JP5869204B2 - 光学素子用の金属トレース形成 - Google Patents
光学素子用の金属トレース形成 Download PDFInfo
- Publication number
- JP5869204B2 JP5869204B2 JP2009548351A JP2009548351A JP5869204B2 JP 5869204 B2 JP5869204 B2 JP 5869204B2 JP 2009548351 A JP2009548351 A JP 2009548351A JP 2009548351 A JP2009548351 A JP 2009548351A JP 5869204 B2 JP5869204 B2 JP 5869204B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- optical element
- solar cell
- depositing
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims description 87
- 229910052751 metal Inorganic materials 0.000 title claims description 12
- 239000002184 metal Substances 0.000 title claims description 12
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000004020 conductor Substances 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 25
- 238000000151 deposition Methods 0.000 claims description 14
- 239000000615 nonconductor Substances 0.000 claims description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 4
- 229910000679 solder Inorganic materials 0.000 description 18
- 239000012212 insulator Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000007751 thermal spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Optical Couplings Of Light Guides (AREA)
- Coating By Spraying Or Casting (AREA)
Description
Claims (4)
- 太陽電池の太陽集光器の製造方法であって、
凹面を含む平坦な第1の面と、前記第1の面に対向する凸状の第2の面と、前記凸状の第2の面上に設けられた円柱台座と、を備えたガラスからなり、前記円柱台座は凹部を画定する平坦な第3の面を含み、前記第3の面は前記第1の面と離れて対向している光学素子を生成するステップと、
前記第3の面上、前記円柱台座の側面上及び前記凸状の第2の面の一部分の上に導電材料を堆積し、また、前記凸状の第2の面の他の部分の上に他の導電材料を堆積し、前記一部分と前記他の部分は互いを電気的に絶縁すべく隙間が画定され、前記堆積された導電材料の一部が前記凹部内に配置されるようにするステップと、
前記第3の表面を化学機械的研磨によりほぼ平坦化させて、前記凹部内に配置された導電材料の一部を露出させて、金属トレースを形成するステップと、
を含む太陽電池の太陽集光器の製造方法。 - 前記導電材料を堆積させるステップが、前記光学素子の上に溶融導電材料を溶射するステップを含んでいる、請求項1に記載の太陽電池の太陽集光器の製造方法。
- 前記導電材料を堆積させるステップが、前記光学素子の上に溶融導電材料を溶射する前に、前記光学素子の上にステンシルを配置するステップを更に含んでいる、請求項2に記載の太陽電池の太陽集光器の製造方法。
- 前記光学素子の上に反射材料を堆積させ、且つ前記第3の面に前記反射材料が付着しないようにするステップと、
前記反射材料の上に電気絶縁体を堆積させ、前記第3の面に前記電気絶縁体が付着しないようにするステップと、
前記導電材料を前記電気絶縁体の上に堆積させるステップとを更に含んでいる、請求項1に記載の太陽電池の太陽集光器の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US89915007P | 2007-02-02 | 2007-02-02 | |
US60/899,150 | 2007-02-02 | ||
US11/782,609 US20080186593A1 (en) | 2007-02-02 | 2007-07-24 | Metal trace fabrication for optical element |
US11/782,609 | 2007-07-24 | ||
PCT/US2008/050790 WO2008097687A2 (en) | 2007-02-02 | 2008-01-10 | Metal trace fabrication for optical element |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010518603A JP2010518603A (ja) | 2010-05-27 |
JP2010518603A5 JP2010518603A5 (ja) | 2011-02-24 |
JP5869204B2 true JP5869204B2 (ja) | 2016-02-24 |
Family
ID=39675132
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009548352A Pending JP2010518255A (ja) | 2007-02-02 | 2008-01-10 | 太陽集光器製造用の熱溶射 |
JP2009548351A Active JP5869204B2 (ja) | 2007-02-02 | 2008-01-10 | 光学素子用の金属トレース形成 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009548352A Pending JP2010518255A (ja) | 2007-02-02 | 2008-01-10 | 太陽集光器製造用の熱溶射 |
Country Status (5)
Country | Link |
---|---|
US (7) | US20080186593A1 (ja) |
EP (2) | EP2115787A1 (ja) |
JP (2) | JP2010518255A (ja) |
AU (2) | AU2008214229A1 (ja) |
WO (1) | WO2008097687A2 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7906722B2 (en) * | 2005-04-19 | 2011-03-15 | Palo Alto Research Center Incorporated | Concentrating solar collector with solid optical element |
US7855335B2 (en) * | 2006-04-26 | 2010-12-21 | Palo Alto Research Center Incorporated | Beam integration for concentrating solar collector |
US7851693B2 (en) * | 2006-05-05 | 2010-12-14 | Palo Alto Research Center Incorporated | Passively cooled solar concentrating photovoltaic device |
US20080186593A1 (en) * | 2007-02-02 | 2008-08-07 | Sol Focus, Inc. | Metal trace fabrication for optical element |
US20100086703A1 (en) * | 2008-10-03 | 2010-04-08 | Veeco Compound Semiconductor, Inc. | Vapor Phase Epitaxy System |
US20100206379A1 (en) * | 2009-02-18 | 2010-08-19 | Palo Alto Research Center Incorporated | Rotational Trough Reflector Array With Solid Optical Element For Solar-Electricity Generation |
US20100206357A1 (en) * | 2009-02-18 | 2010-08-19 | Palo Alto Research Center Incorporated | Two-Part Solar Energy Collection System With Replaceable Solar Collector Component |
TW201110275A (en) * | 2009-05-13 | 2011-03-16 | Seiko Instr Inc | Electronic component, manufacturing method for electronic component, and electronic device |
