CN104708539A - CMP pad conditioners with mosaic abrasive segments and associated methods - Google Patents
CMP pad conditioners with mosaic abrasive segments and associated methods Download PDFInfo
- Publication number
- CN104708539A CN104708539A CN201510020545.3A CN201510020545A CN104708539A CN 104708539 A CN104708539 A CN 104708539A CN 201510020545 A CN201510020545 A CN 201510020545A CN 104708539 A CN104708539 A CN 104708539A
- Authority
- CN
- China
- Prior art keywords
- liner
- grinding
- trimmer
- grinding block
- cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material, A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.
Description
The application is the divisional application that the name submitted on September 29th, 2008 is called the Chinese patent application 200880118437.8 of " CMP liner trimmer and the correlation technique with mosaic abrasive block ".
Require priority
This application claims the sequence number submitted on September 28th, 2007 is 60/976, the sequence number that the U.S. Provisional Patent Application of 198 and on July 5th, 2008 submit to is 12/168, the priority of the U.S. Non-provisional Patent application of 110, above-mentioned patent application is incorporated herein by reference.
Technical field
The present invention relates generally to the CMP liner trimmer for eliminating material (as making level and smooth, polishing, finishing etc.) from CMP liner.In addition, the present invention relates to chemistry, physics and materialogy field.
Background technology
Current semi-conductor industry takes over 1,000,000,000 dollars manufacturing on the silicon wafer must with very smooth and smooth surface every year.Known technology for the manufacture of smooth and smooth surface silicon wafer has a lot.In these technology, the most frequently used comprising is called the process of chemically mechanical polishing (CMP), and this CMP comprises use polishing pad and slurry (slurry).The most important thing is to reach high performance level in every respect in all CMP process, the uniformity of such as polished wafer, the flatness of IC circuit, for the production of elimination factor, the economic consumption life of CMP etc.
Summary of the invention
According to an embodiment, the invention provides a kind of CMP liner trimmer, it comprises multiple grinding block.Each grinding block can comprise compact and be attached to the grinding layer on compact.Grinding layer can comprise superhard abrasive material.Also provide the substrate of liner trimmer and each of described multiple grinding block can be permanently affixed in the substrate of liner trimmer with an orientation, it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner.
According to another aspect of the present invention, provide a kind of CMP liner trimmer, it comprises multiple grinding block.Each grinding block can comprise compact, organic adhesion layer and grinding layer, and grinding layer is attached on compact by this organic adhesion layer.Grinding layer can comprise superhard abrasive material.Also provide the substrate of liner trimmer, each of described multiple grinding block can be permanently affixed in the substrate of liner trimmer with an orientation, and it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner.
According to another aspect of the present invention, provide a kind of CMP liner trimmer, it comprises multiple grinding block.Each grinding block can be comprised compact and is attached to the grinding layer on compact by brazing alloy.Grinding layer can comprise superhard abrasive material.Also provide the substrate of liner trimmer, each of described multiple grinding block can be permanently affixed in the substrate of liner trimmer with an orientation, and it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner.
According to another aspect of the present invention, provide a kind of CMP liner trimmer, it comprises multiple grinding block.Each grinding block can comprise compact and be attached to the grinding layer on compact.Grinding layer can comprise ultra-hard blade.Also provide the substrate of liner trimmer, each of described multiple grinding block can be permanently affixed in the substrate of liner trimmer with an orientation, and it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner.
According to another aspect of the present invention, provide a kind of CMP liner trimmer, it comprises multiple grinding block.Each grinding block can comprise compact and be attached to the grinding layer on compact.Grinding layer can comprise cutting face, and this cutting face becomes an angle of 90 degrees with the machined surface being applied to CMP liner or is less than an angle of 90 degrees.Also provide the substrate of liner trimmer, each of described multiple grinding block can be permanently affixed in the substrate of liner trimmer with an orientation, and it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner.
According to another aspect of the present invention, provide a kind of method forming CMP liner trimmer, it comprises: obtain at least one grinding block.Described grinding block comprises compact and is attached to the grinding layer on compact.Grinding layer comprises superhard abrasive material.Described method can comprise that a face being oriented in the substrate of liner trimmer arranges at least one grinding block described, and it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner; And at least one grinding block described is permanently affixed in this liner trimmer substrate.
Therefore, summarize, instead of expand, each feature of the present invention, describe in detail can be understood it below better, and so that the contribution that the present invention may be better understood to this area.According to detailed description of the present invention is in conjunction with appended claims below, other features of the present invention will become very clear, maybe can learn other features of the present invention by putting into practice the present invention.
Accompanying drawing explanation
Fig. 1 is the diagrammatic top view of exemplary insert trimmer according to an embodiment of the invention;
Figure 1A is the magnification fluoroscopy schematic diagram of the exemplary abrasive block that can be used in the liner trimmer of Fig. 1;
Figure 1B is the end schematic diagram of the grinding block of Figure 1A, shows an exemplary abrasive profile;
Fig. 1 C is the end schematic diagram of the grinding block of Figure 1A, shows another exemplary abrasive profile;
Fig. 2 is the diagrammatic top view of another liner trimmer according to an embodiment of the invention;
Fig. 2 A is the magnification fluoroscopy schematic diagram of the grinding block of Fig. 2 liner trimmer;
Fig. 3 A is the schematic side view of the grinding block with cutting face, shows and eliminates material from a part of CMP liner;
Fig. 3 B is the schematic side view of the grinding block with different structure cutting face, shows and eliminates material from a part of CMP liner;
Fig. 3 C is the schematic side view of the grinding block with different structure cutting face, shows and eliminates material from a part of CMP liner;
Fig. 4 A and 4B is according to an embodiment of the invention with the perspective illustration of another grinding block of blade construction formation; And
Fig. 5 has the diagrammatic side view with a part for the CMP liner trimmer of a series of grinding blocks of different level setting each other.
Should be appreciated that above-mentioned accompanying drawing only for illustrating object to understand the present invention further.In addition, accompanying drawing is not drawn in proportion, therefore size, granular size and other aspects can and normally clear to make to illustrate by what exaggerate.Such as, the grinding layer in some accompanying drawings is illustrated as and comprises many abrasive grains; But many specific embodiments disclosed herein do not need to comprise abrasive grains.Therefore, should be appreciated that can depart from and the concrete size that may depart from accompanying drawing and aspect to produce liner trimmer of the present invention.
Detailed description of the invention
Before the present invention is disclosed and described, should be appreciated that and the present invention is not limited thereto place disclosed concrete structure, procedure of processing or material, but be intended to cover its equivalent that those of ordinary skill in the related art can recognize.Should also be appreciated that term used herein is only not intended to limited for describing the object of specific embodiment.
Have to be noted that as used in this description and appended claims, " one " of singulative, " one ", " this " comprise plural reference object except explanation in addition clear in non-textual.Therefore, such as, " grinding block " mentioned can comprise one or more than one this kind of grinding block.
