KR101691707B1 - 스위칭소자 유닛 - Google Patents

스위칭소자 유닛 Download PDF

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Publication number
KR101691707B1
KR101691707B1 KR1020147014786A KR20147014786A KR101691707B1 KR 101691707 B1 KR101691707 B1 KR 101691707B1 KR 1020147014786 A KR1020147014786 A KR 1020147014786A KR 20147014786 A KR20147014786 A KR 20147014786A KR 101691707 B1 KR101691707 B1 KR 101691707B1
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KR
South Korea
Prior art keywords
switching element
terminal
capacitor
electrode
placement surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020147014786A
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English (en)
Korean (ko)
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KR20140090228A (ko
Inventor
히로히사 도타니
Original Assignee
아이신에이더블류 가부시키가이샤
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Application filed by 아이신에이더블류 가부시키가이샤 filed Critical 아이신에이더블류 가부시키가이샤
Publication of KR20140090228A publication Critical patent/KR20140090228A/ko
Application granted granted Critical
Publication of KR101691707B1 publication Critical patent/KR101691707B1/ko
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/12—Arrangements for reducing harmonics from AC input or output
    • H02M1/126—Arrangements for reducing harmonics from AC input or output using passive filters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/501—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/601—Capacitive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Inverter Devices (AREA)
  • General Engineering & Computer Science (AREA)
KR1020147014786A 2012-01-31 2013-01-29 스위칭소자 유닛 Expired - Fee Related KR101691707B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012019132 2012-01-31
JPJP-P-2012-019132 2012-01-31
JPJP-P-2012-263052 2012-11-30
JP2012263052A JP5935672B2 (ja) 2012-01-31 2012-11-30 スイッチング素子ユニット
PCT/JP2013/052429 WO2013115395A1 (en) 2012-01-31 2013-01-29 Switching element unit

Publications (2)

Publication Number Publication Date
KR20140090228A KR20140090228A (ko) 2014-07-16
KR101691707B1 true KR101691707B1 (ko) 2016-12-30

Family

ID=47754926

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147014786A Expired - Fee Related KR101691707B1 (ko) 2012-01-31 2013-01-29 스위칭소자 유닛

Country Status (6)

Country Link
US (1) US9177948B2 (https=)
EP (1) EP2766930B1 (https=)
JP (1) JP5935672B2 (https=)
KR (1) KR101691707B1 (https=)
CN (1) CN104160501B (https=)
WO (1) WO2013115395A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014029944A (ja) * 2012-07-31 2014-02-13 Aisin Aw Co Ltd スイッチング素子ユニット
JP2015060991A (ja) * 2013-09-19 2015-03-30 パナソニックＩｐマネジメント株式会社 半導体装置及びそれを用いた半導体リレー
JP2015191902A (ja) * 2014-03-27 2015-11-02 トヨタ自動車株式会社 半導体モジュール
DE102014111421A1 (de) * 2014-08-11 2016-02-11 Woodward Kempen Gmbh Niederinduktive Schaltungsanordnung eines Umrichters
JP6361447B2 (ja) * 2014-10-15 2018-07-25 住友電気工業株式会社 半導体モジュール
JP6407300B2 (ja) * 2014-11-06 2018-10-17 三菱電機株式会社 半導体モジュールおよび半導体モジュール用の導電部材
US9681568B1 (en) * 2015-12-02 2017-06-13 Ge Energy Power Conversion Technology Ltd Compact stacked power modules for minimizing commutating inductance and methods for making the same
DE102018124695A1 (de) * 2017-11-15 2019-05-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrieren von Passivvorrichtungen in Package-Strukturen
US20230411367A1 (en) * 2020-11-09 2023-12-21 Rohm Co., Ltd. Discharge circuit module
DE102022208266A1 (de) * 2022-08-09 2024-02-15 Magna powertrain gmbh & co kg Leistungsmodul mit flexibler Leiterplatte

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072147A (ja) * 2003-08-21 2005-03-17 Mitsubishi Electric Corp 半導体装置
JP2009100514A (ja) * 2007-10-15 2009-05-07 Mitsubishi Electric Corp 電力変換装置

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Publication number Priority date Publication date Assignee Title
JPS5961917A (ja) * 1982-10-01 1984-04-09 松下電器産業株式会社 複合電子部品
US5095402A (en) * 1990-10-02 1992-03-10 Rogers Corporation Internally decoupled integrated circuit package
JPH05152161A (ja) * 1992-02-10 1993-06-18 Tdk Corp 複合部品
JPH08181445A (ja) 1994-12-22 1996-07-12 Sumitomo Metal Ind Ltd セラミックス多層基板
JPH11178353A (ja) 1997-12-11 1999-07-02 Hitachi Ltd 共振形インバータ及びそれを用いた電気車
US6373127B1 (en) * 1998-09-29 2002-04-16 Texas Instruments Incorporated Integrated capacitor on the back of a chip
JP4270864B2 (ja) * 2000-08-18 2009-06-03 三菱電機株式会社 パワーモジュール
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
JP3847676B2 (ja) * 2002-07-15 2006-11-22 三菱電機株式会社 パワー半導体装置
US6987670B2 (en) * 2003-05-16 2006-01-17 Ballard Power Systems Corporation Dual power module power system architecture
US7443692B2 (en) 2003-05-16 2008-10-28 Continental Automotive Systems Us, Inc. Power converter architecture employing at least one capacitor across a DC bus
JP2006190972A (ja) 2004-12-08 2006-07-20 Mitsubishi Electric Corp 電力用半導体装置
JP4661645B2 (ja) * 2005-03-23 2011-03-30 トヨタ自動車株式会社 パワー半導体モジュール
US8253241B2 (en) * 2008-05-20 2012-08-28 Infineon Technologies Ag Electronic module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072147A (ja) * 2003-08-21 2005-03-17 Mitsubishi Electric Corp 半導体装置
JP2009100514A (ja) * 2007-10-15 2009-05-07 Mitsubishi Electric Corp 電力変換装置

Also Published As

Publication number Publication date
EP2766930A1 (en) 2014-08-20
CN104160501A (zh) 2014-11-19
JP5935672B2 (ja) 2016-06-15
CN104160501B (zh) 2016-11-09
JP2013179261A (ja) 2013-09-09
WO2013115395A1 (en) 2013-08-08
KR20140090228A (ko) 2014-07-16
US9177948B2 (en) 2015-11-03
US20140264519A1 (en) 2014-09-18
EP2766930B1 (en) 2018-04-04

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