JP2012092434A5 - - Google Patents
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- Publication number
- JP2012092434A5 JP2012092434A5 JP2011204196A JP2011204196A JP2012092434A5 JP 2012092434 A5 JP2012092434 A5 JP 2012092434A5 JP 2011204196 A JP2011204196 A JP 2011204196A JP 2011204196 A JP2011204196 A JP 2011204196A JP 2012092434 A5 JP2012092434 A5 JP 2012092434A5
- Authority
- JP
- Japan
- Prior art keywords
- silver
- pyridyl
- hydantoin
- acrylic acid
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052709 silver Inorganic materials 0.000 claims description 29
- 239000004332 silver Substances 0.000 claims description 29
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 24
- 238000009713 electroplating Methods 0.000 claims description 10
- 150000002019 disulfides Chemical class 0.000 claims description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 6
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 5
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical class O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 claims description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 4
- 150000003568 thioethers Chemical class 0.000 claims 4
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 claims 3
- 229940091173 hydantoin Drugs 0.000 claims 3
- 150000001469 hydantoins Chemical class 0.000 claims 3
- QWPBWIRUYTZEFI-UHFFFAOYSA-N 2-pyridin-2-ylprop-2-enoic acid Chemical compound OC(=O)C(=C)C1=CC=CC=N1 QWPBWIRUYTZEFI-UHFFFAOYSA-N 0.000 claims 2
- RHYBFKMFHLPQPH-UHFFFAOYSA-N N-methylhydantoin Chemical compound CN1CC(=O)NC1=O RHYBFKMFHLPQPH-UHFFFAOYSA-N 0.000 claims 2
- 229940053195 antiepileptics hydantoin derivative Drugs 0.000 claims 2
- 229940053198 antiepileptics succinimide derivative Drugs 0.000 claims 2
- 239000008139 complexing agent Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- LKDFTXDJKHGCAC-SNAWJCMRSA-N (e)-3-pyridin-2-ylprop-2-enoic acid Chemical compound OC(=O)\C=C\C1=CC=CC=N1 LKDFTXDJKHGCAC-SNAWJCMRSA-N 0.000 claims 1
- VUVORVXMOLQFMO-ONEGZZNKSA-N (e)-3-pyridin-3-ylprop-2-enoic acid Chemical compound OC(=O)\C=C\C1=CC=CN=C1 VUVORVXMOLQFMO-ONEGZZNKSA-N 0.000 claims 1
- JCFUUOVZEHIBNV-DAXSKMNVSA-N (z)-2-fluoro-3-pyridin-3-ylprop-2-enoic acid Chemical compound OC(=O)C(\F)=C\C1=CC=CN=C1 JCFUUOVZEHIBNV-DAXSKMNVSA-N 0.000 claims 1
- RFTORHYUCZJHDO-UHFFFAOYSA-N 1,3-dimethylimidazolidine-2,4-dione Chemical compound CN1CC(=O)N(C)C1=O RFTORHYUCZJHDO-UHFFFAOYSA-N 0.000 claims 1
- FRJOTCOVPXSYES-UHFFFAOYSA-N 3-(6-phenylpyridin-2-yl)prop-2-enoic acid Chemical compound OC(=O)C=CC1=CC=CC(C=2C=CC=CC=2)=N1 FRJOTCOVPXSYES-UHFFFAOYSA-N 0.000 claims 1
- HUTNXAYRNHOZHL-UHFFFAOYSA-N 4-methyl-3h-1,3-oxazol-2-one Chemical compound CC1=COC(=O)N1 HUTNXAYRNHOZHL-UHFFFAOYSA-N 0.000 claims 1
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 claims 1
- CXOFVDLJLONNDW-UHFFFAOYSA-N Phenytoin Chemical compound N1C(=O)NC(=O)C1(C=1C=CC=CC=1)C1=CC=CC=C1 CXOFVDLJLONNDW-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 11
- -1 silver ions Chemical class 0.000 description 7
- 238000007747 plating Methods 0.000 description 4