Definition
In description of the present invention and claim, below term use according to the definition of stating below.
The all sizing grids herein related to refer to the sizing grid of AM General, except as otherwise noted.In addition, sizing grid is understood to the average meshes size of given collecting granules usually, because each particle actual change can exceed little size distribution in concrete " sizing grid ".
As used herein, term " substantially " refers to completely or close to the motion of degree completely, characteristic, character, state, structure, part (item) or result.As any example, when two or more than two objects be called as each other interval " substantially " fixed range time, should be appreciated that two or more than two spaced completely constant distances of object, or it is spaced close to constant distance, this is close to constant distance, and ordinary people can not find its difference.In some cases, depart from accurate permissibility definitely completely and can depend on concrete text.But, usually says close to referring to that there is identical whole result completely, as complete in absolute and entirety the result obtained.
When for negative connotation, the use of " substantially " is applicable equally, its refer to completely or close to not moving completely, characteristic, character, state, structure, part or result.As any example, chamber " does not have " impurity to refer to completely without any impurity substantially, or almost close to not having impurity completely, its effect with do not have completely impurity phase with.In other words, the chamber of " substantially not having " impurity is actual can comprise fraction impurity, as long as it is immeasurablel on the result that affects in chamber.
As used herein, liner trimmer " substantially " represents that a part supports the liner trimmer of grinding-material, and thereon can fixed abrasive materials and/or carry the compact of grinding-material.Substrate useful in the present invention can be enough to provide liner trimmer can support the various shapes of grinding-material, thickness or material for its expection object mode with a kind of.Substrate can be solid material, when adding the dusty material or flexible material that can become solid man-hour.The general base material of example comprises when being not limited to metal, metal alloy, pottery, relatively hard polymer or other organic materials, glass and its mixture.In addition, substrate can comprise the material contributing to grinding-material being attached to substrate, includes but not limited to brazing alloy material, sintering aid etc.
As used herein, " compact " refers to the structure of the liner trimmer substrate being similar to above-mentioned restriction in many aspects.Grinding layer, with grinding layer, is attached in the substrate of liner trimmer and generally realizes by being attached to by compact in the substrate of liner trimmer by the compact used in the present invention.Notice discussed herein compact is attached to suprabasil various mode and grinding layer is attached to the various modes of compact extremely important.Should be appreciated that all these different adhesion mechanisms can use herein convertibly.That is, if method compact being attached to substrate discussed herein, then discussed adherence method also may be used for grinding layer to be attached to compact.But, for discussed arbitrary concrete CMP liner trimmer, should be appreciated that method grinding layer being attached to compact can be different from method compact being attached to the substrate of liner trimmer, also can be identical with method compact being attached to the substrate of liner trimmer.
As used herein, " geometry " refers to the shape that can describe with the mathematical term that should be readily appreciated that and recognize.The shape with " geometry " qualification of example includes but not limited to cubic shaped, polyhedron-shaped (comprising regular polygon shape), triangle (comprising equilateral triangle, isosceles triangle and 3-D triangle), pyramid, spherical, rectangle, fan-shaped, wedge shape, octagonal, circle etc.
Used herein, " vapour deposition " refers to the process of deposition of material in substrate by gas phase.Vapor deposition processes can comprise any process, such as, but not limited to chemical vapour deposition (CVD) (CVD) and physical vapour deposition (PVD) (PVD).Those skilled in the art can perform the various changes of often kind of CVD method.The CVD method of example comprises hot-wire chemical gas-phase deposition, radio frequency vapour deposition (rf-CVD), laser chemical vapor deposition (LVCD), metal-organic chemical vapor deposition equipment (MOCVD), sputtering, thermal evaporation physical vapour deposition (PVD), ionized metal physical vapour deposition (IMPVD), electro beam physics vapour deposition (EBPVD), reactant physical vapor deposition etc.
As used herein, " grinding profile " should be understood to mean limited by grinding-material shape, structure or interval, it can be used for eliminating material from CMP liner.The grinding profile of example includes but not limited to rectangular shape, trapezoidal shape (tapering rectangular shapes), wedge-type shape, wedge-type shape, " zigzag " profile etc. by cutting.In certain embodiments, when the viewed in plan be directed by CMP liner during eliminating material from CMP liner, the grinding profile presented by grinding block of the present invention will be clearly.
As used herein, " lapped face or grinding point " can be used to refer to CMP gasket contacts and eliminate the surface of the grinding block of material, edge, face, point or summit from CMP liner.Usual theory, lapped face or grinding point refer to when grinding block and CMP liner contact with each other, and grinding block contacts the part of CMP liner at first.
As used herein, " superhard " can be used to refer to mole hardness and be about 8 or be greater than any crystal of 8, the mixture of polycrystalline material or this kind of material.In some respects, mole hardness can be about 9.5 or be greater than 9.5.This type of material includes but not limited to diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), polycrystal cubic boron nitride (PcBN), corundum and sapphire, and other superhard materials known to those skilled in the art.Superhard material can be incorporated to the present invention in a variety of manners, comprises particle, sand grains, film, layer, sheet, block etc.In some cases, superhard material of the present invention is polycrystalline superhard material form, such as PCD and PcBN material.
As used herein, " organic material " refers to the mixture of semisolid or solid composite or organic compound.Such as, " organic material layer " and " organic material matrix " can use convertibly, refers to semisolid or the composite amorphous shape mixture of solid of organic compound, comprises resin, polymer, rubber etc.Preferred organic material is the polymer or copolymer that are formed by the polymerization of one or more than one monomer.In some cases, this organic material can be adhesive.
As used herein, the process of soldering is intended to refer to produce chemical bond between the carbon atom and brazing material of superabrasive grain/material.In addition, " chemical bond " refers to covalent bond, such as carbon bond or roc key, instead of mechanical force or faint interior atom attraction.Therefore, when " soldering " is for connecting superabrasive grain, genuine chemical bond is formed.But when " soldering " is used for connection metal and metallic bond, this term is used for the metallurgical key of more traditional sense.Therefore, super grinding block is soldered to tool body and necessarily there is not carbide former.
As used herein, " particle " and " sand grains " can interchangeably use.
As used herein, " grinding layer " describe can from CMP liner eliminate material (as cut, polishing, scraping) various structures.Grinding layer can comprise thereon or form the block of multiple cutting point, ansa or platform in it.It should be noted that this cutting point, ansa or platform can be the multiple protrusion or convex-concave that comprise in block.In addition, grinding layer can comprise multiple single abrasive grains, and it or can only form cutting point, ansa or a platform thereon in it.Grinding layer also can comprise composite block, such as PCD sheet, block or base, itself or comprise separately grinding layer or jointly comprise grinding layer.
As used herein, " metal " comprises the metal of arbitrary type, metal alloy or its mixture, and specifically includes but not limited to steel, iron and stainless steel.
