JP5956053B2 - 微細パターニング用表面化学処理装置 - Google Patents
微細パターニング用表面化学処理装置 Download PDFInfo
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- JP5956053B2 JP5956053B2 JP2015500038A JP2015500038A JP5956053B2 JP 5956053 B2 JP5956053 B2 JP 5956053B2 JP 2015500038 A JP2015500038 A JP 2015500038A JP 2015500038 A JP2015500038 A JP 2015500038A JP 5956053 B2 JP5956053 B2 JP 5956053B2
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
- B05B14/10—Arrangements for collecting, re-using or eliminating excess spraying material the excess material being particulate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/06—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/20—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material for applying liquid or other fluent material only at particular parts of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/06—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying two different liquids or other fluent materials, or the same liquid or other fluent material twice, to the same side of the work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/66—Chemical treatment, e.g. leaching, acid or alkali treatment
- C03C25/68—Chemical treatment, e.g. leaching, acid or alkali treatment by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Coating Apparatus (AREA)
Description
次に、上記した本発明の実施の形態の第1の管路11に、0.1〜5% N−イソプロピルアクリルアミドを前記した溶媒1で希釈した溶液(以下、試薬1と称する)を供給するように設定し、この第1の管路11の開口11aをキャピラリプレートの表面の目的とする位置に近接させる。第1の管路11の開口11aから毎分1〜100μLの割合で試薬1を吐出し、第2の管路12の開口12aから毎分1〜500μLで溶媒1および試薬1を吸引し、目的位置付近を化学修飾する。ステージ4の駆動によりキャピラリプレートと第1、第2の管路11,12とをx,y方向に相対移動させることにより、任意領域のパターンを描画することもできる。上記は窒素雰囲気下で実施する。
これにより、キャピラリプレートの目的とする表面のみに温度応答性高分子を導入することができる。
2 液相(または気相)
3 容器
4 ステージ
11 第1の管路
12 第2の管路
13 配管
14 注入用ポンプ
15 配管
16 排出用ポンプ
21 移動機構
22 制御部
23 設定部
24 記憶部
31 パターニング溶液
32 溶質
33 溶媒
34 パターニング領域
35 シース液
51 シース形成口
52 シース液供給用管路
53 シース液供給用ポンプ
Claims (3)
- 気相もくしは液相中に置かれた固相の表面に、所要パターンの化学的処理を施すための装置であって、
一端が開口し、他端が上記固相表面と反応して当該表面を化学処理するためのパターニング溶液を供給する液供給手段に連通する第1の管路と、
上記第1の管路に向けてシース液を供給することにより、当該第1の管路中でシースフローを形成して上記パターニング溶液を中央に収束させるためのシース液供給用管路と、
上記第1の管路の開口の周りを囲むように一端が開口し、他端が液吸引手段に連通する第2の管路と、これらの第1と第2の管路の開口を上記気相もしくは液相中で上記固相の表面に対向させた状態で、当該各開口と固相とを相対的に移動させる移動機構を備え、
上記液供給手段から上記第1の管路内に上記パターニング溶液を供給するとともに、上記シース液供給用管路から上記シース液を供給することにより上記パターニング溶液を中央に収束させて当該第1の管路の開口から吐出させつつ、上記液吸引手段の駆動により上記第2の管路の開口を通じて上記第1の管路の開口から吐出したパターニング溶液を上記気相もしくは液相とともに吸引しながら、上記第1と第2の管路の開口と上記固相とを相対移動させて所要パターンの化学的処理領域を形成することを特徴とする微細パターニング用表面化学処理装置。 - 上記移動機構は、上記各開口と固相とを3次元方向に相対移動させる機構であり、設定手段によりあらかじめ設定された順路で上記開口と固相とを相対移動させることを特徴とする請求項1に記載の微細パターニング用表面化学処理装置。
- 上記第1と第2の管路、または、上記第1と第2の管路およびシース液供給用管路は、Siを用いて形成した構造体からなっていることを特徴とする請求項1または請求項2に記載の微細パターニング用表面化学処理装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2013/053492 WO2014125591A1 (ja) | 2013-02-14 | 2013-02-14 | 微細パターニング用表面化学処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5956053B2 true JP5956053B2 (ja) | 2016-07-20 |
JPWO2014125591A1 JPWO2014125591A1 (ja) | 2017-02-02 |
Family
ID=51353624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015500038A Expired - Fee Related JP5956053B2 (ja) | 2013-02-14 | 2013-02-14 | 微細パターニング用表面化学処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9839932B2 (ja) |
