JP5967316B2 - Cu核ボール、はんだペースト、フォームはんだ及びはんだ継手 - Google Patents
Cu核ボール、はんだペースト、フォームはんだ及びはんだ継手 Download PDFInfo
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- JP5967316B2 JP5967316B2 JP2015546641A JP2015546641A JP5967316B2 JP 5967316 B2 JP5967316 B2 JP 5967316B2 JP 2015546641 A JP2015546641 A JP 2015546641A JP 2015546641 A JP2015546641 A JP 2015546641A JP 5967316 B2 JP5967316 B2 JP 5967316B2
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- core ball
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K35/262—Sn as the principal constituent
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- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
Description
(1)球状の核層と、SnとCuからなるはんだ合金で構成され、核層を被覆するはんだ層とを備えたCu核ボールであって、核層は、Cuの純度が99.9%以上99.995%以下であり、PbまたはBiのいずれかの含有量、あるいは、PbおよびBiの合計の含有量が1ppm以上であり、Uの含有量が5ppb以下であり、Thの含有量が5ppb以下であり、真球度が0.95以上であり、放射されるα線量が0.0200cph/cm 2 以下であり、はんだ層は、Uの含有量が5ppb以下であり、Thの含有量が5ppb以下であり、Cu核ボールから放射されるα線量が0.0200cph/cm 2 以下であるCu核ボール。
U及びThは放射性元素であり、ソフトエラーを抑制するにはこれらの含有量を抑える必要がある。U及びThの含有量は、はんだ層3のα線量を0.0200cph/cm2以下とするため、各々5ppb以下にする必要がある。また、現在または将来の高密度実装でのソフトエラーを抑制する観点から、U及びThの含有量は、好ましくは、各々2ppb以下である。
本発明に係るCu核ボール1のα線量は0.0200cph/cm2以下である。これは、電子部品の高密度実装においてソフトエラーが問題にならない程度のα線量である。本発明に係るCu核ボール1のα線量は、Cu核ボール1を構成するはんだ層3のα線量が0.0200cph/cm2以下であることにより達成される。また、Cu核ボール1のα線量は、後述するように、Cuボール2のα線量が0.0200cph/cm2以下であることによっても達成される。
前述のようにU及びThは放射性同位元素であり、ソフトエラーを抑制するにはこれらの含有量を抑える必要がある。U及びThの含有量は、Cuボール2のα線量を0.0200cph/cm2以下とするため、各々5ppb以下にする必要がある。また、現在または将来の高密度実装でのソフトエラーを抑制する観点から、U及びThの含有量は、好ましくは、各々2ppb以下である。
Cuボール2は純度が3N以上4N5以下である。つまり、Cuボール2は不純物元素の含有量が50ppm以上である。ここで、Cu等の金属材料の純度は、99%を2N、99.9%を3N、99.99%を4N、99.999%を5Nとする。4N5とは、金属材料の純度が99.995%であることを示す。
Cuボール2のα線量は0.0200cph/cm2以下である。これは、電子部品の高密度実装においてソフトエラーが問題にならない程度のα線量である。本発明では、Cuボール2を製造するために通常行っている工程に加え再度加熱処理を施している。このため、Cu材にわずかに残存する210Poが揮発し、Cu材と比較してCuボール2の方がより一層低いα線量を示す。α線量は、更なる高密度実装でのソフトエラーを抑制する観点から、好ましくは0.0020cph/cm2以下であり、より好ましくは0.0010cph/cm2以下である。
Cuボール2に含まれる不純物元素としては、Sn、Sb、Bi、Zn、Fe、Al、As、Ag、In、Cd、Cu、Pb、Au、P、S、U、Thなどが考えられるが、本発明に係るCu核ボール1を構成するCuボール2は、不純物元素の中でも特にPbまたはBiのいずれかの含有量、あるいは、Pb及びBiの合計の含有量が1ppm以上不純物元素として含有することが好ましい。本発明では、α線量を低減する上でPbまたはBiのいずれかの含有量、あるいは、Pb及びBiの含有量を極限まで低減する必要がない。
これは以下の理由による。