As used herein, multiple part, structural detail, composite component and/or material conveniently can appear at same list.But these lists should be interpreted as being identified as separately single and unique unit as each unit (member) in list.Therefore, only when contrary instruction, individual unit is not had should to be interpreted as with any other unit in same list in this list practically identical according to their statement in identical group.
Concentration, quantity, granular size, volume and other numerical datas can be expressed with range format or state herein.Should be appreciated that and use this range format to be only for convenience and simplicity, therefore should be interpreted flexibly not only comprise limited range know describe numerical value, and comprise the whole single numerical value or subrange that comprise within the scope of this, described by clear as each numerical value and subrange.
As an explanation, digital scope " about 1 micron to about 5 microns " should be interpreted as not only comprising about 1 micron to about 5 microns know the value described, and the single value comprised in indicating range and subrange.Therefore, the single value be included in this digital scope can be such as 2,3,4 etc., and subrange can be such as 1-3,2-4 and 3-5 etc.Same principle can be applied to the scope only describing a numerical value.In addition, the feature that the range wide no matter described still describes, all should apply this and explain.
Invention
The present invention generally provides a kind of liner trimmer and correlation technique, it can be used for finishing (as making smooth, polishing, finishing) or affect CMP liner to eliminate material from CMP liner, to provide perfect, smooth and/or flat surfaces for liner.Liner trimmer of the present invention can be advantageously used in, such as, repair CMP liner, and this CMP liner is used for polishing, finishing or otherwise affects silicon wafer.
In the embodiments of the invention illustrated illustrated in Fig. 1, provide a kind of CMP liner trimmer 10.This liner trimmer can comprise at least one grinding block 12a, 12b, 12c and 12d (difference sometimes discussed herein and multiple grinding block are collectively referred to as " 12x ").As the preferably understanding of the example according to Figure 1A, the grinding layer 16 that each grinding block 12 can comprise compact 14 and be attached on compact.This grinding layer 16 can comprise superhard abrasive material: in the exemplary embodiment of Figure 1A, and superhard abrasive material comprises many superhard particles 18.A kind of liner trimmer substrate 20 (Fig. 1) is also provided.The substrate of liner trimmer can change according to the application of design liner trimmer, but generally comprise the face can fixing grinding block thereon, be used for allow liner trimmer grinding, dig, cut or other modes eliminate material from CMP liner (not shown).
This at least one grinding block 12x can be permanently affixed on liner trimmer 20 with an orientation, and it can eliminate material by grinding layer from CMP liner along with the relative movement of liner trimmer and CMP liner.Such as, in the embodiment shown in fig. 1, grinding block 12x is arranged along the edge radial direction of almost circular liner trimmer substrate.Have been found that this setting is very suitable for eliminating material (simultaneously " finishing " liner) with the relative rotation between liner from CMP liner by the substrate of liner trimmer.
The present invention has multiple advantage than conventional apparatus.This advantage is that the method that can make grinding layer 16 to be attached to compact 14 is attached to the suprabasil method customization of liner trimmer independent of by compact or multiple compact.Such as, because various adherence method can comprising very high temperature and/or pressure, very harsh environmental condition, maybe performing different adherence methods when attempting use liner trimmer that is large or complex surface region, only labour-intensive, so wieldy compact can improve the cost of attaching process, efficiency and integrality.In addition, when performing discontinuous, relatively little heap, can more easily perform smooth (leveling) of the assembly of the grinding layer on each compact.After grinding layer is attached to each grinding block individually, through the face of liner trimmer substrate 20, multiple grinding blocks of generation similarly can more easily be located, smooth, interval, orientation etc.
In addition, by obtaining multiple grinding block 12x, each have grinding layer 16 attached to it, and the abrasive pattern through liner trimmer substrate 20 can be designed as and makes various finishing program optimization.Such as, the interval between contiguous grinding block can be carefully chosen as contributing to or controlling around the flowing with the various liquid (as slurry) through grinding block better, to improve effect and the efficiency that process eliminated by material.In addition, as shown in Figure 1, the compact with different grinding profile (as different size, shape, grinding activity etc.) may be used for single substrate, to make the grinding profile of liner trimmer as a whole by customization.
As will be discussed in further detail, not only the grinding profile of each grinding block can by customization, and the type of grinding block or composition also can change to another block from a block 12x.Such as, block 12c can comprise multiple independent abrasive grit 18, and it is attached on compact 14 by organic adhesive material layer 16.Block 12a can comprise basic continous sheet PCD briquetting (compact), and it is attached to compact by different adhesion mechanism.In addition, the relative altitude of grinding block or absolute altitude can according to arbitrary concrete liner trimmer changes.Such as, the grinding block 12a of Fig. 1 can be raised slightly higher than or lower than the grinding block 12c of Fig. 1.
Various compacts 14 that are discussed herein and display can have different materials to be formed, and include but not limited to metal material (such as aluminium, copper, steel, metal alloy etc.), ceramic material, glass, polymer, composite etc.In general, almost any material that can adhere to grinding block 12x is all qualified.
In certain embodiments, the material of grinding block can elect the material that can provide outstanding result during the process that grinding layer is attached to it as.As discussed above, grinding layer can be attached on compact in every way, comprises epoxy bond method (if any switch method), solder bonding metal, sintering, plating etc.Compact material can be selected based on the attaching process expected.Such as, the compact partly or entirely formed by nickel or stainless steel can be utilized in some processes comprising soldering and/or sintering.In addition, pottery or metal material also may be used in organic adherence method.
Different embodiments of the invention use different methods grinding layer 16 being attached to compact 14.In one embodiment, organic material layer can be deposited on compact, and one or more than one abrasive grains, fragment, block etc. can be fixed on compact by organic material layer.The suitable organic materials of example includes but not limited to amino resins, acrylate, alkyd resins, mylar, polyamide, polyimide resin, polyurethane resin, phenolic resins, phenolic aldehyde/emulsion resin, epoxy resin, isocyanate resin, isocyanurate resin, polyorganosiloxane resin, reactive vinyl resins, polyvinyl resin, acrylic resin, polystyrene resin, phenoxy resin, perylene resin, polysulfone resin, acrylonitrile-butadiene-styrene resin, acrylic resin, polycarbonate resin, polyimide resin, with its mixture.
The method being called as " inverse foundry goods " can be used for accurately controllably that grinding-material is directed and to be attached on compact (and by compact directed and be attached to the substrate of liner trimmer).The method can comprise use " mask " material first by superabrasive materials in the form, as multiple super abrasive grit, is fixed to substrate.Then, the particulate fraction given prominence to from mask material can use method discussed herein to be attached to the substrate of liner trimmer, and after the process (or during this process), mask material can be removed.Have been found that these can by the quantity of abrasive grains provide quantity in abrasive grains or contact point 10% or more against casting techniques.
