JP5962752B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP5962752B2
JP5962752B2 JP2014505981A JP2014505981A JP5962752B2 JP 5962752 B2 JP5962752 B2 JP 5962752B2 JP 2014505981 A JP2014505981 A JP 2014505981A JP 2014505981 A JP2014505981 A JP 2014505981A JP 5962752 B2 JP5962752 B2 JP 5962752B2
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JP
Japan
Prior art keywords
cooling medium
cooling
chamber
power module
semiconductor power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2014505981A
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English (en)
Japanese (ja)
Other versions
JPWO2013140704A1 (ja
Inventor
小高　章弘
章弘 小高
泰仁 田中
泰仁 田中
美里 柴田
美里 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of JPWO2013140704A1 publication Critical patent/JPWO2013140704A1/ja
Application granted granted Critical
Publication of JP5962752B2 publication Critical patent/JP5962752B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
JP2014505981A 2012-03-21 2013-01-17 電力変換装置 Expired - Fee Related JP5962752B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012064106 2012-03-21
JP2012064106 2012-03-21
PCT/JP2013/000208 WO2013140704A1 (fr) 2012-03-21 2013-01-17 Appareil de conversion de puissance

Publications (2)

Publication Number Publication Date
JPWO2013140704A1 JPWO2013140704A1 (ja) 2015-08-03
JP5962752B2 true JP5962752B2 (ja) 2016-08-03

Family

ID=49222190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014505981A Expired - Fee Related JP5962752B2 (ja) 2012-03-21 2013-01-17 電力変換装置

Country Status (3)

Country Link
JP (1) JP5962752B2 (fr)
CN (1) CN104067502B (fr)
WO (1) WO2013140704A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016076214A1 (fr) * 2014-11-11 2016-05-19 株式会社村田製作所 Conditionneur de puissance
JP6277114B2 (ja) * 2014-11-28 2018-02-07 日立オートモティブシステムズ株式会社 電力変換装置
GB2560338B (en) * 2017-03-07 2020-09-23 Arrival Ltd Cooling plate
GB2560337B (en) * 2017-03-07 2020-10-21 Arrival Ltd Cooling plate
US10615093B2 (en) * 2017-04-21 2020-04-07 Mitsubishi Electric Corporation Semiconductor device
DE102017208632A1 (de) 2017-05-22 2018-11-22 Audi Ag Kraftfahrzeug und Stromrichtereinrichtung für ein Kraftfahrzeug
JP2019033624A (ja) * 2017-08-09 2019-02-28 株式会社デンソー 電力変換装置
JP7103109B2 (ja) * 2018-09-21 2022-07-20 富士電機株式会社 半導体モジュールおよび車両
JP7278767B2 (ja) * 2018-12-26 2023-05-22 日立Astemo株式会社 電力変換装置
WO2020170000A1 (fr) * 2019-02-21 2020-08-27 日産自動車株式会社 Dispositif de conversion de puissance
DE102019202902A1 (de) * 2019-03-04 2020-09-10 Abb Schweiz Ag Direkte Kühlung eines Stromrichters durch Verwendung einer geprägten Platte
US10888036B1 (en) * 2019-12-18 2021-01-05 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal management assemblies for electronic assemblies circumferentially mounted on a motor
JP7388319B2 (ja) * 2020-09-02 2023-11-29 株式会社デンソー 電力変換装置
JP2022048763A (ja) 2020-09-15 2022-03-28 富士電機株式会社 冷却器及び半導体装置
EP4040471A1 (fr) * 2021-02-08 2022-08-10 Hitachi Energy Switzerland AG Module semi-conducteur de puissance, dispositif semi-conducteur de puissance et procédé de fabrication d'un dispositif semi-conducteur de puissance
JP7477063B1 (ja) 2024-02-13 2024-05-01 富士電機株式会社 電力変換装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4314738B2 (ja) * 2000-11-24 2009-08-19 株式会社デンソー 積層冷却器
JP2003079162A (ja) * 2001-09-03 2003-03-14 Toshiba Transport Eng Inc 電力変換装置
JP3641232B2 (ja) * 2001-11-13 2005-04-20 本田技研工業株式会社 インバータ装置及びその製造方法
JP4138562B2 (ja) * 2002-04-18 2008-08-27 株式会社日立製作所 車両用インバータ装置及びそれを搭載した電動車両
JP4453498B2 (ja) * 2004-09-22 2010-04-21 富士電機システムズ株式会社 パワー半導体モジュールおよびその製造方法
JP4207896B2 (ja) * 2005-01-19 2009-01-14 富士電機デバイステクノロジー株式会社 半導体装置
JP4478618B2 (ja) * 2005-06-28 2010-06-09 本田技研工業株式会社 パワー半導体モジュール
JP2008086099A (ja) * 2006-09-27 2008-04-10 Honda Motor Co Ltd インバータ装置
JP5046378B2 (ja) * 2007-03-30 2012-10-10 ニチコン株式会社 パワー半導体モジュール、および該モジュールを搭載したパワー半導体デバイス
JP5061717B2 (ja) * 2007-05-18 2012-10-31 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
JP5099417B2 (ja) * 2007-05-22 2012-12-19 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP2009033799A (ja) * 2007-07-24 2009-02-12 Fuji Electric Systems Co Ltd ３レベル電力変換装置の冷却構造
JP4644275B2 (ja) * 2008-07-29 2011-03-02 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP5061065B2 (ja) * 2008-08-26 2012-10-31 株式会社豊田自動織機 液冷式冷却装置
JP5287159B2 (ja) * 2008-11-12 2013-09-11 株式会社デンソー 電力変換装置
JP5315073B2 (ja) * 2009-02-02 2013-10-16 日立オートモティブシステムズ株式会社 電力変換装置
JP2010182898A (ja) * 2009-02-06 2010-08-19 Hitachi Automotive Systems Ltd コンデンサモジュール及びそれを用いた電力変換装置
JP5402702B2 (ja) * 2010-02-12 2014-01-29 株式会社デンソー 電力変換装置

Also Published As

Publication number Publication date
CN104067502B (zh) 2016-08-24
CN104067502A (zh) 2014-09-24
JPWO2013140704A1 (ja) 2015-08-03
WO2013140704A1 (fr) 2013-09-26

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