TW201216797A - High resolution, solvent resistant, thin elastomeric printing plates - Google Patents
High resolution, solvent resistant, thin elastomeric printing plates Download PDFInfo
- Publication number
- TW201216797A TW201216797A TW100130867A TW100130867A TW201216797A TW 201216797 A TW201216797 A TW 201216797A TW 100130867 A TW100130867 A TW 100130867A TW 100130867 A TW100130867 A TW 100130867A TW 201216797 A TW201216797 A TW 201216797A
- Authority
- TW
- Taiwan
- Prior art keywords
- polymer layer
- polymer
- styrene
- layer
- group
- Prior art date
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- 238000007639 printing Methods 0.000 title abstract description 47
- 239000002904 solvent Substances 0.000 title description 4
- 229920000642 polymer Polymers 0.000 claims abstract description 181
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 39
- 125000003709 fluoroalkyl group Chemical group 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims description 66
- 230000008569 process Effects 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 41
- 239000000178 monomer Substances 0.000 claims description 39
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 36
- 229920001577 copolymer Polymers 0.000 claims description 34
- 229920006037 cross link polymer Polymers 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 23
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical group C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 21
- 238000004132 cross linking Methods 0.000 claims description 21
- 238000000151 deposition Methods 0.000 claims description 17
- 239000003999 initiator Substances 0.000 claims description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical group CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 9
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 8
- 238000003384 imaging method Methods 0.000 claims description 8
- 239000007858 starting material Substances 0.000 claims description 7
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 claims 1
- 241001674044 Blattodea Species 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 239000000976 ink Substances 0.000 abstract description 26
- 238000009736 wetting Methods 0.000 abstract description 5
- 239000000470 constituent Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 182
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 15
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 15
- -1 poly(styrene-butadiene-styrene) Polymers 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 229920001198 elastomeric copolymer Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000000806 elastomer Substances 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- DAWJJMYZJQJLPZ-UHFFFAOYSA-N 2-sulfanylprop-2-enoic acid Chemical class OC(=O)C(S)=C DAWJJMYZJQJLPZ-UHFFFAOYSA-N 0.000 description 4
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- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 229920002633 Kraton (polymer) Polymers 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 238000007385 chemical modification Methods 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 4
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012300 argon atmosphere Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
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- 238000002360 preparation method Methods 0.000 description 3
- BGKZULDOBMANRY-UHFFFAOYSA-N sulfanyl prop-2-enoate Chemical compound SOC(=O)C=C BGKZULDOBMANRY-UHFFFAOYSA-N 0.000 description 3
- LVJZCPNIJXVIAT-UHFFFAOYSA-N 1-ethenyl-2,3,4,5,6-pentafluorobenzene Chemical compound FC1=C(F)C(F)=C(C=C)C(F)=C1F LVJZCPNIJXVIAT-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
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- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 235000019439 ethyl acetate Nutrition 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