Suitable inverse method for casting can find in the different patent of the present inventor and patent application, comprises the U.S. Patent application that the sequence number submitted on December 6th, 2007 is 60/992,966; The sequence number submitted on May 16th, 2007 is the U.S. Patent application of 11/804,221; The sequence number submitted on May 22nd, 2007 is the U.S. Patent application of 11/805,549; Each of above-mentioned application is incorporated herein by reference.When being attached to by grinding block of the present invention in the substrate of liner trimmer and when being attached on compact by grinding layer of the present invention, these technology can be used.This technology allows the lateral arrangement very accurately controlling grinding block or grinding layer, and very accurately controls the relative altitude of grinding block or grinding layer.
When utilizing organic key material layer, the method for solidification organic material layer can be the various processes known to those skilled in the art, and this process makes organic material undergo phase transition, and makes it be converted at least one hardened condition from least one soft condition.Organic material can be solidified by mode below, but be not limited to, by organic material being exposed in the energy of heat, electromagnetic radiation (such as ultraviolet, infrared ray and microwave), particle bombardment (such as electron beam), organic catalysis, inorganic catalysis, form, or the curing known to any those skilled in the art.
In one aspect of the invention, organic material layer can be thermoplastic material.Thermoplastic material can reversibly be hardened respectively by cooling and heating and be softened.In yet another aspect, organic material layer can be thermosets.Thermosets can not reversibly be hardened and be softened as thermoplastic material.In other words, once be cured, even if need, this process is also irreversible.
Operable organic material includes but not limited in embodiments of the present invention: amino resins (comprises alkylated urea formaldehyde resin, melamine resin, alkylation benzoguanamin formaldehyde resin), acrylate (comprises vinyl, epoxy acrylic, and acroleic acid polyurethane, acrylic polyester, acrylate acrylic acid powder, acrylic polyether, vinethene, acrylic acid oil, silicon Acrylote and relevant methacrylate), alkyd resins (such as urethane-alkyd resin), mylar, polyamide, polyimide resin, active amino Ethyl formate resin, polyurethane resin, phenolic resins (such as resole resin and novolac resin), phenolic aldehyde/emulsion resin, epoxy resin (such as bisphenol epoxy), isocyanate resin, isocyanurate resin, polyorganosiloxane resin (comprising alkoxy silane resin), reactive vinyl resins, trade mark is called Bakelite
tMresin (comprising polyvinyl resin, acrylic resin, epoxy resin, phenolic resins, polystyrene resin, phenoxy resin, perylene resin, polysulfone resin, ethylene copolymer resin, acrylonitrile-butadiene-styrene resin (ABS), acrylic resin and vinylite), acrylic resin, polycarbonate resin and its mixture and composition.In one aspect of the invention, organic material can be epoxy resin.In yet another aspect, organic material can be polyimide resin.In yet another aspect, organic material can be polyurethane resin.In yet another aspect, organic material can be polyurethane resin.
Many additives can be included in organic material to help it to use.Such as, extra crosslinking agent and filler can be used to improve the curing characteristics of organic material layer.In addition, solvent can be used to change the characteristic of organic material under its uncured state.In addition, reinforcing material can be arranged on and solidify in organic material layer at least partially.This reinforcing material may be used for the intensity strengthening organic material, and therefore improves the reservation of single grinding block further.In one aspect, reinforcing material can comprise pottery, metal or its combination.The pottery of example comprises aluminium oxide, aluminium carbide, silica, carborundum, zirconia, zirconium carbide and its mixture.
In addition, in one aspect, coupling agent or organo-metallic compound can be applied to often kind of superabrasive materials in the form on the surface to help superabrasive materials in the form to be retained in organic material by chemical bond.Multiple organic compound and organo-metallic compound are known to those skilled in the art and can be used.Organic metal coupling agent can form chemical bond between superabrasive materials in the form and organic material matrix, therefore strengthens superabrasive materials in the form reservation thereon.In this way, organic metal coupling agent can be used as bridge to form key between organic material matrix and superabrasive materials in the form surface.In one aspect of the invention, organic metal coupling agent can be titanate, zirconates, silane or its mixture.
The silane being suitable for use in concrete non-restrictive example of the present invention comprises: 3-glycidoxy-propyltrimethoxy silane (can obtain, as Z-6040 from Dow Corning company); γ-methacrylic acid propyl trimethoxy silicane (can obtain, as A-174 from Union Carbide Chemicals Company); β-(3,4-epoxycyclohexyl) ethyl trimethoxy silane, gamma-aminopropyl-triethoxy-silane, N-(β-aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane (can obtain from companies such as UnionCarbide, Shin-etsu Kagaku Kogyo K.K).
The titanate coupling agents of concrete non-restrictive example comprises: isopropyl triisostearoyltitanate, two (cumyl phenylate) metatitanic acid glycolic (di (cumylphenylate) oxyacetate titanate), 4 aminobenzene sulfonyl dodecyl benzene sul fonyl ethylene titanate, two [phosphorous acid two (tridecyl ester)] metatitanic acid four monooctyl ester, isopropyl tri(N-ethylamino-ethylamino)titanate (can obtain from KenrichPetrochemicals company), new Alkyl titanate, such as LICA-01, LICA-09, LICA-28, LICA-44 and LICA-97 etc. (it also can obtain from Kenrich company).
The aluminum coupling agent of concrete non-restrictive example comprises: acetyl alkoxyl diisopropyl aluminium oxide (acetoalkoxy aluminum diisopropylate) etc. (it can obtain from Ajinomoto K.K. Corp.).
The zirconates coupling agent of concrete non-restrictive example comprises: new alkylzirconate, LZ-01, LZ-09, LZ-12, LZ-38, LZ-44, LZ-97 etc., (it all can obtain from KenrichPetrochemicals company).Other known organic metal coupling agent, as the compound based on thiolate, may be used for the present invention, and are within the scope of the present invention.
The amount of organic metal coupling agent used can depend on the surf zone of coupling agent and superabrasive materials in the form.Often, account for organic material layer weight 0.05% to 10% can be enough.
Solder bonding metal also can be used for grinding layer 16 to be attached to compact 14.Solder bonding metal technology is known by field.Such as, in manufacture diamond saw blade, this process can comprise mixing diamond particles (as 40/50 U.S., net saw sand) and suitable metal support matrices (connection thing) powder (cobalt powders as 1.5 microns of sizes).Then, this mixture is pressed into mould to form suitable shape (as saw block).Then, the instrument being somebody's turn to do " green " form can by the temperature sintering united at 700-1200 degree Celsius to be formed thereon the monomer being provided with multiple abrasive grains.Finally, association can be attached to (as passed through soldering) tool body; Such as circular saw blade, to form final product.Other examples many that this technology uses are known to those skilled in the art.
Various sintering method also can be used for grinding layer 16 to be attached on compact 14.Suitable sintering method will be easy to be read those of ordinary skill in the art of the present invention understand.
