JP5970268B2 - プラズマ処理装置および処理方法 - Google Patents

プラズマ処理装置および処理方法 Download PDF

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Publication number
JP5970268B2
JP5970268B2 JP2012152005A JP2012152005A JP5970268B2 JP 5970268 B2 JP5970268 B2 JP 5970268B2 JP 2012152005 A JP2012152005 A JP 2012152005A JP 2012152005 A JP2012152005 A JP 2012152005A JP 5970268 B2 JP5970268 B2 JP 5970268B2
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Japan
Prior art keywords
wafer
plasma
ring
sample
shaped member
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JP2012152005A
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English (en)
Japanese (ja)
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JP2014017292A5 (enExample
JP2014017292A (ja
Inventor
安井　尚輝
尚輝 安井
紀彦 池田
紀彦 池田
荒巻　徹
徹 荒巻
西森　康博
康博 西森
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Filing date
Publication date
Application filed by Hitachi High Technologies Corp filed Critical Hitachi High Technologies Corp
Priority to JP2012152005A priority Critical patent/JP5970268B2/ja
Priority to KR1020120081226A priority patent/KR101343967B1/ko
Priority to TW101128230A priority patent/TWI553691B/zh
Priority to US13/590,242 priority patent/US20140011365A1/en
Publication of JP2014017292A publication Critical patent/JP2014017292A/ja
Publication of JP2014017292A5 publication Critical patent/JP2014017292A5/ja
Application granted granted Critical
Publication of JP5970268B2 publication Critical patent/JP5970268B2/ja
Priority to US16/218,703 priority patent/US11152192B2/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2012152005A 2012-07-06 2012-07-06 プラズマ処理装置および処理方法 Active JP5970268B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012152005A JP5970268B2 (ja) 2012-07-06 2012-07-06 プラズマ処理装置および処理方法
KR1020120081226A KR101343967B1 (ko) 2012-07-06 2012-07-25 플라즈마 처리 장치 및 처리 방법
TW101128230A TWI553691B (zh) 2012-07-06 2012-08-06 電漿處理裝置及電漿處理方法
US13/590,242 US20140011365A1 (en) 2012-07-06 2012-08-21 Plasma processing apparatus and method
US16/218,703 US11152192B2 (en) 2012-07-06 2018-12-13 Plasma processing apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012152005A JP5970268B2 (ja) 2012-07-06 2012-07-06 プラズマ処理装置および処理方法

Publications (3)

Publication Number Publication Date
JP2014017292A JP2014017292A (ja) 2014-01-30
JP2014017292A5 JP2014017292A5 (enExample) 2015-09-17
JP5970268B2 true JP5970268B2 (ja) 2016-08-17

Family

ID=49878837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012152005A Active JP5970268B2 (ja) 2012-07-06 2012-07-06 プラズマ処理装置および処理方法

Country Status (4)

Country Link
US (2) US20140011365A1 (enExample)
JP (1) JP5970268B2 (enExample)
KR (1) KR101343967B1 (enExample)
TW (1) TWI553691B (enExample)

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US10237144B2 (en) * 2012-10-29 2019-03-19 T-Mobile Usa, Inc. Quality of user experience analysis
US10854492B2 (en) * 2015-08-18 2020-12-01 Lam Research Corporation Edge ring assembly for improving feature profile tilting at extreme edge of wafer
CN106558522B (zh) * 2015-09-25 2021-01-29 北京北方华创微电子装备有限公司 卡盘及承载装置
KR102421625B1 (ko) * 2017-06-27 2022-07-19 캐논 아네르바 가부시키가이샤 플라스마 처리 장치
JP7033441B2 (ja) * 2017-12-01 2022-03-10 東京エレクトロン株式会社 プラズマ処理装置
JP7140610B2 (ja) * 2018-09-06 2022-09-21 株式会社日立ハイテク プラズマ処理装置
WO2020100357A1 (ja) * 2019-08-05 2020-05-22 株式会社日立ハイテク プラズマ処理装置
US20210249232A1 (en) * 2020-02-10 2021-08-12 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for etching
CN115668438A (zh) * 2020-03-27 2023-01-31 朗姆研究公司 用于处理具有缺口的晶片的等离子体排除区域环
US11404250B2 (en) * 2020-07-08 2022-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Plasma etcher edge ring with a chamfer geometry and impedance design
CN114695041B (zh) * 2020-12-25 2025-04-08 中微半导体设备(上海)股份有限公司 一种等离子体反应器
WO2022185453A1 (ja) * 2021-03-03 2022-09-09 三菱電機株式会社 炭化ケイ素エピタキシャル成長装置および炭化ケイ素エピタキシャル基板の製造方法
KR20250126086A (ko) * 2022-12-20 2025-08-22 램 리써치 코포레이션 기판 노치 근방의 플라즈마 증착 또는 에칭을 제어하기 위한 하부 플라즈마 배제 구역 (plasma exclusion zone) 링

