JP5952849B2 - フラックス及びソルダペースト - Google Patents

フラックス及びソルダペースト Download PDF

Info

Publication number
JP5952849B2
JP5952849B2 JP2014062417A JP2014062417A JP5952849B2 JP 5952849 B2 JP5952849 B2 JP 5952849B2 JP 2014062417 A JP2014062417 A JP 2014062417A JP 2014062417 A JP2014062417 A JP 2014062417A JP 5952849 B2 JP5952849 B2 JP 5952849B2
Authority
JP
Japan
Prior art keywords
flux
long
chain dibasic
mass
dibasic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014062417A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015182125A (ja
JP2015182125A5 (OSRAM
Inventor
上畑　雅司
雅司 上畑
康之 山側
康之 山側
和哉 北沢
和哉 北沢
善範 ▲高▼木
善範 ▲高▼木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okamura Oil Mill Ltd
Senju Metal Industry Co Ltd
Original Assignee
Okamura Oil Mill Ltd
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014062417A priority Critical patent/JP5952849B2/ja
Application filed by Okamura Oil Mill Ltd, Senju Metal Industry Co Ltd filed Critical Okamura Oil Mill Ltd
Priority to CN201580016031.9A priority patent/CN106132629B/zh
Priority to US15/128,231 priority patent/US9902022B2/en
Priority to PCT/JP2015/055781 priority patent/WO2015146473A1/ja
Priority to EP15770209.3A priority patent/EP3124167B1/en
Priority to KR1020167029054A priority patent/KR101712787B1/ko
Priority to TW104106780A priority patent/TWI596154B/zh
Publication of JP2015182125A publication Critical patent/JP2015182125A/ja
Publication of JP2015182125A5 publication Critical patent/JP2015182125A5/ja
Application granted granted Critical
Publication of JP5952849B2 publication Critical patent/JP5952849B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2014062417A 2014-03-25 2014-03-25 フラックス及びソルダペースト Active JP5952849B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014062417A JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト
US15/128,231 US9902022B2 (en) 2014-03-25 2015-02-27 Flux and solder paste
PCT/JP2015/055781 WO2015146473A1 (ja) 2014-03-25 2015-02-27 フラックス及びソルダペースト
EP15770209.3A EP3124167B1 (en) 2014-03-25 2015-02-27 Flux and solder paste
CN201580016031.9A CN106132629B (zh) 2014-03-25 2015-02-27 助焊剂及焊膏
KR1020167029054A KR101712787B1 (ko) 2014-03-25 2015-02-27 플럭스 및 솔더 페이스트
TW104106780A TWI596154B (zh) 2014-03-25 2015-03-04 Flux and solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014062417A JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト

Publications (3)

Publication Number Publication Date
JP2015182125A JP2015182125A (ja) 2015-10-22
JP2015182125A5 JP2015182125A5 (OSRAM) 2016-03-31
JP5952849B2 true JP5952849B2 (ja) 2016-07-13

Family

ID=54195004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014062417A Active JP5952849B2 (ja) 2014-03-25 2014-03-25 フラックス及びソルダペースト

Country Status (7)

