JP5997235B2 - 複合砥粒とその製造方法と研磨方法と研磨装置 - Google Patents
複合砥粒とその製造方法と研磨方法と研磨装置 Download PDFInfo
- Publication number
- JP5997235B2 JP5997235B2 JP2014238783A JP2014238783A JP5997235B2 JP 5997235 B2 JP5997235 B2 JP 5997235B2 JP 2014238783 A JP2014238783 A JP 2014238783A JP 2014238783 A JP2014238783 A JP 2014238783A JP 5997235 B2 JP5997235 B2 JP 5997235B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- polishing
- composite
- polished
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014238783A JP5997235B2 (ja) | 2014-11-26 | 2014-11-26 | 複合砥粒とその製造方法と研磨方法と研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014238783A JP5997235B2 (ja) | 2014-11-26 | 2014-11-26 | 複合砥粒とその製造方法と研磨方法と研磨装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014021392 Division | 2014-02-06 | 2014-02-06 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015147922A JP2015147922A (ja) | 2015-08-20 |
| JP2015147922A5 JP2015147922A5 (cg-RX-API-DMAC7.html) | 2016-01-14 |
| JP5997235B2 true JP5997235B2 (ja) | 2016-09-28 |
Family
ID=53891551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014238783A Active JP5997235B2 (ja) | 2014-11-26 | 2014-11-26 | 複合砥粒とその製造方法と研磨方法と研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5997235B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6460090B2 (ja) * | 2014-02-27 | 2019-01-30 | 堺化学工業株式会社 | 複合金属酸化物研磨材料の製造方法及び複合金属酸化物研磨材料 |
| JP6458554B2 (ja) * | 2015-02-26 | 2019-01-30 | 堺化学工業株式会社 | 複合金属酸化物研磨材料の製造方法及び複合金属酸化物研磨材料 |
| JP6916634B2 (ja) * | 2017-02-28 | 2021-08-11 | アサヒ化成工業株式会社 | 研磨用砥粒 |
| CN110400742B (zh) * | 2019-07-29 | 2020-07-28 | 北京大唐智创科技有限公司 | 一种5g通信关键射频芯片材料 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2039998A1 (en) * | 1990-10-09 | 1992-04-10 | Donald C. Zipperian | Mechanochemical polishing abrasive |
| JPH04176556A (ja) * | 1990-11-13 | 1992-06-24 | Daido Steel Co Ltd | 磁気研摩方法、磁気研摩用砥粒およびその製造方法 |
| JPH11263968A (ja) * | 1998-03-19 | 1999-09-28 | Nec Kansai Ltd | 研磨用スラリ及び研磨方法 |
| JP2000265160A (ja) * | 1999-03-12 | 2000-09-26 | Sumitomo Osaka Cement Co Ltd | 高速鏡面研磨用研磨材 |
| JP4345746B2 (ja) * | 1999-11-16 | 2009-10-14 | 株式会社デンソー | メカノケミカル研磨装置 |
| JP3563017B2 (ja) * | 2000-07-19 | 2004-09-08 | ロデール・ニッタ株式会社 | 研磨組成物、研磨組成物の製造方法及びポリシング方法 |
| JP2003113370A (ja) * | 2001-07-30 | 2003-04-18 | Toshiba Corp | 化学的機械的研磨用スラリー、半導体装置の製造方法、半導体装置の製造装置、及び化学的機械的研磨用スラリーの取り扱い方法 |
| JP2005081485A (ja) * | 2003-09-08 | 2005-03-31 | Tube Systems:Kk | 高温メカノケミカル研磨方法と装置 |
| CN101821353A (zh) * | 2007-10-05 | 2010-09-01 | 圣戈本陶瓷及塑料股份有限公司 | 用复合浆料抛光蓝宝石 |
| JP5384037B2 (ja) * | 2008-06-11 | 2014-01-08 | 山口精研工業株式会社 | サファイア基板用研磨液組成物、及びサファイア基板の研磨方法 |
| JP2013099831A (ja) * | 2011-11-09 | 2013-05-23 | Femutekku:Kk | 砥石 |
| JP2013111725A (ja) * | 2011-11-30 | 2013-06-10 | Admatechs Co Ltd | 研磨材およびその製造方法 |
| JP5860776B2 (ja) * | 2012-07-04 | 2016-02-16 | 株式会社ノリタケカンパニーリミテド | 研磨材の製造方法およびその研磨材の比表面積の調整方法 |
-
2014
- 2014-11-26 JP JP2014238783A patent/JP5997235B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015147922A (ja) | 2015-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102441869B1 (ko) | 연마용 연마입자와 그 제조 방법과 연마 방법과 연마 장치와 슬러리 | |
| TW565488B (en) | Fixed abrasive articles | |
| JP5997235B2 (ja) | 複合砥粒とその製造方法と研磨方法と研磨装置 | |
| CN1832829A (zh) | 三维固定的研磨件的原位激活 | |
| EP3120379A1 (en) | Abrasive pad and glass substrate abrading method | |
| WO2015118927A1 (ja) | 研磨用砥粒とその製造方法と研磨方法と研磨装置とスラリー | |
| EP2035190A1 (en) | Compressible abrasive article | |
| CN108161774A (zh) | 研磨垫及其的制作方法 | |
| KR20170039221A (ko) | 폴리싱 용액 및 그의 사용 방법 | |
| CN115181498B (zh) | 一种用于kdp晶体的抛光液及高效研磨抛光工艺 | |
| TW201542788A (zh) | 硏磨劑組合物及磁碟基板之硏磨法 | |
| Liu et al. | Effect of graphene additions on polishing of silicon carbide wafer with functional PU/silica particles in CMP slurry | |
| CN112139859A (zh) | 一种无水抛光kdp晶体的方法 | |
| JP6731701B2 (ja) | 研磨用砥粒とその製造方法と研磨方法と研磨装置とスラリー | |
| CN104981324B (zh) | 单晶SiC基板的表面加工方法、其制造方法和单晶SiC基板的表面加工用磨削板 | |
| JP6054341B2 (ja) | 研磨用砥粒とその製造方法と研磨方法と研磨部材とスラリー | |
| JP2018141057A (ja) | 研磨用砥粒 | |
| JP6792554B2 (ja) | 研磨砥粒、研磨スラリーおよび硬脆材の研磨方法、ならびに硬脆材の製造方法 | |
| JP4849590B2 (ja) | 研磨工具及びその製造方法 | |
| JP2001093866A (ja) | 酸化物単結晶ウェーハ加工用研磨用組成物及び酸化物単結晶ウェーハの研磨方法 | |
| JP2008221353A (ja) | 研磨具及びその製造方法 | |
| JP2016082127A (ja) | 研磨工具 | |
| Moon et al. | Removal mechanisms of glass and sapphire materials by slurry free lapping | |
| JP2003117806A (ja) | 多結晶セラミックスの鏡面研磨方法 | |
| JP2005349542A (ja) | 砥石およびそれの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151119 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20151119 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160610 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160617 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160706 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160816 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160825 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5997235 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |