JP5965664B2 - 表面保護フィルム、これを用いた半導体装置の製造方法 - Google Patents

表面保護フィルム、これを用いた半導体装置の製造方法 Download PDF

Info

Publication number
JP5965664B2
JP5965664B2 JP2012034384A JP2012034384A JP5965664B2 JP 5965664 B2 JP5965664 B2 JP 5965664B2 JP 2012034384 A JP2012034384 A JP 2012034384A JP 2012034384 A JP2012034384 A JP 2012034384A JP 5965664 B2 JP5965664 B2 JP 5965664B2
Authority
JP
Japan
Prior art keywords
protective film
surface protective
semiconductor substrate
layer
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012034384A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013169685A5 (https=
JP2013169685A (ja
Inventor
真一 浅井
真一 浅井
貴行 植草
貴行 植草
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to JP2012034384A priority Critical patent/JP5965664B2/ja
Publication of JP2013169685A publication Critical patent/JP2013169685A/ja
Publication of JP2013169685A5 publication Critical patent/JP2013169685A5/ja
Application granted granted Critical
Publication of JP5965664B2 publication Critical patent/JP5965664B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012034384A 2012-02-20 2012-02-20 表面保護フィルム、これを用いた半導体装置の製造方法 Active JP5965664B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012034384A JP5965664B2 (ja) 2012-02-20 2012-02-20 表面保護フィルム、これを用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012034384A JP5965664B2 (ja) 2012-02-20 2012-02-20 表面保護フィルム、これを用いた半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013169685A JP2013169685A (ja) 2013-09-02
JP2013169685A5 JP2013169685A5 (https=) 2015-04-02
JP5965664B2 true JP5965664B2 (ja) 2016-08-10

Family

ID=49263971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012034384A Active JP5965664B2 (ja) 2012-02-20 2012-02-20 表面保護フィルム、これを用いた半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5965664B2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201502219XA (en) * 2012-09-24 2015-05-28 Lintec Corp Back grinding sheet
JP5965070B2 (ja) * 2013-06-28 2016-08-03 三井化学株式会社 応力緩和性フィルム及び半導体用表面保護フィルム
JP6774828B2 (ja) * 2016-09-20 2020-10-28 三井化学株式会社 容器
JP6799133B2 (ja) 2017-02-23 2020-12-09 三井化学株式会社 成形体およびその製造方法
JP6949551B2 (ja) * 2017-05-17 2021-10-13 グンゼ株式会社 バックグラインド用基体フィルム
JP2018076517A (ja) * 2017-12-01 2018-05-17 三井化学株式会社 ダイシングフィルム、半導体用表面保護フィルム、及び半導体装置の製造方法
US11485815B2 (en) 2018-04-11 2022-11-01 Mitsui Chemicals, Inc. 4-methyl-1-pentene polymer particle and method for producing 4-methyl-1-pentene resin
EP3783087B1 (en) 2018-04-17 2022-11-09 Mitsui Chemicals, Inc. Lubricating oil composition and viscosity modifier for lubricating oil
KR102646444B1 (ko) 2019-06-21 2024-03-11 미쓰이 가가쿠 가부시키가이샤 배양재 및 그의 용도
WO2022091714A1 (ja) * 2020-10-30 2022-05-05 日東電工株式会社 表面保護フィルム
JP7671602B2 (ja) * 2020-10-30 2025-05-02 日東電工株式会社 表面保護フィルム
US20240301339A1 (en) 2020-12-23 2024-09-12 Mitsui Chemicals, Inc. Culture material and use thereof
WO2023085019A1 (ja) 2021-11-09 2023-05-19 三井化学株式会社 培養容器及び培養方法
US20250333673A1 (en) 2022-05-30 2025-10-30 Mitsui Chemicals, Inc. Culture vessel, method for producing same, and culture method
WO2024009636A1 (ja) 2022-07-07 2024-01-11 三井化学株式会社 ウェルプレートおよび培養方法
WO2024096138A1 (ja) 2022-11-04 2024-05-10 学校法人東海大学 培養装置、培養対象物観察方法、及び培養チップ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW578222B (en) * 2002-01-11 2004-03-01 Mitsui Chemicals Inc Semiconductor wafer surface protective adhesive tape and backside process method of semiconductor wafer using the same
JP4252805B2 (ja) * 2002-01-11 2009-04-08 三井化学株式会社 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
JP4493296B2 (ja) * 2002-07-26 2010-06-30 日東電工株式会社 加工用粘着シートとその製造方法
JP2005125659A (ja) * 2003-10-24 2005-05-19 Nitto Denko Corp 表面保護フィルム
JP2005183764A (ja) * 2003-12-22 2005-07-07 Mitsui Chemicals Inc 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法
CN102382224B (zh) * 2004-06-10 2014-05-21 三井化学株式会社 烯烃系聚合物及其用途
JP4711777B2 (ja) * 2005-08-11 2011-06-29 日東電工株式会社 粘着シートとその製造方法、及び、製品の加工方法
JP4721834B2 (ja) * 2005-09-06 2011-07-13 日東電工株式会社 粘着シート及びこの粘着シートを用いた製品の加工方法
EP2345688B1 (en) * 2008-10-24 2013-03-27 Kao Corporation Process for producing resin composition
JP5501060B2 (ja) * 2009-04-02 2014-05-21 日東電工株式会社 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート
JP5255525B2 (ja) * 2009-06-15 2013-08-07 古河電気工業株式会社 半導体ウエハ加工用粘着テープおよびその製造方法
KR101408423B1 (ko) * 2009-11-06 2014-06-17 미쓰이 가가쿠 가부시키가이샤 4-메틸-1-펜텐·α-올레핀 공중합체, 이 공중합체를 포함하는 조성물 및 4-메틸-1-펜텐 공중합체 조성물
JP5728268B2 (ja) * 2011-03-30 2015-06-03 太平化学製品株式会社 自己修復性高分子材料及びその製造方法、並びに自己修復性高分子フィルム

Also Published As

Publication number Publication date
JP2013169685A (ja) 2013-09-02

Similar Documents

Publication Publication Date Title
JP5965664B2 (ja) 表面保護フィルム、これを用いた半導体装置の製造方法
JP5965070B2 (ja) 応力緩和性フィルム及び半導体用表面保護フィルム
JP4970863B2 (ja) 被加工物の加工方法
CN1912038B (zh) 粘合片及其制造方法、以及制品的加工方法
CN1865376B (zh) 用于切割的压敏粘合片以及使用其的工件的加工方法
JP6261115B2 (ja) 粘着シート
CN110272696B (zh) 背面研磨用粘着胶带
TWI400311B (zh) 壓敏性黏著劑組成物、壓敏性黏著板和使用彼之半導體晶圓背面研磨方法
KR101029235B1 (ko) 다이싱용 점착 시트 및 다이싱 방법
CN103620743B (zh) 半导体加工用划片胶带
CN101081968B (zh) 切割用压敏粘合剂片材和用其处理加工材料的方法
JP7252945B2 (ja) 粘着性フィルムおよび電子装置の製造方法
CN102093827B (zh) 再剥离性粘合片
CN104272437B (zh) 半导体加工用粘合胶带
SG189515A1 (en) Method of manufacturing semiconductor device and semiconductor wafer surface protection film used therein
JP6542502B2 (ja) 拡張性基材フィルム、ダイシングフィルム、半導体用表面保護フィルム、及び半導体装置の製造方法
CN101831253A (zh) 无基材压敏粘合片、其生产方法及使用其的研磨方法
JP4707805B2 (ja) 半導体ウエハ表面保護用粘着フィルム及びそれを用いる半導体ウエハ表面の保護方法
JP2010092945A (ja) 半導体ウェハ保護用粘着フィルム及びそれを用いた半導体ウェハの保護方法
WO2003081653A1 (en) Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
CN101955737A (zh) 表面保护片
CN100419964C (zh) 切片用粘着片、切片方法和半导体元件的制造方法
JP6131126B2 (ja) 粘着シート
JP2019145575A (ja) マスキング材
JP2004006746A (ja) 半導体ウェハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウェハの保護方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150212

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151117

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151118

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160118

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160628

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160704

R150 Certificate of patent or registration of utility model

Ref document number: 5965664

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250