JPS57203789A - Partial plating device - Google Patents
Partial plating deviceInfo
- Publication number
- JPS57203789A JPS57203789A JP8890881A JP8890881A JPS57203789A JP S57203789 A JPS57203789 A JP S57203789A JP 8890881 A JP8890881 A JP 8890881A JP 8890881 A JP8890881 A JP 8890881A JP S57203789 A JPS57203789 A JP S57203789A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- soln
- nozzle
- plated
- plating soln
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To perform partial plating efficiently at accurate liquid temps. with a simple device by providing a heater in the nozzle part that supplies a plating soln. onto the body to be plated, and heating the plating soln. just prior to ejection to prescribed liquid temp.
CONSTITUTION: A plating soln. supplied through a hose 4 from a plating soln. tank by a pump 12 is ejected through a nozzle 3 which is fixed on a nozzle body 2 and serves also as an electrode, onto a body 1 to be plated fixed in a plating tank 8, and electricity is conducted between said nozzle 3 and the body 1, whereby said body is plated. The plating soln. is heated by an induction coil 5 connecting to a high frequency electric power source 6. The body 1 receives plating in required parts in accordance with programs by cross sliding tables 9, 10 which are numerically controlled or profile-controlled in X-, Y-directions. It is also possible to heat the plating soln. with an electric wire heater and to control the soln. temp. by using a liquid temp. detecting sensor.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8890881A JPS57203789A (en) | 1981-06-11 | 1981-06-11 | Partial plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8890881A JPS57203789A (en) | 1981-06-11 | 1981-06-11 | Partial plating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57203789A true JPS57203789A (en) | 1982-12-14 |
Family
ID=13956035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8890881A Pending JPS57203789A (en) | 1981-06-11 | 1981-06-11 | Partial plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57203789A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60130151A (en) * | 1983-12-16 | 1985-07-11 | Toppan Printing Co Ltd | Manufacture of lead frame |
JPS61231184A (en) * | 1985-04-08 | 1986-10-15 | Hitachi Ltd | Device for working local position |
JPH0314155U (en) * | 1989-06-28 | 1991-02-13 | ||
JP2000129490A (en) * | 1998-10-21 | 2000-05-09 | Ebara Corp | Electroplating method and electroplating device |
JP2010172817A (en) * | 2009-01-29 | 2010-08-12 | Micronics Japan Co Ltd | Spraying nozzle for metal particulate |
WO2014125591A1 (en) * | 2013-02-14 | 2014-08-21 | 株式会社島津製作所 | Surface chemical treatment apparatus for fine patterning |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5314916B2 (en) * | 1975-04-25 | 1978-05-20 |
-
1981
- 1981-06-11 JP JP8890881A patent/JPS57203789A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5314916B2 (en) * | 1975-04-25 | 1978-05-20 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60130151A (en) * | 1983-12-16 | 1985-07-11 | Toppan Printing Co Ltd | Manufacture of lead frame |
JPS61231184A (en) * | 1985-04-08 | 1986-10-15 | Hitachi Ltd | Device for working local position |
JPH0314155U (en) * | 1989-06-28 | 1991-02-13 | ||
JP2000129490A (en) * | 1998-10-21 | 2000-05-09 | Ebara Corp | Electroplating method and electroplating device |
JP2010172817A (en) * | 2009-01-29 | 2010-08-12 | Micronics Japan Co Ltd | Spraying nozzle for metal particulate |
WO2014125591A1 (en) * | 2013-02-14 | 2014-08-21 | 株式会社島津製作所 | Surface chemical treatment apparatus for fine patterning |
JP5956053B2 (en) * | 2013-02-14 | 2016-07-20 | 株式会社島津製作所 | Surface chemical processing equipment for fine patterning |
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