WO2011044277A2 (en) * | 2009-10-06 | 2011-04-14 | Brightleaf Technologies, Inc. | Non-parabolic solar concentration to an area of controlled flux density conversion system and method |
US9074795B2 (en) * | 2009-10-06 | 2015-07-07 | Brightleaf Technologies, Inc. | Solar collector and conversion array |
KR101085475B1 (ko) * | 2009-12-21 | 2011-11-21 | 삼성전기주식회사 | 태양전지모듈 및 그 제조방법 |
US20110146754A1 (en) * | 2009-12-22 | 2011-06-23 | Brightleaf Technologies, Inc. | Solar conversion system having solar collector for forming a transposed image |
US8040609B1 (en) | 2010-11-29 | 2011-10-18 | Palo Alto Research Center Incorporated | Self-adjusting solar light transmission apparatus |
US8884156B2 (en) | 2010-11-29 | 2014-11-11 | Palo Alto Research Center Incorporated | Solar energy harvesting device using stimuli-responsive material |
US8695687B2 (en) | 2010-12-10 | 2014-04-15 | Palo Alto Research Center Incorporated | Hybrid pin-fin micro heat pipe heat sink and method of fabrication |
US8659042B2 (en) | 2010-12-21 | 2014-02-25 | Palo Alto Research Center Incorporated | Integrated reflector and thermal spreader and thermal spray fabrication method |
US8328077B1 (en) * | 2011-11-01 | 2012-12-11 | Flextronics Ap, Llc | PV cell mass reflow |
US20130153016A1 (en) * | 2011-12-20 | 2013-06-20 | Tong Hsing Electronic Industries, Ltd. | Solar Cell Flip Chip Package Structure and Method for Manufacturing the same |
DE102013204326A1 (de) | 2012-03-13 | 2013-09-19 | Robert Bosch Gmbh | Solarmodul und Verfahren zur Herstellung eines solchen |
US8752380B2 (en) | 2012-05-22 | 2014-06-17 | Palo Alto Research Center Incorporated | Collapsible solar-thermal concentrator for renewable, sustainable expeditionary power generator system |
US9224626B2 (en) | 2012-07-03 | 2015-12-29 | Watlow Electric Manufacturing Company | Composite substrate for layered heaters |
US9227259B2 (en) | 2012-08-22 | 2016-01-05 | International Business Machines Corporation | Increasing the efficiency of solar cells by transfer of solder |
CN104779312B (zh) * | 2014-01-09 | 2017-10-10 | 讯芯电子科技(中山)有限公司 | 聚光太阳能光伏模块 |
US10144533B2 (en) | 2014-05-14 | 2018-12-04 | California Institute Of Technology | Large-scale space-based solar power station: multi-scale modular space power |
JP6693889B2 (ja) | 2014-05-14 | 2020-05-13 | カリフォルニア インスティチュート オブ テクノロジー | 大規模宇宙太陽光発電所:誘導可能ビームを用いる送電 |
US11362228B2 (en) | 2014-06-02 | 2022-06-14 | California Institute Of Technology | Large-scale space-based solar power station: efficient power generation tiles |
US12021162B2 (en) | 2014-06-02 | 2024-06-25 | California Institute Of Technology | Ultralight photovoltaic power generation tiles |
JP6715317B2 (ja) | 2015-07-22 | 2020-07-01 | カリフォルニア インスティチュート オブ テクノロジー | コンパクトパッケージング用の大面積構造体 |
US10992253B2 (en) | 2015-08-10 | 2021-04-27 | California Institute Of Technology | Compactable power generation arrays |
WO2017027617A1 (en) | 2015-08-10 | 2017-02-16 | California Institute Of Technology | Systems and methods for performing shape estimation using sun sensors in large-scale space-based solar power stations |
KR102167221B1 (ko) * | 2017-02-10 | 2020-10-19 | 주식회사 엘지화학 | 비대칭 투과필름 |
US11634240B2 (en) | 2018-07-17 | 2023-04-25 | California Institute Of Technology | Coilable thin-walled longerons and coilable structures implementing longerons and methods for their manufacture and coiling |
US11772826B2 (en) | 2018-10-31 | 2023-10-03 | California Institute Of Technology | Actively controlled spacecraft deployment mechanism |
Family Cites Families (184)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US31517A (en) * | 1861-02-19 | Metallic spring | ||
US2031387A (en) * | 1934-08-22 | 1936-02-18 | Schwarz Arthur | Nozzle |
US2789731A (en) * | 1955-06-06 | 1957-04-23 | Leonard L Marraffino | Striping dispenser |
US3032008A (en) * | 1956-05-07 | 1962-05-01 | Polaroid Corp | Apparatus for manufacturing photographic films |
US3923381A (en) * | 1973-12-28 | 1975-12-02 | Univ Chicago | Radiant energy collection |
US3973994A (en) * | 1974-03-11 | 1976-08-10 | Rca Corporation | Solar cell with grooved surface |
JPS5328751B2 (ja) * | 1974-11-27 | 1978-08-16 | ||
US3988166A (en) * | 1975-01-07 | 1976-10-26 | Beam Engineering, Inc. | Apparatus for enhancing the output of photovoltaic solar cells |
US4045246A (en) * | 1975-08-11 | 1977-08-30 | Mobil Tyco Solar Energy Corporation | Solar cells with concentrators |
