JP5983662B2 - 電子材料用エポキシ樹脂組成物およびその硬化物 - Google Patents

電子材料用エポキシ樹脂組成物およびその硬化物 Download PDF

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JP5983662B2
JP5983662B2 JP2014040373A JP2014040373A JP5983662B2 JP 5983662 B2 JP5983662 B2 JP 5983662B2 JP 2014040373 A JP2014040373 A JP 2014040373A JP 2014040373 A JP2014040373 A JP 2014040373A JP 5983662 B2 JP5983662 B2 JP 5983662B2
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epoxy resin
resin composition
electronic materials
electronic
phenol
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JP2014196472A (ja
JP2014196472A5 (enExample
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泰代 葭本
泰代 葭本
森永　邦裕
邦裕 森永
木下　宏司
宏司 木下
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DIC Corp
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DIC Corp
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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2014040373A 2013-03-06 2014-03-03 電子材料用エポキシ樹脂組成物およびその硬化物 Active JP5983662B2 (ja)

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JP2014040373A JP5983662B2 (ja) 2013-03-06 2014-03-03 電子材料用エポキシ樹脂組成物およびその硬化物

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JP2013043991 2013-03-06
JP2013043991 2013-03-06
JP2014040373A JP5983662B2 (ja) 2013-03-06 2014-03-03 電子材料用エポキシ樹脂組成物およびその硬化物

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JP2014196472A JP2014196472A (ja) 2014-10-16
JP2014196472A5 JP2014196472A5 (enExample) 2015-01-22
JP5983662B2 true JP5983662B2 (ja) 2016-09-06

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Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
WO2017150587A1 (ja) * 2016-03-02 2017-09-08 Jnc株式会社 低熱膨張部材用組成物、低熱膨張部材、電子機器、低熱膨張部材の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0582675A (ja) * 1991-07-11 1993-04-02 Nitto Denko Corp 半導体装置
TW575631B (en) * 2001-05-23 2004-02-11 Agi Corp Photosensitive resin composition containing hetero atoms
JP5387872B2 (ja) * 2006-07-31 2014-01-15 Ｄｉｃ株式会社 エポキシ樹脂組成物及びその硬化物
WO2014050789A1 (ja) * 2012-09-28 2014-04-03 Dic株式会社 エポキシ化合物、その製造方法、エポキシ樹脂組成物およびその硬化物

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