JP5886335B2 - 電子部品内蔵基板の製造方法及び電子部品内蔵基板 - Google Patents
電子部品内蔵基板の製造方法及び電子部品内蔵基板 Download PDFInfo
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- JP5886335B2 JP5886335B2 JP2014023077A JP2014023077A JP5886335B2 JP 5886335 B2 JP5886335 B2 JP 5886335B2 JP 2014023077 A JP2014023077 A JP 2014023077A JP 2014023077 A JP2014023077 A JP 2014023077A JP 5886335 B2 JP5886335 B2 JP 5886335B2
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- 239000000758 substrate Substances 0.000 title claims description 142
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000000853 adhesive Substances 0.000 claims description 32
- 230000001070 adhesive effect Effects 0.000 claims description 32
- 238000004381 surface treatment Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 26
- 230000003746 surface roughness Effects 0.000 claims description 23
- 238000010030 laminating Methods 0.000 claims description 20
- 238000009832 plasma treatment Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 141
- 239000011810 insulating material Substances 0.000 description 21
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
Images
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
まず、本発明の第1実施形態による電子部品内蔵基板の製造方法について、図面を参照して具体的に説明する。この際、参照図面に記載されていない図面符号は、同一の構成を示す他の図面での図面符号であることができる。
次に、本発明の第2実施形態による電子部品内蔵基板について、図面を参照して具体的に説明する。この際、上述の第1実施形態による電子部品内蔵基板の製造方法が参照され、重複される説明は省略されることができる。
11 キャビティ
20 内層回路パターン
30 電子部品
40 接着基材
50 第1絶縁層
50a 接合界面又は表面処理された露出面
60 第2絶縁層
Claims (11)
- コア基板に形成されたキャビティに電子部品を挿入する段階と、
前記電子部品が挿入された前記コア基板の一側上に第1絶縁層を積層する段階と、
前記第1絶縁層の積層方向の反対側である前記コア基板の他側に表面処理を行うことで、少なくとも前記キャビティにおける前記電子部品が配置されている箇所以外の箇所に設けられた前記第1絶縁層における前記コア基板の前記他側の面である露出面の表面粗さを向上させる段階と、
表面粗さが向上された前記第1絶縁層の露出面と接合されるように、前記コア基板の他側上に第2絶縁層を積層する段階と、を含み、前記第1絶縁層と前記第2絶縁層との間の接合力が向上された電子部品内蔵基板が得られる、電子部品内蔵基板の製造方法。 - 前記第1絶縁層と前記第2絶縁層との間の接合界面は、前記キャビティ内の前記電子部品の側面区間に形成されることを特徴とする、請求項1に記載の電子部品内蔵基板の製造方法。
- 前記表面処理は、機械的研磨、化学的処理又はプラズマ処理により行われることを特徴とする、請求項1に記載の電子部品内蔵基板の製造方法。
- 前記表面粗さを向上させる段階で、前記表面処理は、前記第1絶縁層の露出面、前記電子部品の露出面の少なくとも一部、及び前記コア基板の他側面の少なくとも一部に行われることを特徴とする、請求項1に記載の電子部品内蔵基板の製造方法。
- 前記キャビティに電子部品を挿入する段階は、
前記キャビティが形成された前記コア基板を準備する段階と、
接着基材上に付着された前記電子部品が前記キャビティに挿入されるように、前記コア基板の他側に前記接着基材を付着する段階と、を含み、
前記表面処理を行う前に、前記コア基板の他側に付着された前記接着基材を除去することを特徴とする、請求項1乃至4の何れか一項に記載の電子部品内蔵基板の製造方法。 - 前記キャビティに電子部品を挿入する段階は、
前記キャビティが形成された前記コア基板を準備し、前記コア基板の他側に接着基材を付着する段階と、
前記キャビティに前記電子部品を挿入して前記接着基材上に付着する段階と、を含み、
前記表面処理を行う前に、前記コア基板の他側に付着された前記接着基材を除去することを特徴とする、請求項1乃至4の何れか一項に記載の電子部品内蔵基板の製造方法。 - 前記第1絶縁層を積層する段階の前に、前記コア基板の一側及び他側の少なくとも一方の表面に内層回路パターンを形成する段階と、
前記第1及び第2絶縁層の少なくとも何れか一つを貫通して前記電子部品と電気的に連結されるビアを形成し、前記第1及び第2絶縁層の少なくとも何れか一方の外側面に外層回路パターンを形成する段階と、をさらに含むことを特徴とする、請求項1乃至4の何れか一項に記載の電子部品内蔵基板の製造方法。 - キャビティが備えられたコア基板と、
前記キャビティに挿入された電子部品と、
前記電子部品が挿入された前記コア基板の一側上に積層された第1絶縁層と、
前記第1絶縁層の積層方向の反対側である前記コア基板の他側上に積層された第2絶縁層と、
前記キャビティにおける前記電子部品が配置されている箇所以外の箇所において前記第1絶縁層と第2絶縁層とが接合されて形成され、前記第1絶縁層と前記第2絶縁層との間の接合力を向上させるために、向上された界面粗さを有する接合界面と、を含む電子部品内蔵基板。 - 前記接合界面は、前記キャビティ内の前記電子部品の側面区間に形成されることを特徴とする、請求項8に記載の電子部品内蔵基板。
- 前記第2絶縁層と接触される前記電子部品及びコア基板の表面の少なくとも一部に表面処理が行われていることを特徴とする、請求項8に記載の電子部品内蔵基板。
- 前記コア基板の一側及び他側の少なくとも一方の表面に形成された内層回路パターン、前記第1及び第2絶縁層の少なくとも何れか一つを貫通して前記電子部品と電気的に連結されるビアパターン、及び前記第1及び第2絶縁層の少なくとも何れか一方の外側面に形成された外層回路パターンを含む回路パターンをさらに含むことを特徴とする、請求項8乃至10の何れか一項に記載の電子部品内蔵基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020130096648A KR101442423B1 (ko) | 2013-08-14 | 2013-08-14 | 전자부품 내장기판 제조 방법 및 전자부품 내장기판 |