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical class [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 150000004763 sulfides Chemical class 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229910001923 silver oxide Inorganic materials 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical class [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYKLZUPYJFFNRR-UHFFFAOYSA-N 3-hydroxypiperidin-2-one Chemical compound OC1CCCNC1=O RYKLZUPYJFFNRR-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 235000012012 Paullinia yoco Nutrition 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- LOTBYPQQWICYBB-UHFFFAOYSA-N methyl n-hexyl-n-[2-(hexylamino)ethyl]carbamate Chemical compound CCCCCCNCCN(C(=O)OC)CCCCCC LOTBYPQQWICYBB-UHFFFAOYSA-N 0.000 description 1
- 229940098221 silver cyanide Drugs 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- YPDPYLJJBBKICP-JIZZDEOASA-M silver;(2r)-2-amino-3-hydroxy-3-oxopropane-1-thiolate;nitric acid Chemical class [Ag+].O[N+]([O-])=O.[S-]C[C@H](N)C(O)=O YPDPYLJJBBKICP-JIZZDEOASA-M 0.000 description 1
- NEMJXQHXQWLYDM-JJKGCWMISA-M silver;(2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanoate Chemical class [Ag+].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O NEMJXQHXQWLYDM-JJKGCWMISA-M 0.000 description 1
- XXAQKQFXTTXLEW-UHFFFAOYSA-J silver;trisodium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical class [Na+].[Na+].[Na+].[Ag+].[O-]S([O-])(=O)=S.[O-]S([O-])(=O)=S XXAQKQFXTTXLEW-UHFFFAOYSA-J 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US38506610P | 2010-09-21 | 2010-09-21 | |
| US61/385066 | 2010-09-21 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012092434A JP2012092434A (ja) | 2012-05-17 |
| JP2012092434A5 true JP2012092434A5 (enExample) | 2015-12-10 |
| JP5854727B2 JP5854727B2 (ja) | 2016-02-09 |
Family
ID=44719414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011204196A Active JP5854727B2 (ja) | 2010-09-21 | 2011-09-20 | シアン化物を含まない銀電気めっき液 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8608932B2 (enExample) |
| EP (1) | EP2431502B1 (enExample) |
| JP (1) | JP5854727B2 (enExample) |
| KR (1) | KR101779410B1 (enExample) |
| CN (1) | CN102409373B (enExample) |
| SG (1) | SG179380A1 (enExample) |
| TW (1) | TWI427194B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103741178B (zh) * | 2014-01-20 | 2017-06-16 | 厦门大学 | 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法 |
| US10889907B2 (en) | 2014-02-21 | 2021-01-12 | Rohm And Haas Electronic Materials Llc | Cyanide-free acidic matte silver electroplating compositions and methods |
| CN105506683A (zh) * | 2015-12-23 | 2016-04-20 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液 |
| CN105463524A (zh) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液的电镀方法 |
| CN107604394A (zh) * | 2017-09-29 | 2018-01-19 | 佛山市春暖花开科技有限公司 | 一种银的电镀液 |
| DE102019106004B4 (de) * | 2019-03-08 | 2023-11-30 | Umicore Galvanotechnik Gmbh | Additiv für die cyanidfreie Abscheidung von Silber |
| WO2020038948A1 (de) | 2018-08-21 | 2020-02-27 | Umicore Galvanotechnik Gmbh | Elektrolyt für die cyanidfreie abscheidung von silber |
| DE102018120357A1 (de) * | 2018-08-21 | 2020-02-27 | Umicore Galvanotechnik Gmbh | Elektrolyt zur Abscheidung von Silber und Silberlegierungsüberzügen |
| CN111349934A (zh) * | 2020-03-12 | 2020-06-30 | 华东师范大学 | 一种柔性银电极及其制备方法 |
| JP7740879B2 (ja) * | 2021-01-20 | 2025-09-17 | 株式会社Jcu | 電解銀めっき浴およびこれを用いた電解銀めっき方法 |
| US11578418B2 (en) * | 2021-03-29 | 2023-02-14 | Rohm And Haas Electronic Materials Llc (Rhem) | Silver electroplating compositions and methods for electroplating silver with low coefficients of friction |
| KR102476608B1 (ko) | 2021-11-19 | 2022-12-13 | (주)피이솔브 | 은도금액 |