US4021267A (en) * | 1975-09-08 | 1977-05-03 | United Technologies Corporation | High efficiency converter of solar energy to electricity |
US4053327A (en) * | 1975-09-24 | 1977-10-11 | Communications Satellite Corporation | Light concentrating solar cell cover |
US4114596A (en) * | 1976-03-16 | 1978-09-19 | Chang Wei Yi | Method and apparatus for tracking the sun for use in a solar collector with linear focusing means |
US4086485A (en) | 1976-05-26 | 1978-04-25 | Massachusetts Institute Of Technology | Solar-radiation collection apparatus with tracking circuitry |
US4095997A (en) * | 1976-10-07 | 1978-06-20 | Griffiths Kenneth F | Combined solar cell and hot air collector apparatus |
US4084985A (en) * | 1977-04-25 | 1978-04-18 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Method for producing solar energy panels by automation |
US4131485A (en) * | 1977-08-08 | 1978-12-26 | Motorola, Inc. | Solar energy collector and concentrator |
US4177083A (en) | 1977-09-06 | 1979-12-04 | Acurex Corporation | Photovoltaic concentrator |
US4148301A (en) | 1977-09-26 | 1979-04-10 | Cluff C Brent | Water-borne rotating solar collecting and storage systems |
US4296731A (en) * | 1977-09-26 | 1981-10-27 | Cluff C Brent | Tracking booster and multiple mirror concentrator floating collector |
US4153476A (en) * | 1978-03-29 | 1979-05-08 | Nasa | Double-sided solar cell package |
US4337758A (en) * | 1978-06-21 | 1982-07-06 | Meinel Aden B | Solar energy collector and converter |
US4234351A (en) * | 1978-07-14 | 1980-11-18 | The Boeing Company | Process for fabricating glass-encapsulated solar cell arrays and the product produced thereby |
US4221468A (en) | 1979-02-26 | 1980-09-09 | Macken John A | Multi-cavity laser mirror |
US4331703A (en) * | 1979-03-28 | 1982-05-25 | Solarex Corporation | Method of forming solar cell having contacts and antireflective coating |
US4254894A (en) * | 1979-08-23 | 1981-03-10 | The Continental Group, Inc. | Apparatus for dispensing a striped product and method of producing the striped product |
US4320251A (en) * | 1980-07-28 | 1982-03-16 | Solamat Inc. | Ohmic contacts for solar cells by arc plasma spraying |
DE8033450U1 (de) * | 1980-12-17 | 1982-07-22 | Colgate-Palmolive Co., 10022 New York, N.Y. | Laenglicher Behaelter fuer einen Spender fuer pastoeses gut |
DE3104690A1 (de) | 1981-02-10 | 1982-08-26 | Siemens AG, 1000 Berlin und 8000 München | "solarenergiesystem" |
DE3205439A1 (de) | 1981-03-02 | 1983-08-25 | Imchemie Kunststoff Gmbh, 5632 Wermelskirchen | Solarkonzentrator mit hohlspiegeln |
DE3107888A1 (de) | 1981-03-02 | 1982-09-16 | Imchemie Kunststoff Gmbh, 5632 Wermelskirchen | Solarkonzentrator |
US4355196A (en) * | 1981-03-11 | 1982-10-19 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Solar cell having improved back surface reflector |
JPS58180262A (ja) * | 1982-04-16 | 1983-10-21 | Fuji Photo Film Co Ltd | 塗布方法 |
US4476165A (en) * | 1982-06-07 | 1984-10-09 | Acumeter Laboratories, Inc. | Method of and apparatus for multi-layer viscous fluid deposition such as for the application of adhesives and the like |
US4521457A (en) * | 1982-09-21 | 1985-06-04 | Xerox Corporation | Simultaneous formation and deposition of multiple ribbon-like streams |
DE3308269A1 (de) * | 1983-03-09 | 1984-09-13 | Licentia Patent-Verwaltungs-Gmbh | Solarzelle |
US4602120A (en) * | 1983-11-25 | 1986-07-22 | Atlantic Richfield Company | Solar cell manufacture |
US4841946A (en) | 1984-02-17 | 1989-06-27 | Marks Alvin M | Solar collector, transmitter and heater |
US4771764A (en) * | 1984-04-06 | 1988-09-20 | Cluff C Brent | Water-borne azimuth-altitude tracking solar concentrators |
GB8510706D0 (en) | 1985-04-26 | 1985-06-05 | Marconi Co Ltd | Solar cell arrays |
US4711972A (en) | 1985-07-05 | 1987-12-08 | Entech, Inc. | Photovoltaic cell cover for use with a primary optical concentrator in a solar energy collector |
US4847349A (en) | 1985-08-27 | 1989-07-11 | Mitsui Toatsu Chemicals, Inc. | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines |
US4849028A (en) * | 1986-07-03 | 1989-07-18 | Hughes Aircraft Company | Solar cell with integrated interconnect device and process for fabrication thereof |
DE3633172A1 (de) | 1986-09-30 | 1988-04-07 | Man Technologie Gmbh | Verfahren zur nutzung von sonnenenergie und vorrichtung zur durchfuehrung des verfahrens |
