JP5950228B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP5950228B2
JP5950228B2 JP2012155793A JP2012155793A JP5950228B2 JP 5950228 B2 JP5950228 B2 JP 5950228B2 JP 2012155793 A JP2012155793 A JP 2012155793A JP 2012155793 A JP2012155793 A JP 2012155793A JP 5950228 B2 JP5950228 B2 JP 5950228B2
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JP
Japan
Prior art keywords
heat
fan
air
radiator
dust removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012155793A
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English (en)
Japanese (ja)
Other versions
JP2013042122A (ja
JP2013042122A5 (enExample
Inventor
和弘 白神
和弘 白神
真司 後藤
真司 後藤
尚之 伊藤
尚之 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2012155793A priority Critical patent/JP5950228B2/ja
Priority to US13/550,619 priority patent/US8867208B2/en
Publication of JP2013042122A publication Critical patent/JP2013042122A/ja
Publication of JP2013042122A5 publication Critical patent/JP2013042122A5/ja
Application granted granted Critical
Publication of JP5950228B2 publication Critical patent/JP5950228B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2012155793A 2011-07-19 2012-07-11 電子機器 Active JP5950228B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012155793A JP5950228B2 (ja) 2011-07-19 2012-07-11 電子機器
US13/550,619 US8867208B2 (en) 2011-07-19 2012-07-17 Electronic device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011157548 2011-07-19
JP2011157548 2011-07-19
JP2012155793A JP5950228B2 (ja) 2011-07-19 2012-07-11 電子機器

Publications (3)

Publication Number Publication Date
JP2013042122A JP2013042122A (ja) 2013-02-28
JP2013042122A5 JP2013042122A5 (enExample) 2014-10-30
JP5950228B2 true JP5950228B2 (ja) 2016-07-13

Family

ID=47555622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012155793A Active JP5950228B2 (ja) 2011-07-19 2012-07-11 電子機器

Country Status (2)

Country Link
US (1) US8867208B2 (enExample)
JP (1) JP5950228B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399212A (en) * 1992-04-23 1995-03-21 Aluminum Company Of America High strength titanium-aluminum alloy having improved fatigue crack growth resistance
JP5919568B2 (ja) * 2011-07-25 2016-05-18 パナソニックＩｐマネジメント株式会社 電子機器
CN104279169B (zh) 2013-07-09 2017-10-03 华硕电脑股份有限公司 离心式风扇模块及应用其的电子装置
JP2015053330A (ja) * 2013-09-05 2015-03-19 富士通株式会社 電子機器
US11009301B2 (en) 2014-06-27 2021-05-18 Delta Electronics, Inc. Heat dissipating fin assembly
TWI526626B (zh) * 2014-06-27 2016-03-21 台達電子工業股份有限公司 散熱裝置
WO2017017922A1 (ja) * 2015-07-24 2017-02-02 パナソニックＩｐマネジメント株式会社 温度調和ユニット、温度調和システム、車両
US10565319B1 (en) * 2018-08-15 2020-02-18 Hui Zhao Translation device with two-way projection and voice functions
CN109375747B (zh) * 2018-11-08 2023-03-31 努比亚技术有限公司 散热结构、移动终端及散热方法
JP7436236B2 (ja) * 2020-02-20 2024-02-21 ファナック株式会社 モータ駆動装置
CN113778204A (zh) * 2020-06-09 2021-12-10 英业达科技有限公司 车载电脑、车载电脑的散热系统、及具有车载电脑的车辆
CN214901806U (zh) * 2021-02-24 2021-11-26 深圳市铂盛科技有限公司 带风扇的嵌入式密闭工控机
CN113991463B (zh) * 2021-12-02 2025-05-02 杭州电力设备制造有限公司 一种节能型自动启闭散热的无源式配电箱及其工作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004253506A (ja) * 2003-02-19 2004-09-09 Toshiba Corp 電気機器装置
JP2005321287A (ja) * 2004-05-07 2005-11-17 Sony Corp 冷却装置、電子機器、ヒートシンクおよび放熱フィン
TWI262759B (en) * 2004-05-10 2006-09-21 Asustek Comp Inc Heat spreader with filtering function and electrical apparatus
TWM270405U (en) * 2004-08-19 2005-07-11 Compal Electronics Inc Heat sink device with dust-collection mechanism
JP4493611B2 (ja) * 2005-12-13 2010-06-30 富士通株式会社 電子機器
JP4745206B2 (ja) * 2006-11-30 2011-08-10 株式会社東芝 電子機器
US8016927B2 (en) * 2007-04-11 2011-09-13 Hewlett-Packard Development Company, L.P. Computing device filter system
JP2008306001A (ja) 2007-06-07 2008-12-18 Toshiba Home Technology Corp 冷却装置および電子機器
TWI338830B (en) * 2008-01-11 2011-03-11 Wistron Corp Heat-dissipating module having a dust-removing mechanism and assembly of an electronic device and the heat-dissipating module
JP2010086053A (ja) * 2008-09-29 2010-04-15 Fujitsu Ltd 電子機器
JP2011233849A (ja) * 2010-04-30 2011-11-17 Sony Corp 冷却装置、電子機器及びヒートシンク

Also Published As

Publication number Publication date
JP2013042122A (ja) 2013-02-28
US20130021751A1 (en) 2013-01-24
US8867208B2 (en) 2014-10-21

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