Grinding layer 16 is also attached on compact 14 by known plating and/or electrodeposition process.As a kind of during electrodeposition process and before be suitable for grinding-material location and the example (not shown) of method that retains, can use the mould comprising insulating materials, this insulating materials can effectively prevent the buildup of material of electro-deposition on mo(u)lding surface.Abrasive grains can be able to be maintained on the mo(u)lding surface of mould during electro-deposition.Similarly, the material of the workspace accumulation electro-deposition of and liner trimmer substrate most advanced and sophisticated at particle can be prevented.This type of technology is be described in the U.S. Patent application of 11/292,938 at the sequence number that on December 2nd, 2005 submits to, and it is incorporated herein by reference.
One or more than one hole can extend through insulating materials to allow electrolyte circulation through the surface of way liner trimmer substrate from mold exterior region, so that impact is used for the electro-deposition of material abrasive grains being fixed on the substrate of liner trimmer.This circulation is favourable, because it needs to keep ion (not shown) concentration enough in electrolyte in electro-deposition position usually.Also can utilize other known technologies, should be appreciated that the above-mentioned example provided is only the one in many appropriate technologies.
Compact can be attached to the substrate of liner trimmer in every way similarly.According to the material forming compact, different modes compact being fixed on liner trimmer can be utilized.Suitable adherence method includes but not limited to combination, soldering, welding etc.
The geometry of grinding block 12 can change.In figs. 1 a and 1b in the illustrated embodiment illustrated, grinding block comprises the compact 14 of usual rectangle, and compact 14 has the grinding-material layer 16 (it can comprise abrasive grains 18) in portion attached to it.The size of compact can change.In one aspect of the invention, the size of block can be suitable for realizing diamond grit being uniformly distributed around circular array.Each piece can comprise nearly 1,000 diamond grit, and the large Small Distance of diamond can from 3X to 10X.Less block can be distributed to force down period load-sharing better.
As will be understood, in the embodiment of Figure 1B, the side of grinding-material layer 16 part extends to (or " extending downwardly into ") compact 14.In the embodiment of Fig. 1 C, the degree of grinding layer extends to (or " extending downwardly into ") side wants little many.The modular nature of native system allows to be attached on compact 14 by grinding layer 16 very neatly.Prepare because compact can separate with the substrate of liner trimmer, so multiple advantages that can realize are when when grinding layer is applied to compact, do not need the size, shape, quality, material etc. of considering the final accompanying liner trimmer substrate of compact.
In one aspect of the invention, although without the need to requirement like this, multiple grinding block is each can comprise basically identical geometry.In the embodiment illustrated illustrated in Fig. 2, each of described multiple grinding block 12e presents the super grinding profile (if needs, its can by brachymemma) of basic wedge-type shape.Grinding layer 16e can be attached to compact 14e by different way, and great majority are as discussed above.
Multiple grinding block 12x around liner trimmer substrate 20 radial distribution, and can comprise substantially unified spacing between each piece.In addition, the longitudinal axis of each of described multiple grinding block can align along the radius of liner trimmer substrate.The grinding block 12e of the embodiment shown in Fig. 2 and 2A can be configured to alternately to align or change is alignd through the face of liner trimmer substrate 20: as shown, and the conical section of block can be alignd towards or away from the center of liner trimmer substrate in the mode replacing rank.
The each of grinding block arranged around trimmer substrate can have substantially identical size, shape, grinding composition, height etc. each other.In other embodiments, mutually between size, shape, grinding composition, height etc. on purpose can change the optimized design flexibility realizing each embody rule.In addition, each previously mentioned characteristic can change between different blocks: as replace block can comprise PCD grinding block, fragment or lath, contiguous block comprises abrasive grains.
The grinding block 12x that liner trimmer substrate 20 keeps can be modified by arranging grinding block, so that the mechanical stress impinged upon on any single grinding block is minimized.By reducing the mechanical stress impinged upon on each grinding block, it can be easier to the correct position being retained in substrate, especially for the task of complexity.Make the STRESS VARIATION between block minimum can by make block each other uniform intervals, by smooth for the topmost of each piece to uniform height (relative to the substrate of liner trimmer), come around the face radially aligned block etc. of liner trimmer substrate.Other height different and spacing technology can be utilized to obtain the effect of hope.
In one embodiment of the invention, the spacing of grinding block can be suitable for the contact changing each piece of contact portion (engage as block and eliminate the part of material from CMP liner).Usually, block each other interval is far away, and the contact between block and CMP liner is larger.Therefore, in some cases, the highdensity grinding block through liner trimmer basal surface can provide the grinding interface of more wishing the substrate of liner trimmer and CMP liner.In other application, more low-density grinding block is favourable.No matter in which kind of situation, the invention provides very large design flexibility to obtain optimization grinding profile.
By forming grinding block on the individual unit with restriction geometry, grinding block being set in point-device mode and becoming very easy.Because the geometry limited can copy to another grinding block from a grinding block quite accurately, location and the stress clashed into thereon of each grinding block of therefore above-mentioned discussion quite as one man can be completed through the substrate of liner trimmer.Such as, use the abrasive grit of prior art, the overall shape of each of multiple sand grains and size can change from a sand grains significantly to another sand grains, make accurately to replace sand grains and have been difficult to.Advantage feature of the present invention can fully solve this problem.
Have been found that the diamond liner trimmer of industrial application comprises about 10,000 diamond grit usually.Due to the distortion of substrate, especially when manufacturing disk by high temperature process (as soldering), and the change of sand grains size distribution and diamond orientations, cut tip and be arranged on differing heights.When it is crushed on polishing underlay, only there is the outstanding diamond of about 1% can joint liner.It is darker that this can increase that diamond stress cuts on liner, and diamond can destroy the wafer expensive with destructive scraping.
By utilizing the present invention, the difference in height between particle can be significantly reduced.In one aspect of the invention, block is arranged on planar metal (as stainless steel) mould, and this metal die has the spacing of design in retainer plate.Well-mixed epoxy resin and curing agent can be introduced into retainer plate to fill and to cover all pieces.Diamond grit on mould can be flowed into by the infiltration of epoxy resin and be protected.(heat or do not heat) after hardening, retainer plate and mould can be removed.Thus Buddha's warrior attendant stone is embedded into epoxy resin-base firmly.Due to by smooth mold formation diamond, so the tip height difference of the highest diamond grit is minimized.
What therefore formed inlays disk and can be forced into the polishing underlay with identical dead load.Test result display joint rate is more than 50%.In other words, the number of crystal of working can be increased manyfold thus the life-span of disk can be significantly longer.In addition, owing to avoiding deep cuts, polishing underlay can use the longer life-span.In addition, recessed groove can be made into more shallow and thinner.Slurry is detained and grinding is shared is all modified.The CMP cost (CoC) consumed and owning cost (CoC) are all reduced.Polished wafer is more unified and without scraping, so chip yield is higher.