JPS63175667A (ja) * | 1987-01-14 | 1988-07-20 | Matsushita Electric Ind Co Ltd | 多列同時塗布方法 |
US5216543A (en) * | 1987-03-04 | 1993-06-01 | Minnesota Mining And Manufacturing Company | Apparatus and method for patterning a film |
US4747517A (en) * | 1987-03-23 | 1988-05-31 | Minnesota Mining And Manufacturing Company | Dispenser for metering proportionate increments of polymerizable materials |
US4826777A (en) * | 1987-04-17 | 1989-05-02 | The Standard Oil Company | Making a photoresponsive array |
US4792685A (en) * | 1987-04-29 | 1988-12-20 | Masami Yamakawa | Photoelectric sensor |
US4746370A (en) | 1987-04-29 | 1988-05-24 | Ga Technologies Inc. | Photothermophotovoltaic converter |
US4938994A (en) * | 1987-11-23 | 1990-07-03 | Epicor Technology, Inc. | Method and apparatus for patch coating printed circuit boards |
US4855884A (en) | 1987-12-02 | 1989-08-08 | Morpheus Lights, Inc. | Variable beamwidth stage light |
US4952026A (en) * | 1988-10-14 | 1990-08-28 | Corning Incorporated | Integral optical element and method |
US5004319A (en) | 1988-12-29 | 1991-04-02 | The United States Of America As Represented By The Department Of Energy | Crystal diffraction lens with variable focal length |
US5017986A (en) * | 1989-08-28 | 1991-05-21 | At&T Bell Laboratories | Optical device mounting apparatus |
US4947825A (en) * | 1989-09-11 | 1990-08-14 | Rockwell International Corporation | Solar concentrator - radiator assembly |
US5089055A (en) * | 1989-12-12 | 1992-02-18 | Takashi Nakamura | Survivable solar power-generating systems for use with spacecraft |
US5062899A (en) * | 1990-03-30 | 1991-11-05 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Wide acceptance angle, high concentration ratio, optical collector |
DK170189B1 (da) * | 1990-05-30 | 1995-06-06 | Yakov Safir | Fremgangsmåde til fremstilling af halvlederkomponenter, samt solcelle fremstillet deraf |
JPH04124645A (ja) * | 1990-09-14 | 1992-04-24 | Fuji Photo Film Co Ltd | 写真用支持体及びその製造方法 |
US5213628A (en) * | 1990-09-20 | 1993-05-25 | Sanyo Electric Co., Ltd. | Photovoltaic device |
US5254388A (en) * | 1990-12-21 | 1993-10-19 | Minnesota Mining And Manufacturing Company | Light control film with reduced ghost images |
US5151377A (en) * | 1991-03-07 | 1992-09-29 | Mobil Solar Energy Corporation | Method for forming contacts |
US5167724A (en) | 1991-05-16 | 1992-12-01 | The United States Of America As Represented By The United States Department Of Energy | Planar photovoltaic solar concentrator module |
US5180441A (en) | 1991-06-14 | 1993-01-19 | General Dynamics Corporation/Space Systems Division | Solar concentrator array |
US5356488A (en) * | 1991-12-27 | 1994-10-18 | Rudolf Hezel | Solar cell and method for its manufacture |
CZ196794A3 (en) * | 1992-02-25 | 1994-12-15 | Cambridge Consultants | Liquid feeding device |
US5172170A (en) * | 1992-03-13 | 1992-12-15 | Xerox Corporation | Electroded donor roll for a scavengeless developer unit |
US5404869A (en) * | 1992-04-16 | 1995-04-11 | Tir Technologies, Inc. | Faceted totally internally reflecting lens with individually curved faces on facets |
US5288337A (en) | 1992-06-25 | 1994-02-22 | Siemens Solar Industries, L.P. | Photovoltaic module with specular reflector |
US5353813A (en) * | 1992-08-19 | 1994-10-11 | Philip Morris Incorporated | Reinforced carbon heater with discrete heating zones |
JP2613719B2 (ja) | 1992-09-01 | 1997-05-28 | キヤノン株式会社 | 太陽電池モジュールの製造方法 |
US5344496A (en) | 1992-11-16 | 1994-09-06 | General Dynamics Corporation, Space Systems Division | Lightweight solar concentrator cell array |
EP0632507A3 (en) * | 1993-05-12 | 1995-11-22 | Optical Coating Laboratory Inc | Cover for solar cells which reflects UV / IR rays. |
JPH06337366A (ja) | 1993-05-21 | 1994-12-06 | Xerox Corp | 電子写真プリンターにおけるラスター出力スキャナのための露光装置 |
AU7045094A (en) | 1993-06-02 | 1994-12-20 | Robert C. Stirbl | Method for changing solar energy distribution |
US5559677A (en) * | 1994-04-29 | 1996-09-24 | Motorola, Inc. | Method of forming a device by selectively thermal spraying a metallic conductive material thereon |
US5529054A (en) * | 1994-06-20 | 1996-06-25 | Shoen; Neil C. | Solar energy concentrator and collector system and associated method |
US5501743A (en) * | 1994-08-11 | 1996-03-26 | Cherney; Matthew | Fiber optic power-generating system |