JP (1) | JP5956053B2 (ja) |
CN (1) | CN104994964B (ja) |
WO (1) | WO2014125591A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013206458A1 (de) * | 2013-04-11 | 2014-10-16 | Eos Gmbh Electro Optical Systems | Rotationsbeschichter und Vorrichtung zum generativen Herstellen eines Objekts mit dem Rotationsbeschichter |
EP3749452B1 (en) * | 2018-02-05 | 2022-08-10 | Bio-Rad Laboratories, Inc. | Microfluidic probe head with barrier projections |
US11541403B2 (en) | 2018-10-01 | 2023-01-03 | Polyvalor, Limited Partnership | System and method for fluid delivery |
US11458467B2 (en) | 2019-08-06 | 2022-10-04 | Bio-Rad Laboratories Inc. | Structures to define flow confinement shape and confinement stability with uniform aspiration |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5673579A (en) * | 1979-11-19 | 1981-06-18 | Konishiroku Photo Ind Co Ltd | Production of coated object |
JPS57203789A (en) * | 1981-06-11 | 1982-12-14 | Inoue Japax Res Inc | Partial plating device |
JPH0299166A (ja) * | 1988-10-04 | 1990-04-11 | Fuji Photo Film Co Ltd | 塗布層縁部の吸引処理方法 |
JPH03151070A (ja) * | 1989-11-06 | 1991-06-27 | Agency Of Ind Science & Technol | 吐出ノズル |
JPH091024A (ja) * | 1995-06-20 | 1997-01-07 | Nec Corp | ディスペンサ装置 |
JP2003033699A (ja) * | 2001-07-26 | 2003-02-04 | Nichiden Tekkosho:Kk | 真空塗装方法及び装置 |
JP2010172817A (ja) * | 2009-01-29 | 2010-08-12 | Micronics Japan Co Ltd | 金属微粒子の噴射ノズル |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4826084A (en) * | 1986-09-26 | 1989-05-02 | Wallace Norman R | Sheathed jet fluid dispersing apparatus |
US5520735A (en) * | 1992-06-30 | 1996-05-28 | Nordson Corporation | Nozzle assembly and system for applying powder to a workpiece |
US7108894B2 (en) * | 1998-09-30 | 2006-09-19 | Optomec Design Company | Direct Write™ System |
US6827634B2 (en) * | 2000-05-22 | 2004-12-07 | Agency Of Industrial Science And Technology | Ultra fine particle film forming method and apparatus |
JP3942785B2 (ja) * | 2000-01-26 | 2007-07-11 | エスアイアイ・ナノテクノロジー株式会社 | 光ファイバープローブおよび微小開口付カンチレバーと、それらの開口形成方法 |
US20020014403A1 (en) * | 2000-04-07 | 2002-02-07 | Eiichi Hoshino | Method of fabricating reflective mask, and methods and apparatus of detecting wet etching end point and inspecting side etching amount |
WO2001087491A1 (en) * | 2000-05-16 | 2001-11-22 | Regents Of The University Of Minnesota | High mass throughput particle generation using multiple nozzle spraying |
KR100934679B1 (ko) * | 2000-10-17 | 2009-12-31 | 네오포토닉스 코포레이션 | 반응성 증착에 의한 코팅 형성 |
US6699356B2 (en) * | 2001-08-17 | 2004-03-02 | Applied Materials, Inc. | Method and apparatus for chemical-mechanical jet etching of semiconductor structures |
US8469295B2 (en) * | 2002-02-15 | 2013-06-25 | Implant Sciences Corporation | Trace chemical particle release nozzle |
US7351348B2 (en) * | 2005-08-10 | 2008-04-01 | International Business Machines Corporation | Evaporation control using coating |
CN101310169B (zh) * | 2005-11-16 | 2011-06-08 | 株式会社日立制作所 | 液滴生成运送方法和装置以及粒子操作装置 |
JP2007147456A (ja) * | 2005-11-28 | 2007-06-14 | Seiko Epson Corp | マイクロ流体システム、試料分析装置、及び標的物質の検出または測定方法 |
JP5193877B2 (ja) * | 2005-11-29 | 2013-05-08 | ビート フォグ ノズル インク | 噴霧ノズル |
