JP4283256B2 - 金属の電解析出方法 - Google Patents
金属の電解析出方法 Download PDFInfo
- Publication number
- JP4283256B2 JP4283256B2 JP2005243009A JP2005243009A JP4283256B2 JP 4283256 B2 JP4283256 B2 JP 4283256B2 JP 2005243009 A JP2005243009 A JP 2005243009A JP 2005243009 A JP2005243009 A JP 2005243009A JP 4283256 B2 JP4283256 B2 JP 4283256B2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic solution
- electrolyte
- copper
- ethoxylate
- electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 21
- 238000004070 electrodeposition Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 150000002739 metals Chemical class 0.000 title 1
- 239000003792 electrolyte Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 14
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 12
- 230000002378 acidificating effect Effects 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- -1 halide ion Chemical class 0.000 claims description 7
- 150000008052 alkyl sulfonates Chemical class 0.000 claims description 4
- 239000007859 condensation product Substances 0.000 claims description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 150000004820 halides Chemical class 0.000 claims description 3
- 229910002651 NO3 Inorganic materials 0.000 claims description 2
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims description 2
- 150000007942 carboxylates Chemical class 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- 239000008151 electrolyte solution Substances 0.000 claims 9
- 239000007788 liquid Substances 0.000 claims 2
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 7
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 3
- 229950011260 betanaphthol Drugs 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- BQPBZDSDFCDSAO-UHFFFAOYSA-N 2-naphthalen-2-yloxyethanol Chemical compound C1=CC=CC2=CC(OCCO)=CC=C21 BQPBZDSDFCDSAO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-M naphthalene-1-sulfonate Chemical compound C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-M 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Description
用いられる金属化方法は用いられる電解質と同様に、金属化される基材のタイプ及び性質による。金属性及び非導電性基材のいずれにも対応する表面層を供給される。
銅:40から90g/l、好ましくは75g/l
スルホン酸メタン:50から130ml/l、好ましくは90ml/l
ハロゲン化物イオン:40から100mg/l、好ましくは50mg/l
2−ナフトールエトキシレート:5から30g/l、好ましくは10g/l
ナフタレン縮合生成物:0.001から1g/l、好ましくは0.1g/l
好ましくは、電解質はハロゲン化物イオンとして塩化物を含む。
実施例2は本発明による方法の典型的な処理条件を示す。
基材: 黄銅
温度: 25℃
電流密度: 10A/dm2
引抜(pull-through)速度: 50m/分
析出銅層の層厚: 5μm
Claims (9)
- 酸性電解液からの艶のない又は半光沢の銅層を基質上に電解析出する方法であって、10から100A/dm2の間の電流密度で銅層を析出させ、その際、電解液が少なくとも銅、スルホン酸アルキル、ハロゲン化物イオン、エトキシレート、ナフタレン縮合生成物からなることを特徴とする電解析出方法。
- 方法を22から60℃からなる温度で行なうことを特徴とする請求項1記載の方法。
- 方法を45から55℃からなる温度で行なうことを特徴とする請求項1又は2記載の方法。
- 方法を電解被膜のための引抜(pull-through)装置中で行なうことを特徴とする請求項1から3までのいずれか1項に記載の方法。
- 請求項1から4までのいずれか1項に記載の方法を行なうための電解液であって、前記電解液が少なくとも銅、スルホン酸アルキル、ハロゲン化物イオン、エトキシレート、ナフタレン縮合生成物の成分からなることを特徴とする電解液。
- 請求項5記載の電解液であって、前記電解液がエトキシレートとして2ナフトエトキシレートからなることを特徴とする電解液。
- 請求項5及び請求項6のいずれか1項に記載の電解液であって、前記電解液がハロゲン化物として塩素イオンを含むことを特徴とする電解液。
- 請求項1から4までのいずれか1項に記載の方法を行なうための電解液であって、前記電解液が少なくとも下記の成分を含むことを特徴とする電解液:
銅:40から90g/l、
スルホン酸メタン:50から130ml/l、
ハロゲン化物イオン:40から100mg/l、
エトキシレート:5から30g/l、
ナフタレン縮合生成物:0.001から1g/l。 - 請求項5から8のいずれか1項に記載の電解液であって、電解液がサルフェート、ニトレート、ハロゲン化物、カルボキシレートからなる群の少なくとも1化合物の形態の銅を含むことを特徴とする電解液。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004041701A DE102004041701A1 (de) | 2004-08-28 | 2004-08-28 | Verfahren zur elektrolytischen Abscheidung von Metallen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006063450A JP2006063450A (ja) | 2006-03-09 |