US5540216A (en) * | 1994-11-21 | 1996-07-30 | Rasmusson; James K. | Apparatus and method for concentrating radiant energy emanated by a moving energy source |
US5553747A (en) * | 1994-12-07 | 1996-09-10 | Smithkline Beecham Corporation | Container for multisegmental toothpaste |
US5569399A (en) * | 1995-01-20 | 1996-10-29 | General Electric Company | Lasing medium surface modification |
BR9510445A (pt) * | 1995-02-02 | 1998-05-19 | Minnesota Mining & Mfg | Processo e aparelho para revestir um substrato |
US5538563A (en) * | 1995-02-03 | 1996-07-23 | Finkl; Anthony W. | Solar energy concentrator apparatus for bifacial photovoltaic cells |
EP0729189A1 (en) * | 1995-02-21 | 1996-08-28 | Interuniversitair Micro-Elektronica Centrum Vzw | Method of preparing solar cells and products obtained thereof |
GB9507572D0 (en) * | 1995-04-12 | 1995-05-31 | Smithkline Beecham Plc | Dispenser |
US5929530A (en) * | 1995-08-18 | 1999-07-27 | Mcdonnell Douglas Corporation | Advanced solar controller |
ATE226114T1 (de) * | 1996-01-31 | 2002-11-15 | Airspray Int Bv | Sprühvorrichtung zur abgabe von mehrkomponentenmaterial |
US6476343B2 (en) * | 1996-07-08 | 2002-11-05 | Sandia Corporation | Energy-beam-driven rapid fabrication system |
US5902540A (en) * | 1996-10-08 | 1999-05-11 | Illinois Tool Works Inc. | Meltblowing method and apparatus |
US6014246A (en) * | 1996-11-06 | 2000-01-11 | University Of Pittsburgh Of The Commonwealth System Of Higher Education | Thermally switchable optical devices |
US5873495A (en) * | 1996-11-21 | 1999-02-23 | Saint-Germain; Jean G. | Device for dispensing multi-components from a container |
AUPO429396A0 (en) * | 1996-12-20 | 1997-01-23 | Solsearch Pty Ltd | Solar energy collector system |
US5969052A (en) * | 1996-12-31 | 1999-10-19 | Kimberly Clark Worldwide, Inc. | Temperature sensitive polymers and water-dispersible products containing the polymers |
WO1999001342A1 (en) * | 1997-07-01 | 1999-01-14 | Smithkline Beecham Corporation | Apparatus for inserting plural materials into containers |
US6011307A (en) * | 1997-08-12 | 2000-01-04 | Micron Technology, Inc. | Anisotropic conductive interconnect material for electronic devices, method of use and resulting product |
DE19735281A1 (de) | 1997-08-14 | 1999-02-18 | Rolf Hoericht | Einrichtung zur Erzeugung von Energie |
US6008449A (en) * | 1997-08-19 | 1999-12-28 | Cole; Eric D. | Reflective concentrating solar cell assembly |
EP1027723B1 (en) * | 1997-10-14 | 2009-06-17 | Patterning Technologies Limited | Method of forming an electric capacitor |
US6130465A (en) * | 1997-10-29 | 2000-10-10 | Light Point Systems Inc. | Micro-solar assembly |
EP0915523A3 (en) * | 1997-10-29 | 2005-11-02 | Canon Kabushiki Kaisha | A photovoltaic element having a back side transparent and electrically conductive layer with a light incident side surface region having a specific cross section and a module comprising said photovoltaic element |
US6379521B1 (en) * | 1998-01-06 | 2002-04-30 | Canon Kabushiki Kaisha | Method of producing zinc oxide film, method of producing photovoltaic element, and method of producing semiconductor element substrate |
US6185030B1 (en) * | 1998-03-20 | 2001-02-06 | James W. Overbeck | Wide field of view and high speed scanning microscopy |
US6278054B1 (en) | 1998-05-28 | 2001-08-21 | Tecstar Power Systems, Inc. | Solar cell having an integral monolithically grown bypass diode |
AUPP437598A0 (en) * | 1998-06-29 | 1998-07-23 | Unisearch Limited | A self aligning method for forming a selective emitter and metallization in a solar cell |
JP3259692B2 (ja) * | 1998-09-18 | 2002-02-25 | 株式会社日立製作所 | 集光型太陽光発電モジュール及びその製造方法並びに集光型太陽光発電システム |
US6239353B1 (en) * | 1998-10-14 | 2001-05-29 | Christopher M. Hall | Solar tracker |
US6204523B1 (en) * | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
US6118067A (en) * | 1998-11-20 | 2000-09-12 | Swales Aerospace | Method and apparatus for improved solar concentration arrays |
US6274508B1 (en) * | 1999-02-05 | 2001-08-14 | Alien Technology Corporation | Apparatuses and methods used in forming assemblies |
US6291896B1 (en) | 1999-02-16 | 2001-09-18 | Alien Technology Corporation | Functionally symmetric integrated circuit die |
US6380729B1 (en) | 1999-02-16 | 2002-04-30 | Alien Technology Corporation | Testing integrated circuit dice |
US6020554A (en) | 1999-03-19 | 2000-02-01 | Photovoltaics International, Llc | Tracking solar energy conversion unit adapted for field assembly |
