JP5898919B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5898919B2
JP5898919B2 JP2011239377A JP2011239377A JP5898919B2 JP 5898919 B2 JP5898919 B2 JP 5898919B2 JP 2011239377 A JP2011239377 A JP 2011239377A JP 2011239377 A JP2011239377 A JP 2011239377A JP 5898919 B2 JP5898919 B2 JP 5898919B2
Authority
JP
Japan
Prior art keywords
heat
protrusion
heat sink
heat radiating
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011239377A
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English (en)
Japanese (ja)
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JP2013098328A (ja
JP2013098328A5 (https=
Inventor
雅文 関
雅文 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011239377A priority Critical patent/JP5898919B2/ja
Priority to US13/661,233 priority patent/US8648461B2/en
Publication of JP2013098328A publication Critical patent/JP2013098328A/ja
Publication of JP2013098328A5 publication Critical patent/JP2013098328A5/ja
Application granted granted Critical
Publication of JP5898919B2 publication Critical patent/JP5898919B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2011239377A 2011-10-31 2011-10-31 半導体装置 Active JP5898919B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011239377A JP5898919B2 (ja) 2011-10-31 2011-10-31 半導体装置
US13/661,233 US8648461B2 (en) 2011-10-31 2012-10-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011239377A JP5898919B2 (ja) 2011-10-31 2011-10-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2013098328A JP2013098328A (ja) 2013-05-20
JP2013098328A5 JP2013098328A5 (https=) 2014-09-25
JP5898919B2 true JP5898919B2 (ja) 2016-04-06

Family

ID=48171545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011239377A Active JP5898919B2 (ja) 2011-10-31 2011-10-31 半導体装置

Country Status (2)

Country Link
US (1) US8648461B2 (https=)
JP (1) JP5898919B2 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140118954A1 (en) * 2011-06-28 2014-05-01 Telefonaktiebolaget L M Ericsson (Publ) Electronic device with heat-dissipating structure
US9507391B2 (en) * 2011-11-28 2016-11-29 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Heat sink with orientable fins
US9565787B2 (en) * 2011-12-13 2017-02-07 Intel Corporation Heat dissipation device loading mechanisms
JP6036433B2 (ja) * 2013-03-18 2016-11-30 富士通株式会社 放熱器
JP6201532B2 (ja) * 2013-08-30 2017-09-27 富士電機株式会社 半導体装置
JP6237006B2 (ja) * 2013-08-30 2017-11-29 富士通株式会社 ヒートシンク及び基板ユニット
US9269694B2 (en) * 2013-12-11 2016-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Packages with thermal management features for reduced thermal crosstalk and methods of forming same
US20150255365A1 (en) * 2014-03-05 2015-09-10 Nvidia Corporation Microelectronic package plate with edge recesses for improved alignment
DE102014205957A1 (de) * 2014-03-31 2015-10-01 Lemförder Electronic GmbH Treiberbaugruppe
JP2016012621A (ja) * 2014-06-27 2016-01-21 三星ダイヤモンド工業株式会社 光ファイバ保持装置及びこれを有するレーザ発振器
WO2017057093A1 (ja) * 2015-09-29 2017-04-06 三菱電機株式会社 半導体装置とその製造方法
JP6669586B2 (ja) * 2016-05-26 2020-03-18 新光電気工業株式会社 半導体装置、半導体装置の製造方法
JP6867243B2 (ja) * 2017-06-26 2021-04-28 新光電気工業株式会社 放熱板及びその製造方法と電子部品装置
JP7334433B2 (ja) * 2019-03-19 2023-08-29 日本電気株式会社 放熱構造及び電子部品
FR3103582B1 (fr) 2019-11-21 2022-12-16 Safran Electronics & Defense Calculateur embarqué avec entreproseur sur la puce microprocesseur
WO2022239620A1 (ja) * 2021-05-13 2022-11-17 ローム株式会社 パッケージ
CN114530425B (zh) * 2021-12-31 2025-08-22 通富微电子股份有限公司 扇出型封装器件
TWI872791B (zh) * 2023-11-07 2025-02-11 光寶科技股份有限公司 散熱模組

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127250U (https=) * 1988-02-23 1989-08-31
JPH0265349U (https=) * 1988-11-04 1990-05-16
JP2501583Y2 (ja) * 1990-03-23 1996-06-19 日本電気株式会社 Ｌｓｉのヒ―トシンク取付構造
JPH04137062U (ja) * 1991-06-12 1992-12-21 株式会社ゼクセル パワートランジスタユニツト
JPH04137061U (ja) * 1991-06-17 1992-12-21 日本電気株式会社 ヒートシンクの取付構造
JP2902531B2 (ja) * 1992-12-25 1999-06-07 富士通株式会社 半導体装置の放熱装置
JP3149847B2 (ja) * 1998-04-20 2001-03-26 富士通株式会社 ヒートシンク
JP3249777B2 (ja) * 1998-04-20 2002-01-21 富士通株式会社 ヒートシンク
US6093961A (en) * 1999-02-24 2000-07-25 Chip Coolers, Inc. Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment
KR100457220B1 (ko) * 2002-02-27 2004-11-16 잘만테크 주식회사 칩셋 냉각용 히트싱크장치
US7190586B2 (en) * 2004-03-03 2007-03-13 Hewlett-Packard Development Company, L.P. Heat sink retention assembly and related methods
JP4986435B2 (ja) * 2005-10-12 2012-07-25 株式会社ソニー・コンピュータエンタテインメント 半導体装置、半導体装置の作成方法
JP2007165486A (ja) * 2005-12-12 2007-06-28 Shinko Electric Ind Co Ltd 放熱板及び半導体装置
US7564687B2 (en) * 2007-03-22 2009-07-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fixing base
JP5009085B2 (ja) 2007-08-09 2012-08-22 新光電気工業株式会社 半導体装置
CN102938997A (zh) * 2011-08-16 2013-02-20 鸿富锦精密工业（深圳）有限公司 散热装置

Also Published As

Publication number Publication date
US8648461B2 (en) 2014-02-11
JP2013098328A (ja) 2013-05-20
US20130105964A1 (en) 2013-05-02

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