JP5944188B2 - 電子部品基板の製造方法 - Google Patents
電子部品基板の製造方法 Download PDFInfo
- Publication number
- JP5944188B2 JP5944188B2 JP2012054226A JP2012054226A JP5944188B2 JP 5944188 B2 JP5944188 B2 JP 5944188B2 JP 2012054226 A JP2012054226 A JP 2012054226A JP 2012054226 A JP2012054226 A JP 2012054226A JP 5944188 B2 JP5944188 B2 JP 5944188B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulating plate
- bus bars
- substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000758 substrate Substances 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000002184 metal Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Connection Or Junction Boxes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
2 バスバ
3 絶縁板
4a,4b 電子部品
5a,5b 放熱部
6 繋ぎ部
21 部品搭載部
22 端子部
23 中間部
51 絶縁板の外周方向に平行に延びた部分
Claims (3)
- 複数のバスバが絶縁板に取り付けられ、前記複数のバスバに電子部品が電気接続された電子部品基板の製造方法であって、
前記電子部品基板は、いずれかの前記バスバに一体形成された放熱部が、前記絶縁板の外周に沿って複数設けられ、
前記放熱部が、前記絶縁板の厚み方向に立設した一対の部分と、前記一対の部分と交差するとともに前記絶縁板の外周方向に平行に延びた部分と、を一体に備え、
前記各放熱部における前記平行に延びた部分は、前記絶縁板の厚み方向の幅が一定であり、
1枚の金属板から、複数のバスバと、当該金属板の外縁部分に位置し、前記複数のバスバと繋がった幅が一定の帯状の繋ぎ部と、を一括型抜きし、
前記繋ぎ部と繋がった状態の前記複数のバスバを絶縁板に取り付けた後、前記繋ぎ部を一部残して切除し、残された前記繋ぎ部の一部を放熱部とする
ことを特徴とする電子部品基板の製造方法。 - 前記電子部品基板は、前記放熱部が一体形成された前記バスバが、前記電子部品が搭載される部品搭載部と、外部端子が接続される端子部と、前記部品搭載部と前記端子部との間に位置する中間部と、を有し、
前記各放熱部における前記絶縁板の外周方向に平行に延びた部分の幅が、前記中間部の幅よりも大きい
ことを特徴とする請求項1に記載の電子部品基板の製造方法。 - 前記電子部品基板は、前記放熱部が、前記絶縁板の厚み方向に立設している
ことを特徴とする請求項1または請求項2に記載の電子部品基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012054226A JP5944188B2 (ja) | 2012-03-12 | 2012-03-12 | 電子部品基板の製造方法 |
US13/792,467 US20130235531A1 (en) | 2012-03-12 | 2013-03-11 | Electronic component board and production method of the same |
CN201310077787.7A CN103313508B (zh) | 2012-03-12 | 2013-03-12 | 电子部件基板及其制造方法 |
US15/381,380 US10440833B2 (en) | 2012-03-12 | 2016-12-16 | Production method of electronic component board with uncut portions for heat radiating portions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012054226A JP5944188B2 (ja) | 2012-03-12 | 2012-03-12 | 電子部品基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013187525A JP2013187525A (ja) | 2013-09-19 |
JP5944188B2 true JP5944188B2 (ja) | 2016-07-05 |
Family
ID=49113948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012054226A Active JP5944188B2 (ja) | 2012-03-12 | 2012-03-12 | 電子部品基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20130235531A1 (ja) |
JP (1) | JP5944188B2 (ja) |
CN (1) | CN103313508B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5944188B2 (ja) * | 2012-03-12 | 2016-07-05 | 矢崎総業株式会社 | 電子部品基板の製造方法 |
JP6471951B2 (ja) * | 2014-01-08 | 2019-02-20 | パナソニックIpマネジメント株式会社 | コンデンサブロックおよび電力変換装置 |
JP6441112B2 (ja) * | 2014-04-21 | 2018-12-19 | 矢崎総業株式会社 | 電子部品ユニット、及び、ワイヤハーネス |
JP2015208124A (ja) * | 2014-04-21 | 2015-11-19 | 矢崎総業株式会社 | インサートバスバープレート及びその製造方法 |
JP6301178B2 (ja) * | 2014-04-21 | 2018-03-28 | 矢崎総業株式会社 | インサートバスバープレートの製造方法 |