US20070154641A1 (en) * | 2005-12-30 | 2007-07-05 | Brother Kogyo Kabushiki Kaisha | Thin-film forming method and mask used therefor |
JP2007266074A (ja) * | 2006-03-27 | 2007-10-11 | Toshiba Corp | 半導体装置の製造方法及び液浸リソグラフィーシステム |
JP4907400B2 (ja) * | 2006-07-25 | 2012-03-28 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
US8194232B2 (en) * | 2007-07-24 | 2012-06-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method |
US8547527B2 (en) * | 2007-07-24 | 2013-10-01 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method |
US20090051895A1 (en) * | 2007-08-24 | 2009-02-26 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system |
US8023106B2 (en) * | 2007-08-24 | 2011-09-20 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
JP4661942B2 (ja) * | 2008-05-13 | 2011-03-30 | ソニー株式会社 | マイクロチップとその流路構造 |
JP5573046B2 (ja) * | 2009-08-24 | 2014-08-20 | 富士通株式会社 | 成膜装置及び成膜方法 |
WO2013158178A2 (en) * | 2012-01-27 | 2013-10-24 | Ndsu Research Foundation | Micro cold spray direct write systems and methods for printed micro electronics |
WO2014098905A1 (en) * | 2012-12-21 | 2014-06-26 | Clearedge Power Corporation | Deposition cloud tower with adjustable field |
JP6432236B2 (ja) * | 2014-09-17 | 2018-12-05 | 富士ゼロックス株式会社 | 粉体塗装装置、及び粉体塗装方法 |
CN104294206B (zh) * | 2014-10-09 | 2016-05-04 | 沈阳富创精密设备有限公司 | 一种半导体装备用抗高温蠕变接地基片的制备方法 |
US10130961B2 (en) * | 2014-11-07 | 2018-11-20 | National Technology & Engineering Solutions Of Sandia, Llc | Two-fluid hydrodynamic printing |
US10294567B2 (en) * | 2014-12-11 | 2019-05-21 | The Research Foundation For The State University Of New York | Electroless copper plating polydopamine nanoparticles |
US9446422B2 (en) * | 2015-02-10 | 2016-09-20 | Nordson Corporation | Adhesive dispensing module and method of spraying a plurality of droplets of a liquid adhesive |
-
2013
- 2013-02-14 US US14/766,494 patent/US9839932B2/en not_active Expired - Fee Related
- 2013-02-14 JP JP2015500038A patent/JP5956053B2/ja not_active Expired - Fee Related
- 2013-02-14 CN CN201380073044.0A patent/CN104994964B/zh not_active Expired - Fee Related
- 2013-02-14 WO PCT/JP2013/053492 patent/WO2014125591A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5673579A (en) * | 1979-11-19 | 1981-06-18 | Konishiroku Photo Ind Co Ltd | Production of coated object |
JPS57203789A (en) * | 1981-06-11 | 1982-12-14 | Inoue Japax Res Inc | Partial plating device |
JPH0299166A (ja) * | 1988-10-04 | 1990-04-11 | Fuji Photo Film Co Ltd | 塗布層縁部の吸引処理方法 |
JPH03151070A (ja) * | 1989-11-06 | 1991-06-27 | Agency Of Ind Science & Technol | 吐出ノズル |
JPH091024A (ja) * | 1995-06-20 | 1997-01-07 | Nec Corp | ディスペンサ装置 |
JP2003033699A (ja) * | 2001-07-26 | 2003-02-04 | Nichiden Tekkosho:Kk | 真空塗装方法及び装置 |
JP2010172817A (ja) * | 2009-01-29 | 2010-08-12 | Micronics Japan Co Ltd | 金属微粒子の噴射ノズル |
Also Published As
Publication number | Publication date |
---|---|
JPWO2014125591A1 (ja) | 2017-02-02 |
WO2014125591A1 (ja) | 2014-08-21 |
CN104994964A (zh) | 2015-10-21 |
US20150376796A1 (en) | 2015-12-31 |
US9839932B2 (en) | 2017-12-12 |
CN104994964B (zh) | 2017-05-10 |
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