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- VEVAMZBETDIUGK-UHFFFAOYSA-N tert-butylcyclohexane;carboxyoxy hydrogen carbonate Chemical compound OC(=O)OOC(O)=O.CC(C)(C)C1CCCCC1.CC(C)(C)C1CCCCC1 VEVAMZBETDIUGK-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
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- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- PLFFHJWXOGYWPR-HEDMGYOXSA-N (4r)-4-[(3r,3as,5ar,5br,7as,11as,11br,13ar,13bs)-5a,5b,8,8,11a,13b-hexamethyl-1,2,3,3a,4,5,6,7,7a,9,10,11,11b,12,13,13a-hexadecahydrocyclopenta[a]chrysen-3-yl]pentan-1-ol Chemical compound C([C@]1(C)[C@H]2CC[C@H]34)CCC(C)(C)[C@@H]1CC[C@@]2(C)[C@]4(C)CC[C@@H]1[C@]3(C)CC[C@@H]1[C@@H](CCCO)C PLFFHJWXOGYWPR-HEDMGYOXSA-N 0.000 description 1
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 description 1
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- OYKPJMYWPYIXGG-UHFFFAOYSA-N 2,2-dimethylbutane;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(C)(C)C OYKPJMYWPYIXGG-UHFFFAOYSA-N 0.000 description 1
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- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 1
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- 235000017281 sodium acetate Nutrition 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229940071559 trioxin Drugs 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Printing Plates And Materials Therefor (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/873,584 US8541162B2 (en) | 2010-09-01 | 2010-09-01 | High resolution, solvent resistant, thin elastomeric printing plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201216797A true TW201216797A (en) | 2012-04-16 |
Family
ID=44674878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100130867A TW201216797A (en) | 2010-09-01 | 2011-08-29 | High resolution, solvent resistant, thin elastomeric printing plates |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8541162B2 (enExample) |
| EP (1) | EP2612202B1 (enExample) |
| JP (1) | JP5902689B2 (enExample) |
| KR (1) | KR20130102063A (enExample) |
| CN (1) | CN103180783B (enExample) |
| TW (1) | TW201216797A (enExample) |
| WO (1) | WO2012031058A2 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8715906B2 (en) * | 2008-12-12 | 2014-05-06 | E I Du Pont De Nemours And Company | High resolution, solvent resistant, thin elastomeric printing plates |
| US8563220B2 (en) | 2010-09-01 | 2013-10-22 | E I Du Pont De Nemours And Company | High resolution, solvent resistant, thin elastomeric printing plates |
| US20130152808A1 (en) * | 2010-12-29 | 2013-06-20 | Robert D. Kross | Printing plate for monotype prints having viscoelastic gels and method for its use |
| WO2014133507A1 (en) * | 2013-02-27 | 2014-09-04 | Poly-Gel Llc | Printing plate for monotype prints having viscoelastic gels and method for its use |
| CN106459326B (zh) | 2013-12-06 | 2019-08-13 | 株式会社Lg化学 | 嵌段共聚物 |
| WO2015084132A1 (ko) | 2013-12-06 | 2015-06-11 | 주식회사 엘지화학 | 블록 공중합체 |
| WO2015084122A1 (ko) * | 2013-12-06 | 2015-06-11 | 주식회사 엘지화학 | 블록 공중합체 |
| WO2015084130A1 (ko) | 2013-12-06 | 2015-06-11 | 주식회사 엘지화학 | 블록 공중합체 |
| EP3078688B1 (en) | 2013-12-06 | 2020-03-04 | LG Chem, Ltd. | Block copolymer |
| WO2015084127A1 (ko) | 2013-12-06 | 2015-06-11 | 주식회사 엘지화학 | 블록 공중합체 |
| JP6347356B2 (ja) | 2013-12-06 | 2018-06-27 | エルジー・ケム・リミテッド | ブロック共重合体 |
| JP6432847B2 (ja) | 2013-12-06 | 2018-12-05 | エルジー・ケム・リミテッド | ブロック共重合体 |
| CN105980342B (zh) | 2013-12-06 | 2019-02-15 | 株式会社Lg化学 | 单体和嵌段共聚物 |
| EP3078684B1 (en) | 2013-12-06 | 2019-07-31 | LG Chem, Ltd. | Block copolymer |
| WO2015084131A1 (ko) | 2013-12-06 | 2015-06-11 | 주식회사 엘지화학 | 블록 공중합체 |
| EP3078692B1 (en) | 2013-12-06 | 2021-01-27 | LG Chem, Ltd. | Block copolymer |
| JP6432846B2 (ja) | 2013-12-06 | 2018-12-05 | エルジー・ケム・リミテッド | ブロック共重合体 |
| CN105899559B (zh) | 2013-12-06 | 2018-05-25 | 株式会社Lg化学 | 嵌段共聚物 |