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US5900064A (en) * 1997-05-01 1999-05-04 Applied Materials, Inc. Plasma process chamber
TW506234B (en) * 2000-09-18 2002-10-11 Tokyo Electron Ltd Tunable focus ring for plasma processing
JP3599670B2 (ja) * 2001-01-12 2004-12-08 株式会社日立製作所 プラズマ処理方法および装置
JP3881290B2 (ja) * 2002-08-20 2007-02-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
TW554465B (en) * 2002-08-27 2003-09-21 Winbond Electronics Corp Apparatus for supporting wafer in semiconductor process
US20040040663A1 (en) * 2002-08-29 2004-03-04 Ryujiro Udo Plasma processing apparatus
JP2005026001A (ja) * 2003-06-30 2005-01-27 Toshiba Lighting & Technology Corp 埋込形標識灯装置
TWI488236B (zh) * 2003-09-05 2015-06-11 Tokyo Electron Ltd Focusing ring and plasma processing device
JP4640922B2 (ja) * 2003-09-05 2011-03-02 東京エレクトロン株式会社 プラズマ処理装置
US7658816B2 (en) * 2003-09-05 2010-02-09 Tokyo Electron Limited Focus ring and plasma processing apparatus
JP4584572B2 (ja) 2003-12-22 2010-11-24 株式会社日立ハイテクノロジーズ プラズマ処理装置および処理方法
JP2005260011A (ja) 2004-03-12 2005-09-22 Hitachi High-Technologies Corp ウエハ処理装置およびウエハ処理方法
JP2005303099A (ja) * 2004-04-14 2005-10-27 Hitachi High-Technologies Corp プラズマ処理装置およびプラズマ処理方法
JP5080810B2 (ja) * 2004-11-02 2012-11-21 パナソニック株式会社 プラズマ処理方法およびプラズマ処理装置
JP4566789B2 (ja) * 2005-03-07 2010-10-20 株式会社日立ハイテクノロジーズ プラズマ処理方法およびプラズマ処理装置
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JP4988402B2 (ja) * 2007-03-30 2012-08-01 株式会社日立ハイテクノロジーズ プラズマ処理装置
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KR101645043B1 (ko) * 2007-10-31 2016-08-02 램 리써치 코포레이션 플라즈마 프로세싱 챔버, 플라즈마 프로세싱 콤포넌트 및 플라즈마 식각 챔버 프로세싱 콤포넌트 제조 방법
US8869741B2 (en) * 2008-12-19 2014-10-28 Lam Research Corporation Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber
JP5371466B2 (ja) * 2009-02-12 2013-12-18 株式会社日立ハイテクノロジーズ プラズマ処理方法
JP5227264B2 (ja) * 2009-06-02 2013-07-03 東京エレクトロン株式会社 プラズマ処理装置，プラズマ処理方法，プログラム
JP2011035026A (ja) * 2009-07-30 2011-02-17 Seiko Epson Corp ドライエッチング装置、半導体装置の製造方法、制御リング
JP5450187B2 (ja) * 2010-03-16 2014-03-26 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP5654297B2 (ja) * 2010-09-14 2015-01-14 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法

Also Published As

Publication number Publication date
US20140011365A1 (en) 2014-01-09
JP2014017292A (ja) 2014-01-30
TWI553691B (zh) 2016-10-11
TW201403653A (zh) 2014-01-16
KR101343967B1 (ko) 2013-12-20
US11152192B2 (en) 2021-10-19
US20190115193A1 (en) 2019-04-18

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