JP5858849B2 - 金属箔 - Google Patents

金属箔 Download PDF

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Publication number
JP5858849B2
JP5858849B2 JP2012083265A JP2012083265A JP5858849B2 JP 5858849 B2 JP5858849 B2 JP 5858849B2 JP 2012083265 A JP2012083265 A JP 2012083265A JP 2012083265 A JP2012083265 A JP 2012083265A JP 5858849 B2 JP5858849 B2 JP 5858849B2
Authority
JP
Japan
Prior art keywords
metal foil
foil
coating layer
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012083265A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013213250A (ja
JP2013213250A5 (enrdf_load_stackoverflow
Inventor
晃正 森山
晃正 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2012083265A priority Critical patent/JP5858849B2/ja
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to KR1020167032633A priority patent/KR102095619B1/ko
Priority to KR1020147030582A priority patent/KR20140141704A/ko
Priority to PCT/JP2013/055572 priority patent/WO2013146088A1/ja
Priority to CN201380018605.7A priority patent/CN104271812B/zh
Priority to TW102107462A priority patent/TWI481746B/zh
Publication of JP2013213250A publication Critical patent/JP2013213250A/ja
Publication of JP2013213250A5 publication Critical patent/JP2013213250A5/ja
Application granted granted Critical
Publication of JP5858849B2 publication Critical patent/JP5858849B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2012083265A 2012-03-30 2012-03-30 金属箔 Active JP5858849B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012083265A JP5858849B2 (ja) 2012-03-30 2012-03-30 金属箔
KR1020147030582A KR20140141704A (ko) 2012-03-30 2013-02-28 금속박
PCT/JP2013/055572 WO2013146088A1 (ja) 2012-03-30 2013-02-28 金属箔
CN201380018605.7A CN104271812B (zh) 2012-03-30 2013-02-28 金属箔
KR1020167032633A KR102095619B1 (ko) 2012-03-30 2013-02-28 금속박
TW102107462A TWI481746B (zh) 2012-03-30 2013-03-04 Metal foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012083265A JP5858849B2 (ja) 2012-03-30 2012-03-30 金属箔

Publications (3)

Publication Number Publication Date
JP2013213250A JP2013213250A (ja) 2013-10-17
JP2013213250A5 JP2013213250A5 (enrdf_load_stackoverflow) 2014-11-13
JP5858849B2 true JP5858849B2 (ja) 2016-02-10

Family

ID=49259363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012083265A Active JP5858849B2 (ja) 2012-03-30 2012-03-30 金属箔

Country Status (5)

Country Link
JP (1) JP5858849B2 (enrdf_load_stackoverflow)
KR (2) KR20140141704A (enrdf_load_stackoverflow)
CN (1) CN104271812B (enrdf_load_stackoverflow)
TW (1) TWI481746B (enrdf_load_stackoverflow)
WO (1) WO2013146088A1 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6650923B2 (ja) * 2015-03-24 2020-02-19 三井金属鉱業株式会社 キャリア付極薄銅箔、その製造方法、銅張積層板及びプリント配線板
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6683507B2 (ja) * 2015-07-22 2020-04-22 サトーホールディングス株式会社 ラベルを用いた加工物の生産を管理する方法
JP6594108B2 (ja) * 2015-08-25 2019-10-23 サトーホールディングス株式会社 ラベル、および、当該ラベルを用いた加工物の生産を管理する方法
JP6605271B2 (ja) * 2015-09-24 2019-11-13 Ｊｘ金属株式会社 離型層付き電解銅箔、積層体、半導体パッケージの製造方法、電子機器の製造方法及びプリント配線板の製造方法
JP6204430B2 (ja) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
MY186859A (en) * 2016-04-14 2021-08-26 Mitsui Mining & Smelting Co Ltd Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
JP6782116B2 (ja) * 2016-08-02 2020-11-11 古河電気工業株式会社 銀被覆材料
JP7251928B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
JP7251927B2 (ja) * 2018-06-05 2023-04-04 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
KR102098475B1 (ko) 2018-07-06 2020-04-07 주식회사 포스코 내식성, 도장성이 우수한 표면처리된 Zn-Ni 합금 전기도금강판의 제조방법
CN116762194A (zh) * 2021-09-03 2023-09-15 宁德时代新能源科技股份有限公司 金属箔及制备方法、集流体、电极、电池及用电装置
CA3172018A1 (en) * 2021-12-24 2023-06-24 Circuit Foil Luxembourg Electrolytic copper foil and secondary battery comprising the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215645A (en) * 1989-09-13 1993-06-01 Gould Inc. Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same
WO1991019024A1 (en) * 1990-05-30 1991-12-12 Gould, Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
JPH1036992A (ja) * 1996-07-19 1998-02-10 Japan Energy Corp 電解銅箔及びその製造方法
JP4445616B2 (ja) * 1999-10-27 2010-04-07 Ｄｏｗａホールディングス株式会社 電解銅箔
JP4419161B2 (ja) * 1999-10-27 2010-02-24 Ｄｏｗａホールディングス株式会社 電解銅箔の製造方法
JP2004226615A (ja) * 2003-01-22 2004-08-12 Ricoh Co Ltd 現像装置およびこれを使用する画像形成装置
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
JP4172704B2 (ja) 2003-07-31 2008-10-29 日鉱金属株式会社 表面処理銅箔およびそれを使用した基板
US20090208762A1 (en) * 2005-06-23 2009-08-20 Nippon Mining & Metals Co., Ltd. Copper Foil for Printed Wiring Board
JP2009170771A (ja) 2008-01-18 2009-07-30 Toppan Printing Co Ltd 太陽電池バックシート及び太陽電池モジュール
JP5318886B2 (ja) * 2008-11-25 2013-10-16 Ｊｘ日鉱日石金属株式会社 印刷回路用銅箔
JP2011061151A (ja) 2009-09-14 2011-03-24 Toppan Printing Co Ltd 太陽電池用裏面保護シートおよびその製造方法、太陽電池モジュール
JP5493797B2 (ja) * 2009-12-10 2014-05-14 富士ゼロックス株式会社 画像形成装置および定着装置
MY172093A (en) * 2009-12-24 2019-11-13 Jx Nippon Mining & Metals Corp Surface-treated copper foil
JP2011216598A (ja) * 2010-03-31 2011-10-27 Kuraray Co Ltd 高周波回路基板
JP5634103B2 (ja) 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5885054B2 (ja) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。
JP5128695B2 (ja) * 2010-06-28 2013-01-23 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用電解銅箔、該電解銅箔を用いたリチウムイオン二次電池用電極、該電極を使用したリチウムイオン二次電池

Also Published As

Publication number Publication date
JP2013213250A (ja) 2013-10-17
TWI481746B (zh) 2015-04-21
WO2013146088A1 (ja) 2013-10-03
KR20140141704A (ko) 2014-12-10
CN104271812A (zh) 2015-01-07
KR20160137678A (ko) 2016-11-30
KR102095619B1 (ko) 2020-03-31
TW201343976A (zh) 2013-11-01
CN104271812B (zh) 2016-10-05

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