| JP6451966B2 (ja) | 2014-09-30 | 2019-01-16 | エルジー・ケム・リミテッド | ブロック共重合体 |
| US10281820B2 (en) | 2014-09-30 | 2019-05-07 | Lg Chem, Ltd. | Block copolymer |
| EP3202799B1 (en) | 2014-09-30 | 2021-08-25 | LG Chem, Ltd. | Block copolymer |
| WO2016053001A1 (ko) | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 블록 공중합체 |
| US10377894B2 (en) | 2014-09-30 | 2019-08-13 | Lg Chem, Ltd. | Block copolymer |
| US10287430B2 (en) | 2014-09-30 | 2019-05-14 | Lg Chem, Ltd. | Method of manufacturing patterned substrate |
| WO2016053007A1 (ko) | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 패턴화 기판의 제조 방법 |
| JP6538159B2 (ja) | 2014-09-30 | 2019-07-03 | エルジー・ケム・リミテッド | ブロック共重合体 |
| EP3202802B1 (en) | 2014-09-30 | 2022-11-23 | LG Chem, Ltd. | Block copolymer |
| JP6505212B2 (ja) | 2014-09-30 | 2019-04-24 | エルジー・ケム・リミテッド | ブロック共重合体 |
| KR102412137B1 (ko) * | 2016-09-23 | 2022-06-23 | 에스케이이노베이션 주식회사 | 블록 공중합체를 이용한 미세 패턴의 형성 방법 |
| US20240111213A1 (en) * | 2021-02-10 | 2024-04-04 | Asahi Kasei Kabushiki Kaisha | Flexographic printing raw plate, flexographic printing plate, and manufacturing method of flexographic printing plate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4264705A (en) | 1979-12-26 | 1981-04-28 | Uniroyal, Inc. | Multilayered elastomeric printing plate |
| JPH0232355A (ja) * | 1988-07-20 | 1990-02-02 | Konica Corp | 湿し水不要平版印刷版材料 |
| JP2643475B2 (ja) | 1989-09-27 | 1997-08-20 | 三菱マテリアル株式会社 | 撥水、撥油性を有する光硬化樹脂 |
| US5804353A (en) * | 1992-05-11 | 1998-09-08 | E. I. Dupont De Nemours And Company | Lasers engravable multilayer flexographic printing element |
| EP0665469A3 (en) | 1994-01-28 | 1996-02-21 | Minnesota Mining & Mfg | Flexographic plate with several layers. |
| GB9516723D0 (en) * | 1995-08-15 | 1995-10-18 | Horsell Plc | Water-less lithographic plates |
| WO1998013730A1 (en) | 1996-09-27 | 1998-04-02 | Minnesota Mining And Manufacturing Company | Multilayer flexographic printing plate |
| JPH1195431A (ja) * | 1997-09-18 | 1999-04-09 | Hitachi Chem Co Ltd | 感光性樹脂組成物、それを用いた樹脂膜の製造法及び物品 |
| EP1767990B8 (en) * | 2004-06-11 | 2014-11-19 | Asahi Kasei Chemicals Corporation | Photosensitive resin for flexographic printing plate |
| EP1782886A1 (en) | 2005-11-02 | 2007-05-09 | Sony Deutschland GmbH | A method of patterning molecules on a substrate using a micro-contact printing process |
| JP4203911B2 (ja) * | 2006-02-21 | 2009-01-07 | 株式会社村田製作所 | 圧電発音体 |
| US20080000373A1 (en) * | 2006-06-30 | 2008-01-03 | Maria Petrucci-Samija | Printing form precursor and process for preparing a stamp from the precursor |
| US8715906B2 (en) | 2008-12-12 | 2014-05-06 | E I Du Pont De Nemours And Company | High resolution, solvent resistant, thin elastomeric printing plates |
-
2010
- 2010-09-01 US US12/873,584 patent/US8541162B2/en not_active Expired - Fee Related
-
2011
- 2011-08-29 TW TW100130867A patent/TW201216797A/zh unknown
- 2011-09-01 CN CN201180050963.7A patent/CN103180783B/zh not_active Expired - Fee Related
- 2011-09-01 JP JP2013527301A patent/JP5902689B2/ja not_active Expired - Fee Related
- 2011-09-01 KR KR1020137008050A patent/KR20130102063A/ko not_active Withdrawn
- 2011-09-01 WO PCT/US2011/050119 patent/WO2012031058A2/en not_active Ceased
- 2011-09-01 EP EP11760615.2A patent/EP2612202B1/en not_active Not-in-force
-
2013
- 2013-09-04 US US14/017,976 patent/US8877428B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012031058A2 (en) | 2012-03-08 |
| EP2612202A2 (en) | 2013-07-10 |
| KR20130102063A (ko) | 2013-09-16 |
| US20120052446A1 (en) | 2012-03-01 |
| US20140011137A1 (en) | 2014-01-09 |
| EP2612202B1 (en) | 2019-05-15 |
| CN103180783A (zh) | 2013-06-26 |
| CN103180783B (zh) | 2016-06-22 |
| US8877428B2 (en) | 2014-11-04 |
| US8541162B2 (en) | 2013-09-24 |
| WO2012031058A3 (en) | 2012-06-28 |
| JP2013538147A (ja) | 2013-10-10 |
| JP5902689B2 (ja) | 2016-04-13 |
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