JPS57203789A - Partial plating device - Google Patents

Partial plating device

Info

Publication number
JPS57203789A
JPS57203789A JP8890881A JP8890881A JPS57203789A JP S57203789 A JPS57203789 A JP S57203789A JP 8890881 A JP8890881 A JP 8890881A JP 8890881 A JP8890881 A JP 8890881A JP S57203789 A JPS57203789 A JP S57203789A
Authority
JP
Japan
Prior art keywords
plating
soln
nozzle
plated
plating soln
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8890881A
Other languages
Japanese (ja)
Inventor
Kiyoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INOUE JAPAX KENKYUSHO KK
Inoue Japax Research Inc
Original Assignee
INOUE JAPAX KENKYUSHO KK
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INOUE JAPAX KENKYUSHO KK, Inoue Japax Research Inc filed Critical INOUE JAPAX KENKYUSHO KK
Priority to JP8890881A priority Critical patent/JPS57203789A/en
Publication of JPS57203789A publication Critical patent/JPS57203789A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To perform partial plating efficiently at accurate liquid temps. with a simple device by providing a heater in the nozzle part that supplies a plating soln. onto the body to be plated, and heating the plating soln. just prior to ejection to prescribed liquid temp.
CONSTITUTION: A plating soln. supplied through a hose 4 from a plating soln. tank by a pump 12 is ejected through a nozzle 3 which is fixed on a nozzle body 2 and serves also as an electrode, onto a body 1 to be plated fixed in a plating tank 8, and electricity is conducted between said nozzle 3 and the body 1, whereby said body is plated. The plating soln. is heated by an induction coil 5 connecting to a high frequency electric power source 6. The body 1 receives plating in required parts in accordance with programs by cross sliding tables 9, 10 which are numerically controlled or profile-controlled in X-, Y-directions. It is also possible to heat the plating soln. with an electric wire heater and to control the soln. temp. by using a liquid temp. detecting sensor.
COPYRIGHT: (C)1982,JPO&Japio
JP8890881A 1981-06-11 1981-06-11 Partial plating device Pending JPS57203789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8890881A JPS57203789A (en) 1981-06-11 1981-06-11 Partial plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8890881A JPS57203789A (en) 1981-06-11 1981-06-11 Partial plating device

Publications (1)

Publication Number Publication Date
JPS57203789A true JPS57203789A (en) 1982-12-14

Family

ID=13956035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8890881A Pending JPS57203789A (en) 1981-06-11 1981-06-11 Partial plating device

Country Status (1)

Country Link
JP (1) JPS57203789A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130151A (en) * 1983-12-16 1985-07-11 Toppan Printing Co Ltd Manufacture of lead frame
JPS61231184A (en) * 1985-04-08 1986-10-15 Hitachi Ltd Device for working local position
JPH0314155U (en) * 1989-06-28 1991-02-13
JP2000129490A (en) * 1998-10-21 2000-05-09 Ebara Corp Electroplating method and electroplating device
JP2010172817A (en) * 2009-01-29 2010-08-12 Micronics Japan Co Ltd Spraying nozzle for metal particulate
WO2014125591A1 (en) * 2013-02-14 2014-08-21 株式会社島津製作所 Surface chemical treatment apparatus for fine patterning

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314916B2 (en) * 1975-04-25 1978-05-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5314916B2 (en) * 1975-04-25 1978-05-20

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130151A (en) * 1983-12-16 1985-07-11 Toppan Printing Co Ltd Manufacture of lead frame
JPS61231184A (en) * 1985-04-08 1986-10-15 Hitachi Ltd Device for working local position
JPH0314155U (en) * 1989-06-28 1991-02-13
JP2000129490A (en) * 1998-10-21 2000-05-09 Ebara Corp Electroplating method and electroplating device
JP2010172817A (en) * 2009-01-29 2010-08-12 Micronics Japan Co Ltd Spraying nozzle for metal particulate
WO2014125591A1 (en) * 2013-02-14 2014-08-21 株式会社島津製作所 Surface chemical treatment apparatus for fine patterning
JP5956053B2 (en) * 2013-02-14 2016-07-20 株式会社島津製作所 Surface chemical processing equipment for fine patterning

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