JP4283256B2 true JP4283256B2 (ja) | 2009-06-24 |
Family
ID=35395909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005243009A Active JP4283256B2 (ja) | 2004-08-28 | 2005-08-24 | 金属の電解析出方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060049058A1 (ja) |
EP (1) | EP1630258B1 (ja) |
JP (1) | JP4283256B2 (ja) |
CN (1) | CN1740399A (ja) |
DE (1) | DE102004041701A1 (ja) |
ES (1) | ES2402688T3 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009041097A (ja) * | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
EP2568063A1 (en) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
US10128022B1 (en) * | 2017-10-24 | 2018-11-13 | Northrop Grumman Systems Corporation | Lightweight carbon nanotube cable comprising a pair of plated twisted wires |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2525942A (en) * | 1945-06-29 | 1950-10-17 | Standard Oil Co | Electrodepositing bath and process |
US4036711A (en) * | 1975-12-18 | 1977-07-19 | M & T Chemicals Inc. | Electrodeposition of copper |
US4134803A (en) * | 1977-12-21 | 1979-01-16 | R. O. Hull & Company, Inc. | Nitrogen and sulfur compositions and acid copper plating baths |
US4347108A (en) * | 1981-05-29 | 1982-08-31 | Rohco, Inc. | Electrodeposition of copper, acidic copper electroplating baths and additives therefor |
US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
US5385661A (en) * | 1993-09-17 | 1995-01-31 | International Business Machines Corporation | Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition |
DE4338148C2 (de) * | 1993-11-04 | 1997-01-30 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung matter und pickelfreier Kupferschichten mit hoher Bruchdehnung auf Substratoberflächen |
US6284309B1 (en) * | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
US6444110B2 (en) * | 1999-05-17 | 2002-09-03 | Shipley Company, L.L.C. | Electrolytic copper plating method |
US6605204B1 (en) * | 1999-10-14 | 2003-08-12 | Atofina Chemicals, Inc. | Electroplating of copper from alkanesulfonate electrolytes |
US6491806B1 (en) * | 2000-04-27 | 2002-12-10 | Intel Corporation | Electroplating bath composition |
KR100366631B1 (ko) * | 2000-09-27 | 2003-01-09 | 삼성전자 주식회사 | 폴리비닐피롤리돈을 포함하는 구리도금 전해액 및 이를이용한 반도체 소자의 구리배선용 전기도금방법 |
US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
EP1308541A1 (en) * | 2001-10-04 | 2003-05-07 | Shipley Company LLC | Plating bath and method for depositing a metal layer on a substrate |
US6843852B2 (en) * | 2002-01-16 | 2005-01-18 | Intel Corporation | Apparatus and method for electroless spray deposition |
US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
EP1408141B1 (de) * | 2002-10-11 | 2014-12-17 | Enthone Inc. | Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
-
2004
- 2004-08-28 DE DE102004041701A patent/DE102004041701A1/de not_active Withdrawn
-
2005
- 2005-08-23 ES ES05018241T patent/ES2402688T3/es active Active
- 2005-08-23 EP EP05018241A patent/EP1630258B1/de active Active
- 2005-08-24 JP JP2005243009A patent/JP4283256B2/ja active Active
- 2005-08-26 CN CN200510092292.7A patent/CN1740399A/zh active Pending
- 2005-08-29 US US11/214,421 patent/US20060049058A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2006063450A (ja) | 2006-03-09 |
CN1740399A (zh) | 2006-03-01 |
US20060049058A1 (en) | 2006-03-09 |
DE102004041701A1 (de) | 2006-03-02 |
EP1630258B1 (de) | 2013-02-27 |
ES2402688T3 (es) | 2013-05-07 |
EP1630258A1 (de) | 2006-03-01 |
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