JP2000294813A (ja) * | 1999-04-07 | 2000-10-20 | Bridgestone Corp | 太陽電池用バックカバー材及び太陽電池 |
US6257450B1 (en) * | 1999-04-21 | 2001-07-10 | Pechiney Plastic Packaging, Inc. | Dual dispense container having cloverleaf orifice |
US6203621B1 (en) * | 1999-05-24 | 2001-03-20 | Trw Inc. | Vacuum chuck for holding thin sheet material |
US6091017A (en) * | 1999-08-23 | 2000-07-18 | Composite Optics Incorporated | Solar concentrator array |
US6623579B1 (en) * | 1999-11-02 | 2003-09-23 | Alien Technology Corporation | Methods and apparatus for fluidic self assembly |
US6479395B1 (en) | 1999-11-02 | 2002-11-12 | Alien Technology Corporation | Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings |
US6527964B1 (en) * | 1999-11-02 | 2003-03-04 | Alien Technology Corporation | Methods and apparatuses for improved flow in performing fluidic self assembly |
US6420266B1 (en) * | 1999-11-02 | 2002-07-16 | Alien Technology Corporation | Methods for creating elements of predetermined shape and apparatuses using these elements |
JP2001148500A (ja) * | 1999-11-22 | 2001-05-29 | Sanyo Electric Co Ltd | 太陽電池モジュール |
ES2157846B1 (es) * | 1999-12-02 | 2002-03-01 | Univ Madrid Politecnica | Dispositivo con lente discontinua de reflexion total interna y dioptrico asferico para concentracion o colimacion de energia radiante. |
JP4774146B2 (ja) * | 1999-12-23 | 2011-09-14 | パナソニック株式会社 | レーザを用いて波長より小さなピッチで穴を開けるための方法および装置 |
JP2001251039A (ja) * | 2000-03-07 | 2001-09-14 | Seiko Epson Corp | ガラス基板およびその製造方法ならびに半導体装置 |
EP1266255B1 (en) | 2000-03-16 | 2008-11-12 | Lee Products, Inc. | Method of designing and manufacturing high efficiency non-imaging optics |
JP3865036B2 (ja) * | 2000-04-07 | 2007-01-10 | セイコーエプソン株式会社 | 光モジュール及びその製造方法並びに光伝達装置 |
KR100454225B1 (ko) | 2000-05-12 | 2004-10-26 | 황우성 | 초박형 고집속 광에너지 집속장치 |
US6423565B1 (en) * | 2000-05-30 | 2002-07-23 | Kurt L. Barth | Apparatus and processes for the massproduction of photovotaic modules |
US6232217B1 (en) * | 2000-06-05 | 2001-05-15 | Chartered Semiconductor Manufacturing Ltd. | Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening |
US6423140B1 (en) * | 2000-06-08 | 2002-07-23 | Formosa Advanced Coating Technologies, Inc. | Die set for preparing ABCABC multiple-stripe coating |
US6398370B1 (en) * | 2000-11-15 | 2002-06-04 | 3M Innovative Properties Company | Light control device |
US6620645B2 (en) * | 2000-11-16 | 2003-09-16 | G.T. Equipment Technologies, Inc | Making and connecting bus bars on solar cells |
US20020149107A1 (en) * | 2001-02-02 | 2002-10-17 | Avery Dennison Corporation | Method of making a flexible substrate containing self-assembling microstructures |
JP2002289900A (ja) * | 2001-03-23 | 2002-10-04 | Canon Inc | 集光型太陽電池モジュール及び集光型太陽光発電システム |
US7186102B2 (en) * | 2001-04-26 | 2007-03-06 | Strandex Corporation | Apparatus and method for low-density cellular wood plastic composites |
US6498290B1 (en) * | 2001-05-29 | 2002-12-24 | The Sun Trust, L.L.C. | Conversion of solar energy |
US6606247B2 (en) | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
EP1329297A3 (en) * | 2001-06-15 | 2011-10-19 | FUJIFILM Corporation | Method of producing of cellulose ester film |
CN2606309Y (zh) | 2001-06-22 | 2004-03-10 | 高增世 | 双槽面镜式太阳能单向导光聚能板 |
US6555739B2 (en) * | 2001-09-10 | 2003-04-29 | Ekla-Tek, Llc | Photovoltaic array and method of manufacturing same |
US6531653B1 (en) * | 2001-09-11 | 2003-03-11 | The Boeing Company | Low cost high solar flux photovoltaic concentrator receiver |
US7208674B2 (en) | 2001-09-11 | 2007-04-24 | Eric Aylaian | Solar cell having photovoltaic cells inclined at acute angle to each other |
US6597510B2 (en) * | 2001-11-02 | 2003-07-22 | Corning Incorporated | Methods and apparatus for making optical devices including microlens arrays |
US6697096B2 (en) * | 2001-11-16 | 2004-02-24 | Applied Materials, Inc. | Laser beam pattern generator having rotating scanner compensator and method |
WO2003074254A1 (en) * | 2002-02-28 | 2003-09-12 | Scimed Life Systems, Inc. | Ultrasonic assisted apparatus and process |
US7689022B2 (en) * | 2002-03-15 | 2010-03-30 | Affymetrix, Inc. | System, method, and product for scanning of biological materials |
US7270528B2 (en) * | 2002-05-07 | 2007-09-18 | 3D Systems, Inc. | Flash curing in selective deposition modeling |
