JP5882577B2 - フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置 - Google Patents

フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置 Download PDF

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Publication number
JP5882577B2
JP5882577B2 JP2010271893A JP2010271893A JP5882577B2 JP 5882577 B2 JP5882577 B2 JP 5882577B2 JP 2010271893 A JP2010271893 A JP 2010271893A JP 2010271893 A JP2010271893 A JP 2010271893A JP 5882577 B2 JP5882577 B2 JP 5882577B2
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Japan
Prior art keywords
film
liquid adhesive
frame member
grinding
adhesive
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JP2010271893A
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English (en)
Japanese (ja)
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JP2012124230A5 (https=
JP2012124230A (ja
Inventor
一太 斉藤
一太 斉藤
伸哉 中島
伸哉 中島
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2010271893A priority Critical patent/JP5882577B2/ja
Priority to PCT/US2011/062523 priority patent/WO2012078419A2/en
Priority to TW100144687A priority patent/TWI564949B/zh
Publication of JP2012124230A publication Critical patent/JP2012124230A/ja
Publication of JP2012124230A5 publication Critical patent/JP2012124230A5/ja
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Publication of JP5882577B2 publication Critical patent/JP5882577B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2010271893A 2010-12-06 2010-12-06 フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置 Active JP5882577B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010271893A JP5882577B2 (ja) 2010-12-06 2010-12-06 フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置
PCT/US2011/062523 WO2012078419A2 (en) 2010-12-06 2011-11-30 Method for applying film, method for grinding back surface, method for forming semiconductor chip, and apparatus for applying film
TW100144687A TWI564949B (zh) 2010-12-06 2011-12-05 塗佈膜之方法，研磨背表面之方法，形成半導體晶片之方法及塗佈膜之裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010271893A JP5882577B2 (ja) 2010-12-06 2010-12-06 フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置

Publications (3)

Publication Number Publication Date
JP2012124230A JP2012124230A (ja) 2012-06-28
JP2012124230A5 JP2012124230A5 (https=) 2014-01-30
JP5882577B2 true JP5882577B2 (ja) 2016-03-09

Family

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Family Applications (1)

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JP2010271893A Active JP5882577B2 (ja) 2010-12-06 2010-12-06 フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置

Country Status (3)

Country Link
JP (1) JP5882577B2 (https=)
TW (1) TWI564949B (https=)
WO (1) WO2012078419A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4156238A3 (en) * 2021-09-24 2023-04-19 Disco Corporation Method of processing plate-shaped workpiece

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014129304A1 (ja) 2013-02-19 2014-08-28 株式会社Sumco 半導体ウェーハの加工方法
JP6149223B2 (ja) * 2013-04-18 2017-06-21 株式会社ディスコ 板状物の貼着方法
JP6322472B2 (ja) * 2014-05-01 2018-05-09 スリーエム イノベイティブ プロパティズ カンパニー シート貼付方法、シート貼付装置及びウエハ加工方法
CN110211913A (zh) * 2019-05-29 2019-09-06 浙江荷清柔性电子技术有限公司 一种柔性芯片的制造方法
JP7286250B2 (ja) * 2019-08-07 2023-06-05 株式会社ディスコ 保護部材形成装置
JP7475232B2 (ja) * 2020-07-22 2024-04-26 株式会社ディスコ 保護部材形成装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3602943B2 (ja) * 1997-07-25 2004-12-15 シャープ株式会社 半導体ウエハの研削装置
JPH1153778A (ja) * 1997-08-07 1999-02-26 Matsushita Electric Ind Co Ltd 光ディスク装置の製造方法およびその製造装置
JP2005191535A (ja) * 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
JP4485248B2 (ja) * 2004-04-28 2010-06-16 リンテック株式会社 剥離装置及び剥離方法
KR100843217B1 (ko) * 2006-12-15 2008-07-02 삼성전자주식회사 웨이퍼 후면 액상접착제 도포를 이용한 반도체 패키지 제조용 인라인 시스템
JP2009147201A (ja) * 2007-12-17 2009-07-02 Denki Kagaku Kogyo Kk ダイシングシート、その製造方法、および電子部品の製造方法
JP2009231699A (ja) * 2008-03-25 2009-10-08 Furukawa Electric Co Ltd:The ウエハ加工用テープ
TWM359789U (en) * 2008-07-21 2009-06-21 Beautrong Prec Mechtronics Co Ltd A blue membrane expansion device
JP5492445B2 (ja) * 2009-04-23 2014-05-14 株式会社ディスコ ウェーハの分割方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4156238A3 (en) * 2021-09-24 2023-04-19 Disco Corporation Method of processing plate-shaped workpiece

Also Published As

Publication number Publication date
WO2012078419A3 (en) 2012-08-02
JP2012124230A (ja) 2012-06-28
WO2012078419A2 (en) 2012-06-14
TW201246341A (en) 2012-11-16
TWI564949B (zh) 2017-01-01

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