JP5854727B2 - シアン化物を含まない銀電気めっき液 - Google Patents

シアン化物を含まない銀電気めっき液 Download PDF

Info

Publication number
JP5854727B2
JP5854727B2 JP2011204196A JP2011204196A JP5854727B2 JP 5854727 B2 JP5854727 B2 JP 5854727B2 JP 2011204196 A JP2011204196 A JP 2011204196A JP 2011204196 A JP2011204196 A JP 2011204196A JP 5854727 B2 JP5854727 B2 JP 5854727B2
Authority
JP
Japan
Prior art keywords
silver
electroplating
solution
cyanide
pyridyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011204196A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012092434A (ja
JP2012092434A5 (enExample
Inventor
マルギト・クラウス
ワン・チャン−ベグリンガー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of JP2012092434A publication Critical patent/JP2012092434A/ja
Publication of JP2012092434A5 publication Critical patent/JP2012092434A5/ja
Application granted granted Critical
Publication of JP5854727B2 publication Critical patent/JP5854727B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2011204196A 2010-09-21 2011-09-20 シアン化物を含まない銀電気めっき液 Active JP5854727B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38506610P 2010-09-21 2010-09-21
US61/385066 2010-09-21

Publications (3)

Publication Number Publication Date
JP2012092434A JP2012092434A (ja) 2012-05-17
JP2012092434A5 JP2012092434A5 (enExample) 2015-12-10
JP5854727B2 true JP5854727B2 (ja) 2016-02-09

Family

ID=44719414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011204196A Active JP5854727B2 (ja) 2010-09-21 2011-09-20 シアン化物を含まない銀電気めっき液

Country Status (7)

Country Link
US (1) US8608932B2 (enExample)
EP (1) EP2431502B1 (enExample)
JP (1) JP5854727B2 (enExample)
KR (1) KR101779410B1 (enExample)
CN (1) CN102409373B (enExample)
SG (1) SG179380A1 (enExample)
TW (1) TWI427194B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103741178B (zh) * 2014-01-20 2017-06-16 厦门大学 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
US10889907B2 (en) 2014-02-21 2021-01-12 Rohm And Haas Electronic Materials Llc Cyanide-free acidic matte silver electroplating compositions and methods
CN105463524A (zh) * 2015-12-23 2016-04-06 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液的电镀方法
CN105506683A (zh) * 2015-12-23 2016-04-20 苏州市金星工艺镀饰有限公司 一种无氰镀银电镀液
CN107604394A (zh) * 2017-09-29 2018-01-19 佛山市春暖花开科技有限公司 一种银的电镀液
MY203013A (en) 2018-08-21 2024-06-04 Umicore Galvanotechnik Gmbh Electrolyte for the cyanide-free deposition of silver
DE102019106004B4 (de) * 2019-03-08 2023-11-30 Umicore Galvanotechnik Gmbh Additiv für die cyanidfreie Abscheidung von Silber
DE102018120357A1 (de) * 2018-08-21 2020-02-27 Umicore Galvanotechnik Gmbh Elektrolyt zur Abscheidung von Silber und Silberlegierungsüberzügen
CN111349934A (zh) * 2020-03-12 2020-06-30 华东师范大学 一种柔性银电极及其制备方法
JP7740879B2 (ja) * 2021-01-20 2025-09-17 株式会社Jcu 電解銀めっき浴およびこれを用いた電解銀めっき方法
US11578418B2 (en) * 2021-03-29 2023-02-14 Rohm And Haas Electronic Materials Llc (Rhem) Silver electroplating compositions and methods for electroplating silver with low coefficients of friction
KR102476608B1 (ko) 2021-11-19 2022-12-13 (주)피이솔브 은도금액
FR3155008B1 (fr) 2023-11-06 2025-11-07 Axon Cable Sa Composition de bain d’argenture sans cyanure et ses utilisations

