JP5911678B2 - 伸縮可能な温度応答性基材、製造方法及びその利用方法 - Google Patents
伸縮可能な温度応答性基材、製造方法及びその利用方法 Download PDFInfo
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Description
Claims (12)
- 伸縮性を有する基材の表面に0〜80℃の温度範囲内で水和力が変化する温度応答性ポリマーを被覆した温度応答性基材を利用し、特定の状態で生体材料を付着させ、その後、当該基材の状態を変えることで付着した生体材料を剥離する方法であって、当該剥離が当該基材表面を延伸或いは収縮させること、或いはその基材表面の伸縮と温度を変えた際の基材表面の水和力の変化を併用することによるものである、前記方法。
- 特定の伸縮状態及び温度状態にした前記温度応答性基材の表面に付着した生体材料を剥離させる、請求項1に記載の方法であって、当該剥離は、温度を変えず、当該基材の表面を収縮させることにより行う、前記方法。
- 特定の伸縮状態及び温度状態にした前記温度応答性基材の表面に付着した生体材料を剥離させる、請求項1に記載の方法であって、当該剥離は、温度を変えず、当該基材の表面を伸長させることにより行う、前記方法。
- 特定の伸縮状態及び温度状態にした前記温度応答性基材の表面に付着した生体材料を剥離させる、請求項1に記載の方法であって、当該剥離は、当該基材の表面の伸縮度を変え、かつ温度変化させることにより、基材表面に被覆された温度応答性ポリマー層の性質を変化させることにより行う、前記方法。
- 前記生体材料が、細胞、タンパク質、抗体、ぺプチドのいずれか1種以上である、請求項1〜4のいずれか1項記載の方法。
- 前記生体材料が細胞である、請求項1〜5のいずれか1項記載の方法。
- 前記剥離された細胞が細胞シートである、請求項6記載の方法。
- 前記基材の材質がポリジメチルシロキサンである、請求項1〜7のいずれか1項記載の方法。
- 前記基材の表面に被覆された温度応答性ポリマーが、ポリ−N−置換アクリルアミド誘導体、ポリ−N−置換メタアクリルアミド誘導体、ポリアクリレート誘導体、ポリメタクリレート誘導体の単独、もしくはこれらの2つ以上の共重合体からなる、請求項1〜8のいずれか1項記載の方法。
- 前記温度応答性ポリマーが、ポリ−N−イソプロピルアクリルアミドである、請求項9記載の方法。
- 前記基材表面を伸縮させ、当該基材表面の温度応答性ポリマーの被覆量を2.5μg/cm2以下にすることによって、生体材料との親和性を高める、請求項1〜10のいずれか1項記載の方法。
- 前記基材表面を伸縮させ、当該基材表面の温度応答性ポリマーの被覆量を2.5μg/cm2より高くすることによって、生体材料との親和性を弱める、請求項1〜10のいずれか1項記載の方法。
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