Publication date
CN104708539A (en) 2015-06-17
WO2009043058A2 (en) 2009-04-02
KR20100087297A (en) 2010-08-04
CN101878094A (en) 2010-11-03

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