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
JPS534499B2 (enExample) 1972-11-13 1978-02-17
US4126524A (en) * 1975-03-12 1978-11-21 Technic, Inc. Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys
BG29206A1 (en) 1979-07-06 1980-10-15 Novev Combinated brightnessformer for amonia- sulphamate electrolyte for plating with silver
US4478691A (en) * 1981-10-13 1984-10-23 At&T Bell Laboratories Silver plating procedure
GB8334226D0 (en) 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
US5198132A (en) 1990-10-11 1993-03-30 The Lubrizol Corporation Antioxidant products
JPH08104993A (ja) * 1994-10-04 1996-04-23 Electroplating Eng Of Japan Co 銀めっき浴及びその銀めっき方法
JP3012182B2 (ja) * 1995-11-15 2000-02-21 荏原ユージライト株式会社 銀および銀合金めっき浴
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JP4296358B2 (ja) * 1998-01-21 2009-07-15 石原薬品株式会社 銀及び銀合金メッキ浴
JPH11302893A (ja) * 1998-04-22 1999-11-02 Okuno Chem Ind Co Ltd 非シアン系電気銀めっき液
WO2000079031A1 (de) * 1999-06-17 2000-12-28 Degussa Galvanotechnik Gmbh Saures bad zur galvanischen abscheidung von glänzenden gold- und goldlegierungsschichten und glanzzusatz hierfür
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR2807450B1 (fr) 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
US7628903B1 (en) 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
DE10026680C1 (de) 2000-05-30 2002-02-21 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten
DE10124002C1 (de) 2001-05-17 2003-02-06 Ami Doduco Gmbh Saures Silberbad
JP2004225063A (ja) * 2003-01-20 2004-08-12 Electroplating Eng Of Japan Co 非シアン系銀めっき液及び銀めっき方法並びにそれによるバンプ形成方法
JP2005105386A (ja) 2003-10-01 2005-04-21 Nagoya Plating Co Ltd 繊維用の無電解銀めっき液
US20050183961A1 (en) 2004-02-24 2005-08-25 Morrissey Ronald J. Non-cyanide silver plating bath composition
JP2007327127A (ja) * 2006-06-09 2007-12-20 Daiwa Fine Chemicals Co Ltd (Laboratory) 銀めっき方法
EP2157209B1 (en) * 2008-07-31 2014-10-22 Rohm and Haas Electronic Materials LLC Inhibiting Background Plating
CN101665963B (zh) * 2009-09-23 2011-08-24 福建师范大学 一种环保型无氰银电镀液
JP5854726B2 (ja) * 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ニッケル上に銀ストライクを電気めっきする方法

Also Published As

Publication number Publication date
TW201219610A (en) 2012-05-16
TWI427194B (zh) 2014-02-21
JP2012092434A (ja) 2012-05-17
CN102409373A (zh) 2012-04-11
EP2431502A3 (en) 2015-11-25
US8608932B2 (en) 2013-12-17
SG179380A1 (en) 2012-04-27
KR101779410B1 (ko) 2017-09-18
EP2431502A2 (en) 2012-03-21
US20120067735A1 (en) 2012-03-22
CN102409373B (zh) 2015-05-20
KR20120030982A (ko) 2012-03-29
EP2431502B1 (en) 2017-05-24

Similar Documents

Publication Publication Date Title
JP5854727B2 (ja) シアン化物を含まない銀電気めっき液
TWI229016B (en) Aqueous alkaline zincate solutions and methods
Goh et al. Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
TWI306908B (en) Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
TWI404834B (zh) 青銅之電鍍方法
CN101665963B (zh) 一种环保型无氰银电镀液
JP2012092434A5 (enExample)
KR101409701B1 (ko) 은 또는 은 합금층의 기재 위 침착용 시아나이드가 없는 전해질 조성물 및 방법
CN102965700B (zh) 不含氰化物的白青铜的粘着促进性
CN102162110A (zh) 一种甲基磺酸盐镀锡电解液及钢带或钢板的镀锡方法
JP5854726B2 (ja) ニッケル上に銀ストライクを電気めっきする方法
CN1703540B (zh) 电沉积青铜的方法
JPH06287791A (ja) シアン化物を含まない１価金属のメッキ溶液
JP5690727B2 (ja) 銅層のガルバニック堆積のための無シアン化物電解質組成物
TWI548782B (zh) 無氰化物之酸性消光銀電鍍組成物及方法
JP2004510053A (ja) 錫−銅合金層を析出させるための電解質及び方法
CN101643926A (zh) 一种无氰预镀铜电镀液
TWI669296B (zh) 用於電沉積含金之層之組合物及方法
CN102021613A (zh) 电解质组合物
JP2003530486A5 (enExample)
KR20210094558A (ko) 새틴 구리조 및 새틴 구리층 침착 방법
CN105392927A (zh) 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置
JP2016532004A (ja) 電気めっき浴
JP4742677B2 (ja) 錫めっき鋼帯の製造方法
JP4283256B2 (ja) 金属の電解析出方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140919

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150721

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150730

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20151021

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151208

R150 Certificate of patent or registration of utility model

Ref document number: 5854727

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250