| FR3155008B1 (fr) | 2023-11-06 | 2025-11-07 | Axon Cable Sa | Composition de bain d’argenture sans cyanure et ses utilisations |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615737A (en) * | 1969-08-04 | 1971-10-26 | Photocircuits Corp | Electroless copper deposition |
| JPS534499B2 (enExample) | 1972-11-13 | 1978-02-17 | ||
| US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
| BG29206A1 (en) | 1979-07-06 | 1980-10-15 | Novev | Combinated brightnessformer for amonia- sulphamate electrolyte for plating with silver |
| US4478691A (en) * | 1981-10-13 | 1984-10-23 | At&T Bell Laboratories | Silver plating procedure |
| GB8334226D0 (en) | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
| US4673472A (en) * | 1986-02-28 | 1987-06-16 | Technic Inc. | Method and electroplating solution for deposition of palladium or alloys thereof |
| GB8612361D0 (en) * | 1986-05-21 | 1986-06-25 | Engelhard Corp | Gold electroplating bath |
| US5198132A (en) | 1990-10-11 | 1993-03-30 | The Lubrizol Corporation | Antioxidant products |
| JPH08104993A (ja) | 1994-10-04 | 1996-04-23 | Electroplating Eng Of Japan Co | 銀めっき浴及びその銀めっき方法 |
| JP3012182B2 (ja) * | 1995-11-15 | 2000-02-21 | 荏原ユージライト株式会社 | 銀および銀合金めっき浴 |
| US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
| JP4296358B2 (ja) * | 1998-01-21 | 2009-07-15 | 石原薬品株式会社 | 銀及び銀合金メッキ浴 |
| JPH11302893A (ja) * | 1998-04-22 | 1999-11-02 | Okuno Chem Ind Co Ltd | 非シアン系電気銀めっき液 |
| CN1205360C (zh) * | 1999-06-17 | 2005-06-08 | 德古萨电解技术有限公司 | 用于电沉积有光泽的金和金合金镀层的酸性浴液及其所用的光泽剂 |
| FR2807422B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages |
| FR2807450B1 (fr) | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages |
| US7628903B1 (en) | 2000-05-02 | 2009-12-08 | Ishihara Chemical Co., Ltd. | Silver and silver alloy plating bath |
| DE10026680C1 (de) | 2000-05-30 | 2002-02-21 | Schloetter Fa Dr Ing Max | Elektrolyt und Verfahren zur Abscheidung von Zinn-Silber-Legierungsschichten und Verwendung des Elektrolyten |
| DE10124002C1 (de) | 2001-05-17 | 2003-02-06 | Ami Doduco Gmbh | Saures Silberbad |
| JP2004225063A (ja) * | 2003-01-20 | 2004-08-12 | Electroplating Eng Of Japan Co | 非シアン系銀めっき液及び銀めっき方法並びにそれによるバンプ形成方法 |
| JP2005105386A (ja) | 2003-10-01 | 2005-04-21 | Nagoya Plating Co Ltd | 繊維用の無電解銀めっき液 |
| US20050183961A1 (en) | 2004-02-24 | 2005-08-25 | Morrissey Ronald J. | Non-cyanide silver plating bath composition |
| JP2007327127A (ja) * | 2006-06-09 | 2007-12-20 | Daiwa Fine Chemicals Co Ltd (Laboratory) | 銀めっき方法 |
| EP2157209B1 (en) * | 2008-07-31 | 2014-10-22 | Rohm and Haas Electronic Materials LLC | Inhibiting Background Plating |
| CN101665963B (zh) * | 2009-09-23 | 2011-08-24 | 福建师范大学 | 一种环保型无氰银电镀液 |
| EP2431501B1 (en) * | 2010-09-21 | 2013-11-20 | Rohm and Haas Electronic Materials LLC | Method of electroplating silver strike over nickel |
-
2011
- 2011-09-20 JP JP2011204196A patent/JP5854727B2/ja active Active
- 2011-09-20 EP EP11182051.0A patent/EP2431502B1/en active Active
- 2011-09-20 SG SG2011067964A patent/SG179380A1/en unknown
- 2011-09-21 CN CN201110331863.3A patent/CN102409373B/zh active Active
- 2011-09-21 US US13/239,048 patent/US8608932B2/en active Active
- 2011-09-21 TW TW100133878A patent/TWI427194B/zh active
- 2011-09-21 KR KR1020110095022A patent/KR101779410B1/ko active Active
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