Forward now Fig. 3 A-5 to, illustrate various different embodiment of the present invention.In Fig. 3 A-3C, shown embodiment contributes to solving the problem (being shown by the cross sectional view at example and 24 places) with the plastic deformation of CMP liner.This embodiment reduces downward force required between liner trimmer and CMP liner.Therefore, CMP liner has the refacing more smooth and more smooth than the surface using conventional method to obtain.
Trimmer shown in Fig. 3 A-3C comprises grinding layer 12f (only its cross section is shown).Grinding layer can comprise cutting face 26, and this cutting face becomes an angle of 90 degrees with the machined surface being applied to CMP liner or is less than an angle of 90 degrees (as relative to the movement-sometimes referred to as tangent top rake of cutting face away from machined surface).The face 26 of grinding layer 12f can be oriented so that the relative movement of liner trimmer and CMP liner 24 (directions along in Fig. 3 A shown in 23) eliminates material neatly from the CMP liner with cutting face, thus finishing CMP liner.
By being arranged in cutting face 26 become an angle of 90 degrees with the machined surface being applied to liner 24 or be less than an angle of 90 degrees, finishing work can scrape off one deck gasket material from liner neatly.The result surface being applied to liner can be used safely in not damage expensive silicon wafer in CMP process.This liner trimmer may be used for scraping off very shallow, thin layer of material from liner, and on liner, leave clean, smooth and smooth machined surface.This technology may be used for eliminating the thin glaze layer formed in CMP pad surfaces.
Fig. 3 A and 3B shows cutting face 26, and this cutting face is oriented to and becomes about an angle of 90 degrees α with the machined surface being applied to CMP liner
1, the cutting face 26a of Fig. 3 C is oriented as and becomes to be less than an angle of 90 degrees α with the machined surface being applied to CMP liner
2, be similar to about 60 degree.Cutting face can be oriented as different angles, and in one embodiment, changes at about 45 degree with the angle of the machined surface being applied to CMP liner to about an angle of 90 degrees.Have been found that reducing this angle can produce sharper cutting interface between cutting element and liner.
Grinding layer 12f, 12f ' of Fig. 3 A-3C and 12f " can be formed elongated cutting blade (along its corresponding compact, not showing in these figures).These sheets kept burning day and night aobvious is longer than wide, is similar to the blade of traditional kitchen knife.In this aspect of the invention, this sheet may be used for the material cutting, swipe or cut relatively wide bar from PCD liner (Fig. 3 A-3C 24).As shown in the example in Fig. 4 A and 4B, the grinding layer shown in 12f, 12f ' place's example can comprise the cutting edge (as shown in Figure 4 A) of basic continous, or on this sheet, form a series of incisor (as shown in Figure 4 B).This type of incisor formed on said sheets in this example is be described in detail in the U.S. Provisional Patent Application of 60/987,687 at the sequence number that on November 13rd, 2007 submits to, and it is incorporated herein by reference.
These embodiments illustrated illustrated in comprising in the figure in angled cutting face are each comprises a cutting face with respective angles.But in certain embodiments, should be appreciated that the cutting face that can utilize Relative vertical (as 90 degree), unless when being attached to substrate, the grinding block forming cutting face is thereon " inclination ".In other words, the relative grinding block in cutting face does not have angle, but makes grinding block have angle thus make cutting face have angle.In like fashion, the angled cutting face of tool can be provided and on grinding block, (or interior) reference angle need not formed.
Also it is contemplated that for extra and change grinding block of the present invention.Such as, the US Patent No that use body February 17 in 2006 is submitted to is imagined.11/357, the various cutting element/grinding blocks described in detail in 713, it is incorporated herein by reference.
In addition, the grinding layer that compact is formed can be completed by various technology, various technology includes but not limited to be similar to the gas phase deposition technology summarized of U.S. Patent application that the sequence number submitted on August 29th, 2006 is 11/512,755, and above-mentioned patent application is incorporated herein by reference.In addition, grinding block can utilize ceramic component (as compact and/or grinding layer or the two all), the formation such as electroplating technology.
In the embodiment illustrated illustrated in Fig. 5, provide a series of grinding layer 14g, 14g ' and 14g ", its each comprise with the cutting of different level orientation most advanced and sophisticated.In this aspect of the invention, guide the absolute altitude of grinding block (grinding layer 14g formed its part) usually than hangover grinding layer 14g ' and 14g " absolute altitude relative high, otherwise after guide plate passes through, trailing can not contact remaining gasket material.There is grinding layer 14g, 14g ' and 14g " grinding block can be formed by different way; and be formed different shapes, size and structure; such as; the sequence number submitted to as on November 16th, 2007 is 60/988; described in detail in the U.S. Provisional Patent Application of 643, above-mentioned temporary patent application by reference entirety is herein incorporated.This embodiment can utilize stepwise cutting element wittingly to realize the grinding effect of wishing.
Example represents the distinct methods manufacturing liner trimmer of the present invention below.This kind of example only illustrates, and does not limit thus the present invention that can realize.
Example
Example 1
Liner trimmer is formed by first arranging diamond grit (as 50/60 net) on the stainless steel flat plate mold (also can utilize convex or Waveform mould a little) with adhesion layer (as acrylate).Rubber materials is used to single diamond grit press-in adhesion layer, and the tip of sand grains is flattened by flat mould simultaneously.Then, the mixture of epoxy resin and curing agent is poured on the sand grains (volume loop (containment ring) outside mould can retaining ring epoxy resins) being projected into adhesion layer outside.After hardening, mould is removed and adhesion layer is peeled off.Remaining ODD comprises from the outstanding diamond grit of cured epoxy resin substrate.The back of epoxy resin can by machining and disk is attached on stainless steel (as 316) plate, and this corrosion resistant plate has fixing hole in order to be arranged on CMP machine.
Example 2
Liner trimmer arranges sawtooth PCD sheet by radial direction and is formed.As in exemplified earlier, the tooth of PCD sheet uses mould to be flattened, and this mould can be positioned at bottom or the top of liner trimmer.Then epoxy resin such as exemplified earlier is cast.When mould is positioned at top, this sheet is slightly pressed into the slit of substrate, and this slit is by epoxy resin or silicone seal.
Example 3
Discussed above is the married Combination Design of embodiment with example 1 and example 2.The many of this design balance example 1 cut stock-removing efficiencies that are most advanced and sophisticated and example 2.In this example 3, less organic abrasive block is formed by using fiber-reinforced polymer, and this fiber-reinforced polymer is generally hard than epoxy resin.Then, this organic piece liner trimmer substrate radial direction being centered around the sheet inserting example 2 is therebetween arranged.The cutting tip of this sheet is flattened so that higher than the tip of organic abrasive block about 20 microns.By this way, the penetration depth of control strip cutting teeth, the second effect of organic cutting teeth is simultaneously that finishing liner plays the effect removing glaze, and by liner grooving.