DE102015112785B4 (de) * | 2015-08-04 | 2023-07-06 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Elektrische Kontaktierungsanordnung |
DE102016108323A1 (de) | 2016-05-04 | 2017-11-09 | Fujitsu Limited | Leitung, Anordnung und Servereinschub |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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US4303297A (en) * | 1980-03-26 | 1981-12-01 | Eastman Kodak Company | Socket structure for electrical components |
US4659167A (en) * | 1983-09-30 | 1987-04-21 | Hosiden Electronics Co., Ltd. | Jack with recessed contacts |
US4895536A (en) * | 1984-05-11 | 1990-01-23 | Amp Incorporated | Lead frame assembly having severable electrical circuit sections |
US4783906A (en) * | 1985-11-12 | 1988-11-15 | Amp Incorporated | Method of making a customizable electrical article |
US5184283A (en) * | 1991-12-23 | 1993-02-02 | Ford Motor Company | Power device assembly and method |
JPH09289360A (ja) * | 1996-04-19 | 1997-11-04 | Matsushita Electric Ind Co Ltd | 配線板とその製造方法 |
JP2000245034A (ja) * | 1999-02-24 | 2000-09-08 | Sumitomo Wiring Syst Ltd | 配線板組立体 |
JP2001211529A (ja) | 2000-01-20 | 2001-08-03 | Auto Network Gijutsu Kenkyusho:Kk | 電気接続箱 |
JP3482183B2 (ja) * | 2000-10-30 | 2003-12-22 | Tdk株式会社 | 電子部品の実装構造 |
DE10254910B4 (de) * | 2001-11-26 | 2008-12-24 | AutoNetworks Technologies, Ltd., Nagoya | Schaltkreisbildende Einheit und Verfahren zu deren Herstellung |
JP2003348731A (ja) * | 2002-05-22 | 2003-12-05 | Yazaki Corp | ブスバ配線板及びブスバ配線板の組立方法 |
JP4022440B2 (ja) * | 2002-07-01 | 2007-12-19 | 株式会社オートネットワーク技術研究所 | 回路ユニット |
JP2004253759A (ja) * | 2002-12-24 | 2004-09-09 | Auto Network Gijutsu Kenkyusho:Kk | 制御回路基板及び回路構成体 |
JP4155048B2 (ja) * | 2003-02-14 | 2008-09-24 | 住友電装株式会社 | パワーモジュール及びその製造方法 |
JP2005185056A (ja) * | 2003-12-22 | 2005-07-07 | T An T:Kk | 車両室内灯用バスバー基板 |
JP2005329883A (ja) * | 2004-05-21 | 2005-12-02 | Yazaki Corp | 車両用室内照明灯 |
JP4619992B2 (ja) * | 2006-05-30 | 2011-01-26 | 矢崎総業株式会社 | 電気接続箱 |
CN101998764B (zh) * | 2009-08-20 | 2012-08-08 | 中达电通股份有限公司 | 一种矩阵式金属氧化物压敏电阻电路板结构及其制造方法 |
JP4934211B2 (ja) * | 2010-03-16 | 2012-05-16 | シークス株式会社 | 電子機器の筺体 |
JP5632672B2 (ja) * | 2010-07-29 | 2014-11-26 | 矢崎総業株式会社 | ヒューズユニット |
JP5944188B2 (ja) * | 2012-03-12 | 2016-07-05 | 矢崎総業株式会社 | 電子部品基板の製造方法 |
-
2012
- 2012-03-12 JP JP2012054226A patent/JP5944188B2/ja active Active
-
2013
- 2013-03-11 US US13/792,467 patent/US20130235531A1/en not_active Abandoned
- 2013-03-12 CN CN201310077787.7A patent/CN103313508B/zh active Active
-
2016
- 2016-12-16 US US15/381,380 patent/US10440833B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20130235531A1 (en) | 2013-09-12 |
CN103313508A (zh) | 2013-09-18 |
JP2013187525A (ja) | 2013-09-19 |
US20170150612A1 (en) | 2017-05-25 |
US10440833B2 (en) | 2019-10-08 |
CN103313508B (zh) | 2016-01-27 |
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