JP5935672B2 - スイッチング素子ユニット - Google Patents

スイッチング素子ユニット Download PDF

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Publication number
JP5935672B2
JP5935672B2 JP2012263052A JP2012263052A JP5935672B2 JP 5935672 B2 JP5935672 B2 JP 5935672B2 JP 2012263052 A JP2012263052 A JP 2012263052A JP 2012263052 A JP2012263052 A JP 2012263052A JP 5935672 B2 JP5935672 B2 JP 5935672B2
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JP
Japan
Prior art keywords
switching element
arrangement surface
terminal
connection electrode
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012263052A
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English (en)
Japanese (ja)
Other versions
JP2013179261A5 (https=
JP2013179261A (ja
Inventor
浩久 戸谷
浩久 戸谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aisin AW Co Ltd
Original Assignee
Aisin AW Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012263052A priority Critical patent/JP5935672B2/ja
Application filed by Aisin AW Co Ltd filed Critical Aisin AW Co Ltd
Priority to EP13706754.2A priority patent/EP2766930B1/en
Priority to CN201380004115.1A priority patent/CN104160501B/zh
Priority to KR1020147014786A priority patent/KR101691707B1/ko
Priority to US14/359,486 priority patent/US9177948B2/en
Priority to PCT/JP2013/052429 priority patent/WO2013115395A1/en
Publication of JP2013179261A publication Critical patent/JP2013179261A/ja
Publication of JP2013179261A5 publication Critical patent/JP2013179261A5/ja
Application granted granted Critical
Publication of JP5935672B2 publication Critical patent/JP5935672B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/12—Arrangements for reducing harmonics from AC input or output
    • H02M1/126—Arrangements for reducing harmonics from AC input or output using passive filters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • General Engineering & Computer Science (AREA)
JP2012263052A 2012-01-31 2012-11-30 スイッチング素子ユニット Expired - Fee Related JP5935672B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012263052A JP5935672B2 (ja) 2012-01-31 2012-11-30 スイッチング素子ユニット
CN201380004115.1A CN104160501B (zh) 2012-01-31 2013-01-29 开关元件单元
KR1020147014786A KR101691707B1 (ko) 2012-01-31 2013-01-29 스위칭소자 유닛
US14/359,486 US9177948B2 (en) 2012-01-31 2013-01-29 Switching element unit
EP13706754.2A EP2766930B1 (en) 2012-01-31 2013-01-29 Switching element unit
PCT/JP2013/052429 WO2013115395A1 (en) 2012-01-31 2013-01-29 Switching element unit

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012019132 2012-01-31
JP2012019132 2012-01-31
JP2012263052A JP5935672B2 (ja) 2012-01-31 2012-11-30 スイッチング素子ユニット

Publications (3)

Publication Number Publication Date
JP2013179261A JP2013179261A (ja) 2013-09-09
JP2013179261A5 JP2013179261A5 (https=) 2014-05-01
JP5935672B2 true JP5935672B2 (ja) 2016-06-15

Family

ID=47754926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012263052A Expired - Fee Related JP5935672B2 (ja) 2012-01-31 2012-11-30 スイッチング素子ユニット

Country Status (6)

Country Link
US (1) US9177948B2 (https=)
EP (1) EP2766930B1 (https=)
JP (1) JP5935672B2 (https=)
KR (1) KR101691707B1 (https=)
CN (1) CN104160501B (https=)
WO (1) WO2013115395A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029944A (ja) * 2012-07-31 2014-02-13 Aisin Aw Co Ltd スイッチング素子ユニット
JP2015060991A (ja) * 2013-09-19 2015-03-30 パナソニックＩｐマネジメント株式会社 半導体装置及びそれを用いた半導体リレー
JP2015191902A (ja) * 2014-03-27 2015-11-02 トヨタ自動車株式会社 半導体モジュール
DE102014111421A1 (de) * 2014-08-11 2016-02-11 Woodward Kempen Gmbh Niederinduktive Schaltungsanordnung eines Umrichters
JP6361447B2 (ja) * 2014-10-15 2018-07-25 住友電気工業株式会社 半導体モジュール
JP6407300B2 (ja) * 2014-11-06 2018-10-17 三菱電機株式会社 半導体モジュールおよび半導体モジュール用の導電部材
US9681568B1 (en) * 2015-12-02 2017-06-13 Ge Energy Power Conversion Technology Ltd Compact stacked power modules for minimizing commutating inductance and methods for making the same
DE102018124695A1 (de) * 2017-11-15 2019-05-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrieren von Passivvorrichtungen in Package-Strukturen
US20230411367A1 (en) * 2020-11-09 2023-12-21 Rohm Co., Ltd. Discharge circuit module
DE102022208266A1 (de) * 2022-08-09 2024-02-15 Magna powertrain gmbh & co kg Leistungsmodul mit flexibler Leiterplatte

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961917A (ja) * 1982-10-01 1984-04-09 松下電器産業株式会社 複合電子部品
US5095402A (en) * 1990-10-02 1992-03-10 Rogers Corporation Internally decoupled integrated circuit package
JPH05152161A (ja) * 1992-02-10 1993-06-18 Tdk Corp 複合部品
JPH08181445A (ja) 1994-12-22 1996-07-12 Sumitomo Metal Ind Ltd セラミックス多層基板
JPH11178353A (ja) 1997-12-11 1999-07-02 Hitachi Ltd 共振形インバータ及びそれを用いた電気車
US6373127B1 (en) * 1998-09-29 2002-04-16 Texas Instruments Incorporated Integrated capacitor on the back of a chip
JP4270864B2 (ja) * 2000-08-18 2009-06-03 三菱電機株式会社 パワーモジュール
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
JP3847676B2 (ja) * 2002-07-15 2006-11-22 三菱電機株式会社 パワー半導体装置
US6987670B2 (en) * 2003-05-16 2006-01-17 Ballard Power Systems Corporation Dual power module power system architecture
US7443692B2 (en) 2003-05-16 2008-10-28 Continental Automotive Systems Us, Inc. Power converter architecture employing at least one capacitor across a DC bus
JP4038455B2 (ja) * 2003-08-21 2008-01-23 三菱電機株式会社 半導体装置
JP2006190972A (ja) 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
JP4661645B2 (ja) * 2005-03-23 2011-03-30 トヨタ自動車株式会社 パワー半導体モジュール
JP4651653B2 (ja) * 2007-10-15 2011-03-16 三菱電機株式会社 電力変換装置
US8253241B2 (en) * 2008-05-20 2012-08-28 Infineon Technologies Ag Electronic module

Also Published As

Publication number Publication date
EP2766930A1 (en) 2014-08-20
CN104160501A (zh) 2014-11-19
CN104160501B (zh) 2016-11-09
JP2013179261A (ja) 2013-09-09
KR101691707B1 (ko) 2016-12-30
WO2013115395A1 (en) 2013-08-08
KR20140090228A (ko) 2014-07-16
US9177948B2 (en) 2015-11-03
US20140264519A1 (en) 2014-09-18
EP2766930B1 (en) 2018-04-04

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