GB2560338B - Cooling plate - Google Patents

Cooling plate Download PDF

Info

Publication number
GB2560338B
GB2560338B GB1703651.8A GB201703651A GB2560338B GB 2560338 B GB2560338 B GB 2560338B GB 201703651 A GB201703651 A GB 201703651A GB 2560338 B GB2560338 B GB 2560338B
Authority
GB
United Kingdom
Prior art keywords
cooling plate
cooling
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1703651.8A
Other versions
GB201703651D0 (en
GB2560338A (en
Inventor
Tsonev Kaloyan
Smith Richard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arrival UK Ltd
Original Assignee
Arrival Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arrival Ltd filed Critical Arrival Ltd
Priority to GB1703651.8A priority Critical patent/GB2560338B/en
Publication of GB201703651D0 publication Critical patent/GB201703651D0/en
Publication of GB2560338A publication Critical patent/GB2560338A/en
Application granted granted Critical
Publication of GB2560338B publication Critical patent/GB2560338B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1703651.8A 2017-03-07 2017-03-07 Cooling plate Expired - Fee Related GB2560338B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1703651.8A GB2560338B (en) 2017-03-07 2017-03-07 Cooling plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1703651.8A GB2560338B (en) 2017-03-07 2017-03-07 Cooling plate

Publications (3)

Publication Number Publication Date
GB201703651D0 GB201703651D0 (en) 2017-04-19
GB2560338A GB2560338A (en) 2018-09-12
GB2560338B true GB2560338B (en) 2020-09-23

Family

ID=58543996

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1703651.8A Expired - Fee Related GB2560338B (en) 2017-03-07 2017-03-07 Cooling plate

Country Status (1)

Country Link
GB (1) GB2560338B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019200011A1 (en) * 2019-01-02 2020-07-02 Rolls-Royce Deutschland Ltd & Co Kg Electrical circuit with cooling, in particular for applications in aircraft
EP4287797A1 (en) * 2022-05-31 2023-12-06 Valeo eAutomotive Germany GmbH Electrical equipment with an integrated coolant pump

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740015A (en) * 1996-05-02 1998-04-14 Chrysler Corporation Heat exchanger
US6434003B1 (en) * 2001-04-24 2002-08-13 York International Corporation Liquid-cooled power semiconductor device heatsink
US20060113661A1 (en) * 2004-11-30 2006-06-01 Mitsubishi Denki Kabushiki Kaisha Cooling system of power semiconductor module
DE102009012042A1 (en) * 2009-03-07 2010-09-16 Esw Gmbh Cooling device for cooling electrical or electronic component, has recess that is completely locked at plate surface by cooling body so that component stays in heat conducting contact with coolant by defined surface using cooling body
US20110042038A1 (en) * 2009-08-18 2011-02-24 Gm Global Technology Operations, Inc. Power module assemblies with staggered coolant channels
WO2013140704A1 (en) * 2012-03-21 2013-09-26 富士電機株式会社 Power conversion apparatus
CN103906417A (en) * 2014-04-11 2014-07-02 黄山谷捷散热科技有限公司 Water-cooled heat dissipation device
US9003649B1 (en) * 2010-06-25 2015-04-14 Maxq Technology, Llc Method of making a two-sided fluid cooled assembly
US20160183409A1 (en) * 2014-12-22 2016-06-23 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US20170055378A1 (en) * 2015-08-20 2017-02-23 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740015A (en) * 1996-05-02 1998-04-14 Chrysler Corporation Heat exchanger
US6434003B1 (en) * 2001-04-24 2002-08-13 York International Corporation Liquid-cooled power semiconductor device heatsink
US20060113661A1 (en) * 2004-11-30 2006-06-01 Mitsubishi Denki Kabushiki Kaisha Cooling system of power semiconductor module
DE102009012042A1 (en) * 2009-03-07 2010-09-16 Esw Gmbh Cooling device for cooling electrical or electronic component, has recess that is completely locked at plate surface by cooling body so that component stays in heat conducting contact with coolant by defined surface using cooling body
US20110042038A1 (en) * 2009-08-18 2011-02-24 Gm Global Technology Operations, Inc. Power module assemblies with staggered coolant channels
US9003649B1 (en) * 2010-06-25 2015-04-14 Maxq Technology, Llc Method of making a two-sided fluid cooled assembly
WO2013140704A1 (en) * 2012-03-21 2013-09-26 富士電機株式会社 Power conversion apparatus
CN103906417A (en) * 2014-04-11 2014-07-02 黄山谷捷散热科技有限公司 Water-cooled heat dissipation device
US20160183409A1 (en) * 2014-12-22 2016-06-23 Toyota Motor Engineering & Manufacturing North America, Inc. Modular jet impingement assemblies with passive and active flow control for electronics cooling
US20170055378A1 (en) * 2015-08-20 2017-02-23 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling

Also Published As

Publication number Publication date
GB201703651D0 (en) 2017-04-19
GB2560338A (en) 2018-09-12

Similar Documents

Publication Publication Date Title
GB2557840B (en) Bone plate
GB2570842B (en) Cold plate
GB201618255D0 (en) Cooling device
SG11202001938RA (en) Coolant
GB201602402D0 (en) Cooling device
GB201811040D0 (en) Cooling
GB201705512D0 (en) Cooling system
GB2548096B (en) Cooling system
IL267460A (en) Cooling pad
GB201706298D0 (en) Cooling system
GB201521862D0 (en) Cooling arrangement
IL271134A (en) Cooling composition
GB201812374D0 (en) Cooling system
PL3262357T3 (en) Cooling device
PL3076106T3 (en) Cooling unit
GB2560338B (en) Cooling plate
ZA201807162B (en) Cooling device
GB201517369D0 (en) Self cooling loudspeaker
GB2560337B (en) Cooling plate
GB2567799B (en) Transition plate
ZA201806329B (en) Cooling system
GB201709130D0 (en) Cooling device
GB201609498D0 (en) Cooling system
ZA202000311B (en) Galvanized-wire cooling device
AU201810628S (en) Plate

Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20230901 AND 20230906

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20230307