JPS5314916B2 - - Google Patents
Info
- Publication number
- JPS5314916B2 JPS5314916B2 JP5044875A JP5044875A JPS5314916B2 JP S5314916 B2 JPS5314916 B2 JP S5314916B2 JP 5044875 A JP5044875 A JP 5044875A JP 5044875 A JP5044875 A JP 5044875A JP S5314916 B2 JPS5314916 B2 JP S5314916B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5044875A JPS51126764A (en) | 1975-04-25 | 1975-04-25 | Resin sealed semiconductor unit manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5044875A JPS51126764A (en) | 1975-04-25 | 1975-04-25 | Resin sealed semiconductor unit manufacturing process |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51126764A JPS51126764A (en) | 1976-11-05 |
JPS5314916B2 true JPS5314916B2 (en) | 1978-05-20 |
Family
ID=12859134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5044875A Granted JPS51126764A (en) | 1975-04-25 | 1975-04-25 | Resin sealed semiconductor unit manufacturing process |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51126764A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57203789A (en) * | 1981-06-11 | 1982-12-14 | Inoue Japax Res Inc | Partial plating device |
JPS63153293A (en) * | 1986-12-17 | 1988-06-25 | Chugoku Denka Kogyo Kk | Surface treatment of work |
JPH0532538Y2 (en) * | 1990-03-15 | 1993-08-19 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821849A (en) * | 1981-07-31 | 1983-02-08 | Nec Home Electronics Ltd | Resin-sealed semiconductor device |
JPS5899842U (en) * | 1981-12-28 | 1983-07-07 | 富士通株式会社 | semiconductor equipment |
-
1975
- 1975-04-25 JP JP5044875A patent/JPS51126764A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57203789A (en) * | 1981-06-11 | 1982-12-14 | Inoue Japax Res Inc | Partial plating device |
JPS63153293A (en) * | 1986-12-17 | 1988-06-25 | Chugoku Denka Kogyo Kk | Surface treatment of work |
JPH0532538Y2 (en) * | 1990-03-15 | 1993-08-19 |
Also Published As
Publication number | Publication date |
---|---|
JPS51126764A (en) | 1976-11-05 |