AU2003261394A1 (en) * | 2002-08-05 | 2004-02-23 | Research Foundation Of The State University Of New York | System and method for manufacturing embedded conformal electronics |
US6818818B2 (en) * | 2002-08-13 | 2004-11-16 | Esmond T. Goei | Concentrating solar energy receiver |
US6896381B2 (en) * | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
US20050081908A1 (en) * | 2003-03-19 | 2005-04-21 | Stewart Roger G. | Method and apparatus for generation of electrical power from solar energy |
JP2004288898A (ja) * | 2003-03-24 | 2004-10-14 | Canon Inc | 太陽電池モジュールの製造方法 |
US7388147B2 (en) * | 2003-04-10 | 2008-06-17 | Sunpower Corporation | Metal contact structure for solar cell and method of manufacture |
US7259323B2 (en) | 2003-04-22 | 2007-08-21 | The Aerospace Corporation | Thin film solar cell thermal radiator |
US7964789B2 (en) * | 2003-05-07 | 2011-06-21 | Imec | Germanium solar cell and method for the production thereof |
US6959993B2 (en) * | 2003-07-10 | 2005-11-01 | Energy Innovations, Inc. | Solar concentrator array with individually adjustable elements |
IL157716A0 (en) | 2003-09-02 | 2004-03-28 | Eli Shifman | Solar energy utilization unit and solar energy utilization system |
JP4121928B2 (ja) * | 2003-10-08 | 2008-07-23 | シャープ株式会社 | 太陽電池の製造方法 |
US6958868B1 (en) | 2004-03-29 | 2005-10-25 | John George Pender | Motion-free tracking solar concentrator |
JP2005317225A (ja) * | 2004-04-27 | 2005-11-10 | Enplas Corp | 色素増感型太陽電池、及び色素増感型太陽電池の光電極基板 |
JP4635474B2 (ja) * | 2004-05-14 | 2011-02-23 | ソニー株式会社 | 光電変換素子、及びこれに用いる透明導電性基板 |
JP2006005252A (ja) * | 2004-06-18 | 2006-01-05 | Nandei Electronics:Kk | 回路基板及びその製造方法 |
US7045794B1 (en) * | 2004-06-18 | 2006-05-16 | Novelx, Inc. | Stacked lens structure and method of use thereof for preventing electrical breakdown |
JP2006083036A (ja) * | 2004-09-17 | 2006-03-30 | Fujikura Ltd | ガラスのエッチング方法、透明導電基板の製造方法および光電変換素子 |
US7199918B2 (en) * | 2005-01-07 | 2007-04-03 | Miradia Inc. | Electrical contact method and structure for deflection devices formed in an array configuration |
US20060207650A1 (en) * | 2005-03-21 | 2006-09-21 | The Regents Of The University Of California | Multi-junction solar cells with an aplanatic imaging system and coupled non-imaging light concentrator |
US7906722B2 (en) | 2005-04-19 | 2011-03-15 | Palo Alto Research Center Incorporated | Concentrating solar collector with solid optical element |
US7444934B2 (en) * | 2005-05-24 | 2008-11-04 | Micron Technology, Inc. | Supercritical fluid-assisted direct write for printing integrated circuits |
JP2006332351A (ja) * | 2005-05-26 | 2006-12-07 | Fujikura Ltd | 発光素子実装用基板および発光装置 |
DE102005033272A1 (de) * | 2005-06-03 | 2006-12-07 | Solartec Ag | Konzentrator-Photovoltaik-Einrichtung, daraus gebildetes PV-Konzentratormodul sowie Herstellverfahren hierfür |
US7394016B2 (en) * | 2005-10-11 | 2008-07-01 | Solyndra, Inc. | Bifacial elongated solar cell devices with internal reflectors |
US20080047605A1 (en) | 2005-07-28 | 2008-02-28 | Regents Of The University Of California | Multi-junction solar cells with a homogenizer system and coupled non-imaging light concentrator |
US20070137691A1 (en) * | 2005-12-19 | 2007-06-21 | Cobb Joshua M | Light collector and concentrator |
US8283554B2 (en) | 2005-12-19 | 2012-10-09 | Corning Incorporated | Method and apparatus for concentrating light |
EP1997154A2 (en) | 2006-03-08 | 2008-12-03 | Light Prescriptions Innovators, LLC. | Multi-junction solar cells with a homogenizer system and coupled non-imaging light concentrator |
WO2007109901A1 (en) | 2006-03-28 | 2007-10-04 | Menova Energy Inc. | Support structure kor a solar collector system |
US7638708B2 (en) * | 2006-05-05 | 2009-12-29 | Palo Alto Research Center Incorporated | Laminated solar concentrating photovoltaic device |
TWI466304B (zh) * | 2006-07-07 | 2014-12-21 | Energy Related Devices Inc | 與球形光伏特電池彈性耦合的微型集中器 |
US20080186593A1 (en) * | 2007-02-02 | 2008-08-07 | Sol Focus, Inc. | Metal trace fabrication for optical element |
US20080308154A1 (en) * | 2007-06-06 | 2008-12-18 | Green Volts, Inc. | Reflective secondary optic for concentrated photovoltaic systems |
US20090084374A1 (en) * | 2007-06-13 | 2009-04-02 | Mills David R | Solar energy receiver having optically inclined aperture |
US20090056789A1 (en) * | 2007-08-30 | 2009-03-05 | Vladimir Draganov | Solar concentrator and solar concentrator array |