Country Link
US (1) US9902022B2 (OSRAM)
EP (1) EP3124167B1 (OSRAM)
JP (1) JP5952849B2 (OSRAM)
KR (1) KR101712787B1 (OSRAM)
CN (1) CN106132629B (OSRAM)
TW (1) TWI596154B (OSRAM)
WO (1) WO2015146473A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5962832B1 (ja) * 2015-09-18 2016-08-03 千住金属工業株式会社 フラックス
JP2017130623A (ja) * 2016-01-22 2017-07-27 株式会社村田製作所 充填用ペースト材料、それを用いたビアホール導体の製造方法および多層基板の製造方法
JP2017183571A (ja) * 2016-03-31 2017-10-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6536503B2 (ja) * 2016-07-12 2019-07-03 千住金属工業株式会社 フラックス
JP6399242B1 (ja) * 2018-01-17 2018-10-03 千住金属工業株式会社 フラックス及びソルダペースト
EP3763477A4 (en) 2018-03-09 2021-11-17 Origin Company, Limited FLUX, SOLDER PASTE, SOLDERING METHOD, METHOD FOR MANUFACTURING A SOLDERING PRODUCT, AND METHOD FOR MANUFACTURING BGA PACKAGING
US11833622B2 (en) 2018-08-10 2023-12-05 Koki Company Limited Flux and solder paste
JP7724477B2 (ja) 2020-03-17 2025-08-18 パナソニックＩｐマネジメント株式会社 フラックス用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法
JP7620916B2 (ja) 2020-12-17 2025-01-24 パナソニックＩｐマネジメント株式会社 フラックス用樹脂組成物、電子部品、電子部品の製造方法、実装構造体及び実装構造体の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9808587D0 (en) * 1998-04-22 1998-06-24 Craig Hugh P Adhesive and encapsulating material with fluxing properties
GB2353528A (en) 1998-04-22 2001-02-28 Multicore Solders Ltd Adhesive and encapsulating material with fluxing properties
JP4504481B2 (ja) * 1998-11-26 2010-07-14 岡村製油株式会社 長鎖二塩基酸組成物及びこれを用いる電解液
TW527253B (en) 1999-10-05 2003-04-11 Tdk Corp Soldering flux, soldering paste and soldering process
JP3849842B2 (ja) * 1999-10-05 2006-11-22 Ｔｄｋ株式会社 はんだ付け用フラックス、はんだぺ一スト、電子部品装置、電子回路モジュール、電子回路装置、及び、はんだ付け方法
JP2001219294A (ja) * 1999-12-03 2001-08-14 Tdk Corp 熱硬化性はんだ付け用フラックスおよびはんだ付け方法
CN1181949C (zh) 1999-12-27 2004-12-29 住友电木株式会社 可固化助焊剂及可固化助焊剂增强的半导体封装和半导体器件以及制造半导体封装和半导体器件的方法
JP3791403B2 (ja) * 2000-12-04 2006-06-28 富士電機ホールディングス株式会社 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物
JP3888573B2 (ja) 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3702418B2 (ja) 2002-03-07 2005-10-05 株式会社 東京第一商興 ソルダペースト用フラックス及びソルダペースト
TW200634127A (en) 2004-12-15 2006-10-01 Tamurakaken Corp An electrically conductive adhesive, electrical part and electrical part module were made of it
CN101232967B (zh) 2005-08-11 2010-12-08 千住金属工业株式会社 电子部件用无铅焊膏、钎焊方法以及电子部件
JP5760170B2 (ja) * 2010-11-30 2015-08-05 パナソニックＩｐマネジメント株式会社 はんだペースト
US8070043B1 (en) 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
US8430295B2 (en) 2011-09-30 2013-04-30 Rohm And Haas Electronic Materials Llc Curable flux composition and method of soldering
KR20140116216A (ko) 2012-02-24 2014-10-01 히타치가세이가부시끼가이샤 반도체용 접착제, 플럭스제, 반도체 장치의 제조 방법 및 반도체 장치

Also Published As

Publication number Publication date
CN106132629A (zh) 2016-11-16
CN106132629B (zh) 2017-10-13
EP3124167A1 (en) 2017-02-01
KR20160133558A (ko) 2016-11-22
US9902022B2 (en) 2018-02-27
TWI596154B (zh) 2017-08-21
EP3124167A4 (en) 2017-09-20
JP2015182125A (ja) 2015-10-22
TW201602219A (zh) 2016-01-16
EP3124167B1 (en) 2019-05-08
WO2015146473A1 (ja) 2015-10-01
KR101712787B1 (ko) 2017-03-06
US20170190005A1 (en) 2017-07-06

Similar Documents

Publication Publication Date Title
JP5952849B2 (ja) フラックス及びソルダペースト
JP5935947B2 (ja) 導電性接合剤およびはんだ継手
US8227536B2 (en) Lead-free solder paste and its use
TWI582915B (zh) Mounting structure and manufacturing method thereof
CN107848081A (zh) 膏状热固化性树脂组合物、半导体部件、半导体安装品、半导体部件的制造方法、半导体安装品的制造方法
JP7126167B2 (ja) はんだペーストおよび実装構造体
WO2016016916A1 (ja) 半導体部品とそれを用いた半導体実装品、半導体実装品の製造方法
JP2021178336A (ja) 樹脂フラックスはんだペーストおよび実装構造体
JP6152899B2 (ja) 半田付け用フラックス及び半田組成物
TWI659990B (zh) Flux
JP5560032B2 (ja) はんだ接合補強剤組成物、及びこれを用いた実装基板の製造方法
KR20150111403A (ko) 전자부품을 접합하기 위한 무연납땜용 플럭스 및 페이스트, 이를 이용하여 납땜하는 방법
JP6115762B2 (ja) 回路装置の製造方法
JP6048562B1 (ja) フラックス残渣の接着強度測定方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160210

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160210

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20160210

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20160223

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160301

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160330

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160419

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160512

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160531

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160610

R150 Certificate of patent or registration of utility model

Ref document number: 5952849

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250