Cuボール2の形状は、スタンドオフ高さを制御する観点から真球度は0.95以上であることが好ましい。Cuボール2の真球度が0.95未満であると、Cuボールが不定形状になるため、バンプ形成時に高さが不均一なバンプが形成され、接合不良が発生する可能性が高まる。真球度は、より好ましくは0.990以上である。本発明において、真球度とは真球からのずれを表す。真球度は、例えば、最小二乗中心法(LSC法)、最小領域中心法(MZC法)、最大内接中心法(MIC法)、最小外接中心法(MCC法)など種々の方法で求められる。詳しくは、真球度とは、500個の各Cuボール2の直径を長径で割った際に算出される算術平均値であり、値が上限である1.00に近いほど真球に近いことを表す。本発明での長径の長さ、および直径の長さとは、ミツトヨ社製のウルトラクイックビジョン、ULTRA QV350−PRO測定装置によって測定された長さをいう。
Cuボール2の直径は1〜1000μmであることが好ましい。この範囲にあると、球状のCuボール2を安定して製造でき、また、端子間が狭ピッチである場合の接続短絡を抑制することができる。
材料となるCu材はセラミックのような耐熱性の板である耐熱板に置かれ、耐熱板とともに炉中で加熱される。耐熱板には底部が半球状となった多数の円形の溝が設けられている。溝の直径や深さは、Cuボールの粒径に応じて適宜設定されており、例えば、直径が0.8mmであり、深さが0.88mmである。また、Cu細線が切断されて得られたチップ形状のCu材(以下、「チップ材」という。)は、耐熱板の溝内に一個ずつ投入される。
Sn化合物の具体例としては、メタンスルホン酸、エタンスルホン酸、2−プロパノールスルホン酸、p−フェノールスルホン酸などの有機スルホン酸の錫塩、硫酸錫、酸化錫、硝酸錫、塩化錫、臭化錫、ヨウ化錫、リン酸錫、ピロリン酸錫、酢酸錫、ギ酸錫、クエン酸錫、グルコン酸錫、酒石酸錫、乳酸錫、コハク酸錫、スルファミン酸錫、ホウフッ化錫、ケイフッ化錫などの第一Sn化合物が挙げられる。これらのSn化合物は、一種単独又は二種以上混合して用いることができる。
Agを含まないはんだ合金ではんだ層が形成されたCu核ボールと、Agを含むはんだ合金ではんだ層が形成されたCu核ボールと、Agを含まないはんだ合金で形成されたはんだボールと、Agを含むはんだ合金で形成されたはんだボールを作成し、落下等の衝撃に対する強度を測定する落下強度試験と、ヒートサイクルによる伸縮に対する強度を測定するヒートサイクル試験を行った。
次に、真球度が高いCuボールを作製し、このCuボールの表面にはんだ層を形成したCu核ボールのα線量を測定した。
真球度が高いCuボールの作製条件を調査した。純度が99.9%のCuペレット、純度が99.995%以下のCuワイヤー、及び純度が99.995%を超えるCu板を準備した。各々をるつぼの中に投入した後、るつぼの温度を1200℃に昇温し、45分間加熱処理を行い、るつぼ底部に設けたオリフィスから溶融Cuの液滴を滴下し、液滴を冷却してCuボールを造粒した。これにより平均粒径が250μmのCuボールを作製した。作製したCuボールの元素分析結果及び真球度を表3に示す。
以下に、真球度の測定方法を詳述する。真球度はCNC画像測定システムで測定された。装置は、ミツトヨ社製のウルトラクイックビジョン、ULTRA QV350−PROである。
α線量の測定方法は以下の通りである。α線量の測定にはガスフロー比例計数器のα線測定装置を用いた。測定サンプルは300mm×300mmの平面浅底容器にCuボールを敷き詰めたものである。この測定サンプルをα線測定装置内に入れ、PR−10ガスフローにて24時間放置した後、α線量を測定した。
作製したCuボールの元素分析結果、α線量を表2に示す。
Claims (6)
- 球状の核層と、
SnとCuからなるはんだ合金で構成され、前記核層を被覆するはんだ層とを備えたCu核ボールであって、
前記核層は、
Cuの純度が99.9%以上99.995%以下であり、
PbまたはBiのいずれかの含有量、あるいは、PbおよびBiの合計の含有量が1ppm以上であり、
Uの含有量が5ppb以下であり、
Thの含有量が5ppb以下であり、
真球度が0.95以上であり、
放射されるα線量が0.0200cph/cm 2 以下であり、
前記はんだ層は、
Uの含有量が5ppb以下であり、
Thの含有量が5ppb以下であり、
Cu核ボールから放射されるα線量が0.0200cph/cm 2 以下である
ことを特徴とするCu核ボール。 - 前記はんだ層は、Cuを0.1%以上3.0%以下で含み、残部がSnと不純物から構成される
ことを特徴とする請求項1に記載のCu核ボール。 - Ni及びCoから選択される1元素以上からなる層で被覆された上記核層が、上記はんだ層で被覆される
ことを特徴とする請求項2に記載のCu核ボール。 - 請求項1〜3のいずれか1項に記載のCu核ボールを使用した
ことを特徴とするはんだペースト。 - 請求項1〜3のいずれか1項に記載のCu核ボールを使用した
ことを特徴とするフォームはんだ。 - 請求項1〜3のいずれか1項に記載のCu核ボールを使用した
ことを特徴とするはんだ継手。
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