CN101227158A (zh) | 2008-01-21 | 2008-07-23 | 北京格物创道科技发明有限公司 | 自动追踪式太阳能发电机 |
EP2326889A4 (en) | 2008-09-19 | 2013-07-03 | Univ California | SOLAR ENERGY SYSTEM AND METHOD AND METHOD OF MANUFACTURING THEREOF |
-
2007
- 2007-07-24 US US11/782,609 patent/US20080186593A1/en not_active Abandoned
- 2007-07-24 US US11/782,376 patent/US20080185039A1/en not_active Abandoned
- 2007-07-24 US US11/782,605 patent/US20090025784A1/en not_active Abandoned
- 2007-07-24 US US11/782,359 patent/US20090025789A1/en not_active Abandoned
-
2008
- 2008-01-10 AU AU2008214229A patent/AU2008214229A1/en not_active Abandoned
- 2008-01-10 AU AU2008214228A patent/AU2008214228B2/en not_active Ceased
- 2008-01-10 JP JP2009548352A patent/JP2010518255A/ja active Pending
- 2008-01-10 EP EP08727546A patent/EP2115787A1/en not_active Withdrawn
- 2008-01-10 JP JP2009548351A patent/JP5869204B2/ja active Active
- 2008-01-10 WO PCT/US2008/050790 patent/WO2008097687A2/en active Application Filing
- 2008-01-10 EP EP08727545.9A patent/EP2115781B1/en active Active
-
2010
- 2010-07-22 US US12/841,823 patent/US20100294364A1/en not_active Abandoned
- 2010-10-21 US US12/909,488 patent/US8389851B2/en active Active
-
2012
- 2012-08-15 US US13/586,794 patent/US8624102B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2115787A1 (en) | 2009-11-11 |
US20090025784A1 (en) | 2009-01-29 |
US20080185039A1 (en) | 2008-08-07 |
JP2010518255A (ja) | 2010-05-27 |
EP2115781B1 (en) | 2017-11-01 |
WO2008097687A2 (en) | 2008-08-14 |
US20080186593A1 (en) | 2008-08-07 |
US20120305405A1 (en) | 2012-12-06 |
EP2115781A2 (en) | 2009-11-11 |
US20090025789A1 (en) | 2009-01-29 |
AU2008214228A1 (en) | 2008-08-14 |
AU2008214229A1 (en) | 2008-08-14 |
US8389851B2 (en) | 2013-03-05 |
US8624102B2 (en) | 2014-01-07 |
US20100294364A1 (en) | 2010-11-25 |
JP2010518603A (ja) | 2010-05-27 |
WO2008097687A3 (en) | 2008-10-02 |
EP2115781A4 (en) | 2015-10-07 |
US20110031211A1 (en) | 2011-02-10 |
AU2008214228B2 (en) | 2013-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5869204B2 (ja) | 光学素子用の金属トレース形成 | |
JP3129728B2 (ja) | 薄膜半導体装置 | |
CN101675516B (zh) | 具有通过过孔连接到前侧触头的后侧触头的芯片 | |
US7439094B2 (en) | Method of manufacturing a semiconductor package | |
US7935568B2 (en) | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | |
US6033931A (en) | Semiconductor device including stacked chips having metal patterned on circuit surface and one edge side of chip | |
TWI248140B (en) | Semiconductor device containing stacked semiconductor chips and manufacturing method thereof | |
CN104584214B (zh) | 载体晶片从器件晶片的激光去键合 | |
US20050205977A1 (en) | Methods and apparatus for packaging integrated circuit devices | |
US20080099907A1 (en) | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | |
JP5591343B2 (ja) | オプトエレクトロニクス素子及び該オプトエレクトロニクス素子の製造方法 | |
KR20060132490A (ko) | 관통 전극을 갖는 반도체 장치 및 그 제조 방법 | |
CN101335280A (zh) | 影像感测元件封装体及其制作方法 | |
TW201218346A (en) | Conductive pads defined by embedded traces | |
JPH08264819A (ja) | 半導体装置及び該製造方法 | |
KR20030069321A (ko) | 플립칩 범핑을 이용한 반도체 촬상소자 패키지 및 그제조방법 | |
US6338973B1 (en) | Semiconductor device and method of fabrication | |
CN101383299B (zh) | 电子元件的晶圆级封装及其制造方法 | |
US6372623B1 (en) | Semiconductor device and method of fabrication | |
WO2008097805A2 (en) | Conductor fabrication for optical element | |
JP2003059969A (ja) | 物質の追加を必要としない溶接による接続サポートに構成部分を付着する方法 | |
CN1972570A (zh) | 电路板形成导电结构的制程 | |
WO2003081669A1 (fr) | Module de circuits integres et procede de fabrication correspondant | |
TWI291239B (en) | Manufacturing method for chip package structure | |
CN105977270A (zh) | 影像芯片模组及其制作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110104 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110104 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120904 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120905 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130814 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140218 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140616 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140623 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20140718 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151029 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160107 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5869204 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |