JP5902689B2 - 高解像度で耐溶剤性の薄いエラストマー印刷版 - Google Patents

高解像度で耐溶剤性の薄いエラストマー印刷版 Download PDF

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Publication number
JP5902689B2
JP5902689B2 JP2013527301A JP2013527301A JP5902689B2 JP 5902689 B2 JP5902689 B2 JP 5902689B2 JP 2013527301 A JP2013527301 A JP 2013527301A JP 2013527301 A JP2013527301 A JP 2013527301A JP 5902689 B2 JP5902689 B2 JP 5902689B2
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Prior art keywords
styrene
polymer
polymer layer
layer
pattern
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Expired - Fee Related
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JP2013527301A
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English (en)
Japanese (ja)
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JP2013538147A5 (enExample
JP2013538147A (ja
Inventor
デルマー ジェイコックス ゲーリー
デルマー ジェイコックス ゲーリー
ビアトリス ブランシェ グラシエラ
ビアトリス ブランシェ グラシエラ
ナンシー　ジー．タッシ
ジー．タッシ ナンシー
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EIDP Inc
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EI Du Pont de Nemours and Co
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Publication of JP2013538147A publication Critical patent/JP2013538147A/ja
Publication of JP2013538147A5 publication Critical patent/JP2013538147A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Architecture (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2013527301A 2010-09-01 2011-09-01 高解像度で耐溶剤性の薄いエラストマー印刷版 Expired - Fee Related JP5902689B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/873,584 2010-09-01
US12/873,584 US8541162B2 (en) 2010-09-01 2010-09-01 High resolution, solvent resistant, thin elastomeric printing plates
PCT/US2011/050119 WO2012031058A2 (en) 2010-09-01 2011-09-01 High resolution, solvent resistant, thin elastomeric printing plates

Publications (3)

Publication Number Publication Date
JP2013538147A JP2013538147A (ja) 2013-10-10
JP2013538147A5 JP2013538147A5 (enExample) 2014-10-02
JP5902689B2 true JP5902689B2 (ja) 2016-04-13

Family

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Family Applications (1)

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JP2013527301A Expired - Fee Related JP5902689B2 (ja) 2010-09-01 2011-09-01 高解像度で耐溶剤性の薄いエラストマー印刷版

Country Status (7)

Country Link
US (2) US8541162B2 (enExample)
EP (1) EP2612202B1 (enExample)
JP (1) JP5902689B2 (enExample)
KR (1) KR20130102063A (enExample)
CN (1) CN103180783B (enExample)
TW (1) TW201216797A (enExample)
WO (1) WO2012031058A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8715906B2 (en) * 2008-12-12 2014-05-06 E I Du Pont De Nemours And Company High resolution, solvent resistant, thin elastomeric printing plates
US8563220B2 (en) 2010-09-01 2013-10-22 E I Du Pont De Nemours And Company High resolution, solvent resistant, thin elastomeric printing plates
US20130152808A1 (en) * 2010-12-29 2013-06-20 Robert D. Kross Printing plate for monotype prints having viscoelastic gels and method for its use
WO2014133507A1 (en) * 2013-02-27 2014-09-04 Poly-Gel Llc Printing plate for monotype prints having viscoelastic gels and method for its use
JP6483693B2 (ja) 2013-12-06 2019-03-13 エルジー・ケム・リミテッド ブロック共重合体
JP6521974B2 (ja) 2013-12-06 2019-05-29 エルジー・ケム・リミテッド ブロック共重合体
WO2015084122A1 (ko) * 2013-12-06 2015-06-11 주식회사 엘지화학 블록 공중합체
EP3101043B1 (en) 2013-12-06 2021-01-27 LG Chem, Ltd. Block copolymer
EP3078688B1 (en) 2013-12-06 2020-03-04 LG Chem, Ltd. Block copolymer
US10227437B2 (en) 2013-12-06 2019-03-12 Lg Chem, Ltd. Block copolymer
JP6334706B2 (ja) 2013-12-06 2018-05-30 エルジー・ケム・リミテッド ブロック共重合体
CN105960422B (zh) 2013-12-06 2019-01-18 株式会社Lg化学 嵌段共聚物
CN105873968B (zh) 2013-12-06 2018-09-28 株式会社Lg化学 嵌段共聚物
CN105873969B (zh) 2013-12-06 2018-09-04 株式会社Lg化学 嵌段共聚物
CN105980342B (zh) 2013-12-06 2019-02-15 株式会社Lg化学 单体和嵌段共聚物
CN105934454B (zh) 2013-12-06 2019-01-18 株式会社Lg化学 嵌段共聚物
EP3078685B1 (en) 2013-12-06 2020-09-09 LG Chem, Ltd. Block copolymer
JP6432847B2 (ja) 2013-12-06 2018-12-05 エルジー・ケム・リミテッド ブロック共重合体
JP6532941B2 (ja) 2014-09-30 2019-06-19 エルジー・ケム・リミテッド ブロック共重合体
JP6637495B2 (ja) 2014-09-30 2020-01-29 エルジー・ケム・リミテッド パターン化基板の製造方法
WO2016053001A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 블록 공중합체
EP3202799B1 (en) 2014-09-30 2021-08-25 LG Chem, Ltd. Block copolymer
WO2016053000A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 블록 공중합체
CN107075052B (zh) 2014-09-30 2020-05-29 株式会社Lg化学 嵌段共聚物
CN107077066B9 (zh) 2014-09-30 2021-05-14 株式会社Lg化学 制造图案化基底的方法
US10281820B2 (en) 2014-09-30 2019-05-07 Lg Chem, Ltd. Block copolymer
WO2016052994A1 (ko) 2014-09-30 2016-04-07 주식회사 엘지화학 블록 공중합체
US10377894B2 (en) 2014-09-30 2019-08-13 Lg Chem, Ltd. Block copolymer
KR102412137B1 (ko) * 2016-09-23 2022-06-23 에스케이이노베이션 주식회사 블록 공중합체를 이용한 미세 패턴의 형성 방법
WO2022173000A1 (ja) * 2021-02-10 2022-08-18 旭化成株式会社 フレキソ印刷原版、フレキソ印刷版及びフレキソ印刷版の製造方法

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US4264705A (en) 1979-12-26 1981-04-28 Uniroyal, Inc. Multilayered elastomeric printing plate
JPH0232355A (ja) * 1988-07-20 1990-02-02 Konica Corp 湿し水不要平版印刷版材料
JP2643475B2 (ja) 1989-09-27 1997-08-20 三菱マテリアル株式会社 撥水、撥油性を有する光硬化樹脂
US5804353A (en) * 1992-05-11 1998-09-08 E. I. Dupont De Nemours And Company Lasers engravable multilayer flexographic printing element
EP0665469A3 (en) 1994-01-28 1996-02-21 Minnesota Mining & Mfg Flexographic plate with several layers.
GB9516723D0 (en) * 1995-08-15 1995-10-18 Horsell Plc Water-less lithographic plates
WO1998013730A1 (en) 1996-09-27 1998-04-02 Minnesota Mining And Manufacturing Company Multilayer flexographic printing plate
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US20080000373A1 (en) 2006-06-30 2008-01-03 Maria Petrucci-Samija Printing form precursor and process for preparing a stamp from the precursor
US8715906B2 (en) 2008-12-12 2014-05-06 E I Du Pont De Nemours And Company High resolution, solvent resistant, thin elastomeric printing plates

Also Published As

Publication number Publication date
EP2612202A2 (en) 2013-07-10
WO2012031058A3 (en) 2012-06-28
KR20130102063A (ko) 2013-09-16
US8541162B2 (en) 2013-09-24
WO2012031058A2 (en) 2012-03-08
CN103180783B (zh) 2016-06-22
TW201216797A (en) 2012-04-16
CN103180783A (zh) 2013-06-26
EP2612202B1 (en) 2019-05-15
JP2013538147A (ja) 2013-10-10
US20120052446A1 (en) 2012-03-01
US8877428B2 (en) 2014-11-04
US20140011137A1 (en) 2014-01-09

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