JP5854600B2 - 光硬化性樹脂組成物 - Google Patents
光硬化性樹脂組成物 Download PDFInfo
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- JP5854600B2 JP5854600B2 JP2010292805A JP2010292805A JP5854600B2 JP 5854600 B2 JP5854600 B2 JP 5854600B2 JP 2010292805 A JP2010292805 A JP 2010292805A JP 2010292805 A JP2010292805 A JP 2010292805A JP 5854600 B2 JP5854600 B2 JP 5854600B2
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- 231100000053 low toxicity Toxicity 0.000 description 1
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- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- LJFWQNJLLOFIJK-UHFFFAOYSA-N solvent violet 13 Chemical compound C1=CC(C)=CC=C1NC1=CC=C(O)C2=C1C(=O)C1=CC=CC=C1C2=O LJFWQNJLLOFIJK-UHFFFAOYSA-N 0.000 description 1
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- WMXCDAVJEZZYLT-UHFFFAOYSA-N tert-butylthiol Chemical compound CC(C)(C)S WMXCDAVJEZZYLT-UHFFFAOYSA-N 0.000 description 1
- UGNWTBMOAKPKBL-UHFFFAOYSA-N tetrachloro-1,4-benzoquinone Chemical class ClC1=C(Cl)C(=O)C(Cl)=C(Cl)C1=O UGNWTBMOAKPKBL-UHFFFAOYSA-N 0.000 description 1
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- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Chemical & Material Sciences (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
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| CN201180063399.2A CN103282828B (zh) | 2010-12-28 | 2011-12-19 | 光固化性树脂组合物 |
| KR1020167004208A KR101827942B1 (ko) | 2010-12-28 | 2011-12-19 | 광 경화성 수지 조성물 |
| KR1020187003483A KR101997412B1 (ko) | 2010-12-28 | 2011-12-19 | 광 경화성 수지 조성물 |
| KR1020137019864A KR20130099218A (ko) | 2010-12-28 | 2011-12-19 | 광 경화성 수지 조성물 |
| PCT/JP2011/079326 WO2012090752A1 (ja) | 2010-12-28 | 2011-12-19 | 光硬化性樹脂組成物 |
| TW100148908A TWI475064B (zh) | 2010-12-28 | 2011-12-27 | A photohardenable resin composition |
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| JP2010292805A JP5854600B2 (ja) | 2010-12-28 | 2010-12-28 | 光硬化性樹脂組成物 |
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| JP2012141387A JP2012141387A (ja) | 2012-07-26 |
| JP5854600B2 true JP5854600B2 (ja) | 2016-02-09 |
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| CN (1) | CN103282828B (zh) |
| TW (1) | TWI475064B (zh) |
| WO (1) | WO2012090752A1 (zh) |
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| JP5315441B1 (ja) * | 2012-03-30 | 2013-10-16 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| EP2932318A1 (en) * | 2012-12-14 | 2015-10-21 | Merck Patent GmbH | Birefringent rm lens |
| JP2015164995A (ja) * | 2013-04-30 | 2015-09-17 | 川崎化成工業株式会社 | 縮合多環芳香族骨格を有する重合制御剤を用いた分子量の制御されたポリマーの製造方法 |
| KR101702707B1 (ko) | 2014-04-30 | 2017-02-07 | 제일모직주식회사 | 편광판용 접착필름, 이를 위한 편광판용 접착제 조성물, 이를 포함하는 편광판 및 이를 포함하는 광학표시장치 |
| CN107407871B (zh) | 2015-03-27 | 2021-09-03 | 东丽株式会社 | 感光性树脂组合物、感光性树脂组合物膜、固化物、绝缘膜及多层布线基板 |
| KR20170046585A (ko) * | 2015-10-21 | 2017-05-02 | 제이엔씨 주식회사 | 감광성 조성물 |
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| CN101464632A (zh) * | 2007-12-21 | 2009-06-24 | 太阳油墨制造株式会社 | 光固化性热固化性树脂组合物和干膜以及使用这些的印刷线路板 |
| JP5166016B2 (ja) * | 2007-12-28 | 2013-03-21 | 株式会社シンク・ラボラトリー | ネガ型感光性組成物 |
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| JP4900510B2 (ja) * | 2008-09-04 | 2012-03-21 | 日立化成工業株式会社 | 半導体パッケージ用プリント配線板の保護膜用感光性樹脂組成物 |
| JP2010113241A (ja) * | 2008-11-07 | 2010-05-20 | Taiyo Ink Mfg Ltd | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP5349113B2 (ja) * | 2009-03-30 | 2013-11-20 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、それを用いたドライフィルム及びプリント配線板 |
| JP5099851B2 (ja) * | 2009-04-27 | 2012-12-19 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP5695928B2 (ja) * | 2010-04-14 | 2015-04-08 | 東京応化工業株式会社 | 櫛型電極の製造方法 |
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| CN103282828B (zh) | 2016-07-06 |
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| WO2012090752A1 (ja) | 2012-07-05 |
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