Should be appreciated that above-mentioned setting is only the application schematically illustrating principle of the present invention.Many amendments and replacement arrange and can be designed by those skilled in the art and not depart from thought of the present invention and scope, and any appended claims object covers this type of amendment and arranges.Therefore, although by above-mentioned combination, the present invention has been thought that the most realistic and preferred embodiment of the present invention is concrete at present and has described in detail, but the general technical staff to this area is apparent in many amendments, it includes but not limited to, the change of size, material, shape, form, function and mode of operation, can assemble and uses and do not depart from the principle and concept stated herein.
Claims (10)
1. manufacture a method for CMP liner trimmer, it comprises:
Multiple grinding block being provided, wherein manufacturing each grinding block by grinding layer being attached to compact; With
Utilize the described grinding layer that is attached on the face of liner trimmer substrate, what be permanently fixed in described multiple grinding block is each.
2. method according to claim 1, wherein said grinding layer is made up of a series of cutting teeth.
3. method according to claim 1, wherein said grinding layer is made up of continuous cutting limit.
4. method according to claim 3, wherein said continuous cutting limit is elongated cutting blade.
5. method according to claim 4, each described grinding block in wherein said multiple grinding block is by a manufacture technics, and this technique is made up of following steps:
In the flat mould with layer of adhesive, radial direction arranges elongated cutting blade;
Described elongated cutting blade is pressed into described adhesive, simultaneously described smooth by described flat mould;
Epoxy resin and curing agent are poured on the outside of described adhesive;
Solidify described epoxy resin; With
Described mould is removed from described grinding block.
6. method according to claim 4, the machined surface that wherein said elongated cutting blade is applied to relative to described CMP liner trimmer becomes an angle of 90 degrees or is less than an angle of 90 degrees.
7. method according to claim 4, the machined surface that wherein said elongated cutting blade is applied to relative to described CMP liner trimmer is oriented as different angles.
8. method according to claim 7, the machined surface that wherein said angle is applied to relative to described CMP liner trimmer from about 45 degree to about 90 degree of changes.
9. method according to claim 1, wherein said grinding layer is flattened when being attached to described grinding block, and described grinding block is relative to each other flattened when they are attached on the face of described liner trimmer substrate.
10. method according to claim 1, wherein said grinding layer is made up of multiple single abrasive grains.
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97619807P | 2007-09-28 | 2007-09-28 | |
| US60/976,198 | 2007-09-28 | ||
| US98768707P | 2007-11-13 | 2007-11-13 | |
| US60/987,687 | 2007-11-13 | ||
| US98864307P | 2007-11-16 | 2007-11-16 | |
| US60/988,643 | 2007-11-16 | ||
| US99296607P | 2007-12-06 | 2007-12-06 | |
| US60/992,966 | 2007-12-06 | ||
| US12/168,110 | 2008-07-05 | ||
| US12/168,110 US8398466B2 (en) | 2006-11-16 | 2008-07-05 | CMP pad conditioners with mosaic abrasive segments and associated methods |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801184378A Division CN101878094A (en) | 2007-09-28 | 2008-09-29 | CMP pad conditioners with mosaic abrasive segments and associated methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104708539A true CN104708539A (en) | 2015-06-17 |
Family
ID=40512135
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801184378A Pending CN101878094A (en) | 2007-09-28 | 2008-09-29 | CMP pad conditioners with mosaic abrasive segments and associated methods |
| CN201510020545.3A Pending CN104708539A (en) | 2007-09-28 | 2008-09-29 | CMP pad conditioners with mosaic abrasive segments and associated methods |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801184378A Pending CN101878094A (en) | 2007-09-28 | 2008-09-29 | CMP pad conditioners with mosaic abrasive segments and associated methods |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20100087297A (en) |
| CN (2) | CN101878094A (en) |
| WO (1) | WO2009043058A2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104858787A (en) * | 2015-06-18 | 2015-08-26 | 浙江工商大学 | Grinding disc surface self-growing grinding mechanism |
| CN108161721A (en) * | 2018-01-10 | 2018-06-15 | 江苏韦尔博新材料科技有限公司 | A kind of novel multi-layer is brazed diamond grinding head |
| CN109866108A (en) * | 2017-12-01 | 2019-06-11 | 咏巨科技有限公司 | Trimming device for polishing cushion and its manufacturing method and polishing pad finishing method |
| CN110087809A (en) * | 2016-12-21 | 2019-08-02 | 3M创新有限公司 | Pad conditioner and wafer planarization system with gasket |
| TWI839864B (en) * | 2021-09-29 | 2024-04-21 | 美商恩特葛瑞斯股份有限公司 | Chemical mechanical planarization pad conditioner assembly |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US20110275288A1 (en) * | 2010-05-10 | 2011-11-10 | Chien-Min Sung | Cmp pad dressers with hybridized conditioning and related methods |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| KR101237740B1 (en) * | 2010-11-29 | 2013-02-26 | 이화다이아몬드공업 주식회사 | Method for Manufacturing a High-functional Pad Conditioner for Chemical Mechanical Planarization and High-functional Pad Conditioner produced thereby |
| CN104736299A (en) | 2012-08-02 | 2015-06-24 | 3M创新有限公司 | Abrasive articles with precisely shaped features and method of making thereof |
| EP2879837B1 (en) | 2012-08-02 | 2018-09-19 | 3M Innovative Properties Company | Abrasive element precursor with precisely shaped features and method of making thereof |
| TWI613039B (en) * | 2016-01-27 | 2018-02-01 | 周景星 | Grinding apparatus and grinding method thereof |
| CN107263342B (en) * | 2017-06-07 | 2019-04-16 | 广州捷骏电子科技有限公司 | Printed wiring board grinding brush wheel resin abrasive disc and its manufacturing method |
| CN108312080A (en) * | 2018-02-09 | 2018-07-24 | 江苏中博钻石科技有限公司 | A kind of medal polish disk and its manufacturing method |
| CN110871407A (en) * | 2018-09-04 | 2020-03-10 | 宋健民 | Polishing pad dresser and method for chemical mechanical planarization |
| CN111673627A (en) * | 2020-04-28 | 2020-09-18 | 泉州众志新材料科技有限公司 | Dry-wet dual-purpose abrasive disc material and preparation method thereof |
| KR102466715B1 (en) * | 2020-10-13 | 2022-11-14 | 김영환 | Cmp pad conditioner and manufacturing method thereof |
