JP5908009B2 - レーザ加工方法及びレーザ加工装置 - Google Patents

レーザ加工方法及びレーザ加工装置 Download PDF

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Publication number
JP5908009B2
JP5908009B2 JP2014039643A JP2014039643A JP5908009B2 JP 5908009 B2 JP5908009 B2 JP 5908009B2 JP 2014039643 A JP2014039643 A JP 2014039643A JP 2014039643 A JP2014039643 A JP 2014039643A JP 5908009 B2 JP5908009 B2 JP 5908009B2
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JP
Japan
Prior art keywords
laser
short pulse
processing
metal layer
laser processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014039643A
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English (en)
Japanese (ja)
Other versions
JP2015061731A (ja
JP2015061731A5 (enExample
Inventor
呉屋　真之
真之 呉屋
雅人 木ノ内
雅人 木ノ内
篤史 瀧田
篤史 瀧田
団野　実
実 団野
渡辺　俊哉
俊哉 渡辺
石出　孝
孝 石出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014039643A priority Critical patent/JP5908009B2/ja
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to CN201580001583.2A priority patent/CN105473273B/zh
Priority to KR1020167003704A priority patent/KR101902084B1/ko
Priority to US14/911,663 priority patent/US10792759B2/en
Priority to CA2921212A priority patent/CA2921212C/en
Priority to PCT/JP2015/052072 priority patent/WO2015129362A1/ja
Priority to EP15755690.3A priority patent/EP3025820B1/en
Publication of JP2015061731A publication Critical patent/JP2015061731A/ja
Publication of JP2015061731A5 publication Critical patent/JP2015061731A5/ja
Application granted granted Critical
Publication of JP5908009B2 publication Critical patent/JP5908009B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/001—Turbines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2014039643A 2013-08-20 2014-02-28 レーザ加工方法及びレーザ加工装置 Active JP5908009B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014039643A JP5908009B2 (ja) 2013-08-20 2014-02-28 レーザ加工方法及びレーザ加工装置
KR1020167003704A KR101902084B1 (ko) 2014-02-28 2015-01-26 레이저 가공방법 및 레이저 가공장치
US14/911,663 US10792759B2 (en) 2014-02-28 2015-01-26 Laser processing method and laser processing apparatus
CA2921212A CA2921212C (en) 2014-02-28 2015-01-26 Laser processing method and laser processing apparatus
CN201580001583.2A CN105473273B (zh) 2014-02-28 2015-01-26 激光加工方法及激光加工装置
PCT/JP2015/052072 WO2015129362A1 (ja) 2014-02-28 2015-01-26 レーザ加工方法及びレーザ加工装置
EP15755690.3A EP3025820B1 (en) 2014-02-28 2015-01-26 Laser processing method and laser processing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013170835 2013-08-20
JP2013170835 2013-08-20
JP2014039643A JP5908009B2 (ja) 2013-08-20 2014-02-28 レーザ加工方法及びレーザ加工装置

Publications (3)

Publication Number Publication Date
JP2015061731A JP2015061731A (ja) 2015-04-02
JP2015061731A5 JP2015061731A5 (enExample) 2015-08-27
JP5908009B2 true JP5908009B2 (ja) 2016-04-26

Family

ID=54010731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014039643A Active JP5908009B2 (ja) 2013-08-20 2014-02-28 レーザ加工方法及びレーザ加工装置

Country Status (7)

Country Link
US (1) US10792759B2 (enExample)
EP (1) EP3025820B1 (enExample)
JP (1) JP5908009B2 (enExample)
KR (1) KR101902084B1 (enExample)
CN (1) CN105473273B (enExample)
CA (1) CA2921212C (enExample)
WO (1) WO2015129362A1 (enExample)

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JP6804224B2 (ja) * 2016-06-22 2020-12-23 三菱重工業株式会社 レーザ加工装置およびレーザ加工方法
JP6721439B2 (ja) * 2016-07-11 2020-07-15 株式会社ディスコ レーザー加工装置
CN107824990A (zh) * 2017-12-19 2018-03-23 单杰 一种模切板的多功能激光冲孔机构及其使用方法
CN108406120A (zh) * 2018-02-08 2018-08-17 武汉华工激光工程有限责任公司 对喷漆碳纤维外壳进行镭雕通孔的方法及设备
CN108526719A (zh) * 2018-04-25 2018-09-14 王天牧 一种复合材料的切割设备及切割方法
KR102075731B1 (ko) * 2018-09-27 2020-02-10 한국기계연구원 레이저 제염 시스템
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JP7297568B2 (ja) * 2019-07-08 2023-06-26 三菱重工業株式会社 レーザ加工方法
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DE102019125103A1 (de) * 2019-09-18 2021-03-18 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks, Verfahren zur Laserbearbeitung eines Werkstücks
CN110744205B (zh) * 2019-10-22 2022-06-14 大族激光科技产业集团股份有限公司 一种钛基多层复合材料激光深度标记方法
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CN112296536A (zh) * 2020-06-22 2021-02-02 深圳市木森科技有限公司 一种基于二氧化碳激光和光纤激光的铝基板切割方法、铝基板切割装置及其控制方法
CN112064012B (zh) * 2020-09-07 2022-06-21 江苏联宸激光科技有限公司 一种应用于工件修复的激光熔覆装置
CN112872629B (zh) * 2021-01-18 2022-07-01 星控激光科技(上海)有限公司 一种基于超快激光脉冲序列的四光楔旋切钻孔方法及系统
KR102351494B1 (ko) * 2021-08-12 2022-01-17 (주)멀티일렉텍 유리 측면 가공 장치
JP7252306B1 (ja) * 2021-12-21 2023-04-04 住友金属鉱山株式会社 金属ロールの製造方法
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Also Published As

Publication number Publication date
CN105473273B (zh) 2020-04-10
WO2015129362A1 (ja) 2015-09-03
EP3025820A4 (en) 2017-01-25
CN105473273A (zh) 2016-04-06
US10792759B2 (en) 2020-10-06
EP3025820A1 (en) 2016-06-01
JP2015061731A (ja) 2015-04-02
KR20160029857A (ko) 2016-03-15
US20160193693A1 (en) 2016-07-07
CA2921212C (en) 2020-08-18
CA2921212A1 (en) 2015-09-03
KR101902084B1 (ko) 2018-09-27
EP3025820B1 (en) 2020-08-19

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