KR10-2013-0096648 | 2013-08-14 |
Publications (2)
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JP2015037185A JP2015037185A (ja) | 2015-02-23 |
JP5886335B2 true JP5886335B2 (ja) | 2016-03-16 |
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JP2014023077A Active JP5886335B2 (ja) | 2013-08-14 | 2014-02-10 | 電子部品内蔵基板の製造方法及び電子部品内蔵基板 |
Country Status (3)
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US (2) | US20150049445A1 (ja) |
JP (1) | JP5886335B2 (ja) |
KR (1) | KR101442423B1 (ja) |
Families Citing this family (4)
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WO2014125567A1 (ja) * | 2013-02-12 | 2014-08-21 | 株式会社メイコー | 部品内蔵基板及びその製造方法 |
KR20160114792A (ko) * | 2015-03-24 | 2016-10-06 | 삼성전기주식회사 | 코일 내장 집적회로 기판 및 그 제조 방법 |
KR102216506B1 (ko) * | 2015-11-10 | 2021-02-17 | 삼성전기주식회사 | 방열부재 및 이를 구비한 인쇄회로기판 |
US20190006356A1 (en) * | 2017-06-29 | 2019-01-03 | Intel Corporation | Package with embedded capacitors |
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JPH10190224A (ja) * | 1996-12-27 | 1998-07-21 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
JPH11126978A (ja) * | 1997-10-24 | 1999-05-11 | Kyocera Corp | 多層配線基板 |
JP4968404B2 (ja) * | 2000-04-05 | 2012-07-04 | イビデン株式会社 | プリント配線板 |
JP2002237683A (ja) * | 2001-02-08 | 2002-08-23 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
TWI241695B (en) * | 2004-11-19 | 2005-10-11 | Ind Tech Res Inst | Structure of an electronic package and method for fabricating the same |
US7293355B2 (en) * | 2005-04-21 | 2007-11-13 | Endicott Interconnect Technologies, Inc. | Apparatus and method for making circuitized substrates in a continuous manner |
KR20070056200A (ko) * | 2005-11-29 | 2007-06-04 | 이충근 | 오락실 매장 관리 시스템 |
JP4875925B2 (ja) * | 2006-05-29 | 2012-02-15 | イビデン株式会社 | 多層配線板及びその製造方法 |
KR100811034B1 (ko) * | 2007-04-30 | 2008-03-06 | 삼성전기주식회사 | 전자소자 내장 인쇄회로기판의 제조방법 |
JP2009004459A (ja) * | 2007-06-19 | 2009-01-08 | Ngk Spark Plug Co Ltd | コンデンサ内蔵配線基板 |
KR101551898B1 (ko) | 2007-10-05 | 2015-09-09 | 신꼬오덴기 고교 가부시키가이샤 | 배선 기판, 반도체 장치 및 이들의 제조 방법 |
KR101294446B1 (ko) * | 2007-12-15 | 2013-08-07 | 현대자동차주식회사 | 웨이스트 게이트 밸브장치 |
JP2011210892A (ja) * | 2010-03-29 | 2011-10-20 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
JP5001395B2 (ja) * | 2010-03-31 | 2012-08-15 | イビデン株式会社 | 配線板及び配線板の製造方法 |
KR101472672B1 (ko) * | 2013-04-26 | 2014-12-12 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제조방법 |
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2013
- 2013-08-14 KR KR1020130096648A patent/KR101442423B1/ko active IP Right Grant
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2014
- 2014-01-16 US US14/156,837 patent/US20150049445A1/en not_active Abandoned
- 2014-02-10 JP JP2014023077A patent/JP5886335B2/ja active Active
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2016
- 2016-03-25 US US15/081,108 patent/US20160212856A1/en not_active Abandoned
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Publication number | Publication date |
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US20160212856A1 (en) | 2016-07-21 |
KR101442423B1 (ko) | 2014-09-17 |
US20150049445A1 (en) | 2015-02-19 |
JP2015037185A (ja) | 2015-02-23 |
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