| CN112536711A (en) * | 2020-11-19 | 2021-03-23 | 西安奕斯伟硅片技术有限公司 | Grinding structure and grinding device |
| CN113172553A (en) * | 2021-05-25 | 2021-07-27 | 宁波江丰电子材料股份有限公司 | Chemical mechanical grinding polishing pad dressing device and preparation method thereof |
| CN113478392A (en) * | 2021-08-03 | 2021-10-08 | 北京烁科精微电子装备有限公司 | Diamond collator and grinding machine table with same |
| CN113618648B (en) * | 2021-08-18 | 2022-08-16 | 全立传感科技(南京)有限公司 | Preparation method of regular fine diamond particle grinding tool |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243790A (en) * | 1992-06-25 | 1993-09-14 | Abrasifs Vega, Inc. | Abrasive member |
| CN1197543A (en) * | 1995-09-22 | 1998-10-28 | 美国3M公司 | Method of modifying an exposed surface of semiconductor wafer |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| CN1482959A (en) * | 2000-12-21 | 2004-03-17 | �ձ�������ʽ���� | CMP Conditioner, method for arranging rigid grains used for CMP conditioner, and method for manufacturing CMP conditioner |
| CN1494984A (en) * | 2002-09-09 | 2004-05-12 | ������������ʽ���� | Sander for polishing cloth and polishing cloth sanding method using said sander |
| CN1532026A (en) * | 2003-03-19 | 2004-09-29 | 铨科光电材料股份有限公司 | Grinding pad finishing device and its producing method |
| US20040203325A1 (en) * | 2003-04-08 | 2004-10-14 | Applied Materials, Inc. | Conditioner disk for use in chemical mechanical polishing |
| CN1548271A (en) * | 2003-05-13 | 2004-11-24 | 中国砂轮企业股份有限公司 | Trimming disc with grinding grains capable of being regulated individually and its making process |
| US20060079160A1 (en) * | 2004-10-12 | 2006-04-13 | Applied Materials, Inc. | Polishing pad conditioner with shaped abrasive patterns and channels |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071718A (en) * | 2001-08-30 | 2003-03-12 | Nippon Steel Corp | Cmp conditioner, method for arranging hard abrasive grain used in cmp conditioner and method for manufacturing cmp conditioner |
| DE10139762A1 (en) * | 2001-08-13 | 2003-02-27 | Hilti Ag | grinding wheel |
| JP2004142083A (en) * | 2002-10-28 | 2004-05-20 | Elpida Memory Inc | Wafer polishing device and wafer polishing method |
-
2008
- 2008-09-29 WO PCT/US2008/078208 patent/WO2009043058A2/en active Application Filing
- 2008-09-29 KR KR1020107009287A patent/KR20100087297A/en not_active Application Discontinuation
- 2008-09-29 CN CN2008801184378A patent/CN101878094A/en active Pending
- 2008-09-29 CN CN201510020545.3A patent/CN104708539A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243790A (en) * | 1992-06-25 | 1993-09-14 | Abrasifs Vega, Inc. | Abrasive member |
| CN1197543A (en) * | 1995-09-22 | 1998-10-28 | 美国3M公司 | Method of modifying an exposed surface of semiconductor wafer |
| US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
| CN1482959A (en) * | 2000-12-21 | 2004-03-17 | �ձ�������ʽ���� | CMP Conditioner, method for arranging rigid grains used for CMP conditioner, and method for manufacturing CMP conditioner |
| CN1494984A (en) * | 2002-09-09 | 2004-05-12 | ������������ʽ���� | Sander for polishing cloth and polishing cloth sanding method using said sander |
| CN1532026A (en) * | 2003-03-19 | 2004-09-29 | 铨科光电材料股份有限公司 | Grinding pad finishing device and its producing method |
| US20040203325A1 (en) * | 2003-04-08 | 2004-10-14 | Applied Materials, Inc. | Conditioner disk for use in chemical mechanical polishing |
| CN1548271A (en) * | 2003-05-13 | 2004-11-24 | 中国砂轮企业股份有限公司 | Trimming disc with grinding grains capable of being regulated individually and its making process |
| US20060079160A1 (en) * | 2004-10-12 | 2006-04-13 | Applied Materials, Inc. | Polishing pad conditioner with shaped abrasive patterns and channels |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104858787A (en) * | 2015-06-18 | 2015-08-26 | 浙江工商大学 | Grinding disc surface self-growing grinding mechanism |
| CN104858787B (en) * | 2015-06-18 | 2017-04-12 | 浙江工商大学 | Grinding disc surface self-growing grinding mechanism |
| CN110087809A (en) * | 2016-12-21 | 2019-08-02 | 3M创新有限公司 | Pad conditioner and wafer planarization system with gasket |
| CN110087809B (en) * | 2016-12-21 | 2020-12-01 | 3M创新有限公司 | Pad conditioner with pad and wafer planarization system |
| CN109866108A (en) * | 2017-12-01 | 2019-06-11 | 咏巨科技有限公司 | Trimming device for polishing cushion and its manufacturing method and polishing pad finishing method |
| CN108161721A (en) * | 2018-01-10 | 2018-06-15 | 江苏韦尔博新材料科技有限公司 | A kind of novel multi-layer is brazed diamond grinding head |
| CN108161721B (en) * | 2018-01-10 | 2023-10-24 | 江苏韦尔博新材料科技有限公司 | Multi-layer brazing diamond grinding head |
| TWI839864B (en) * | 2021-09-29 | 2024-04-21 | 美商恩特葛瑞斯股份有限公司 | Chemical mechanical planarization pad conditioner assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009043058A3 (en) | 2009-10-15 |
| WO2009043058A2 (en) | 2009-04-02 |
| KR20100087297A (en) | 2010-08-04 |
| CN101878094A (en) | 2010-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104708539A (en) | CMP pad conditioners with mosaic abrasive segments and associated methods | |
| US8398466B2 (en) | CMP pad conditioners with mosaic abrasive segments and associated methods | |
| CN101722475B (en) | CMP pad dressers with hybridized abrasive surface and related methods | |
| US8393934B2 (en) | CMP pad dressers with hybridized abrasive surface and related methods | |
| CN101528414B (en) | Methods of bonding superabrasive particles in an organic matrix and super abrasive particle tool | |
| US8622787B2 (en) | CMP pad dressers with hybridized abrasive surface and related methods | |
| CN103329253B (en) | There is the CMP pad dresser at planarization tip | |
| US20180222009A1 (en) | Cmp pad dresser having leveled tips and associated methods | |
| CN101903131B (en) | CMP pad dressers | |
| US20080292869A1 (en) | Methods of bonding superabrasive particles in an organic matrix | |
| CN101856806A (en) | Improved superabrasive tool and correlation technique thereof with superabrasive grain of finishing | |
| CN102240973A (en) | CMP pad dressers with hybridized conditioning and related methods | |
| US8920214B2 (en) | Dual dressing system for CMP pads and associated methods | |
| US9724802B2 (en) | CMP pad dressers having leveled tips and associated methods | |
| US20170232576A1 (en) | Cmp pad conditioners with mosaic abrasive segments and associated methods | |
| US20150017884A1 (en) | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods | |
| US20140120807A1 (en) | Cmp pad conditioners with mosaic abrasive segments and associated methods |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150617 |
|
| WD01 | Invention patent application deemed withdrawn after publication |